CN202259299U - Led铜线灯串 - Google Patents

Led铜线灯串 Download PDF

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CN202259299U
CN202259299U CN2011203910176U CN201120391017U CN202259299U CN 202259299 U CN202259299 U CN 202259299U CN 2011203910176 U CN2011203910176 U CN 2011203910176U CN 201120391017 U CN201120391017 U CN 201120391017U CN 202259299 U CN202259299 U CN 202259299U
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led
lamp string
copper
lead
led chip
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廖国荣
赵红彦
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

本实用新型公开了一种LED铜线灯串，它包括复数个LED芯片，其改进在于：还包括两根导线，所述两导线上的对应位置经压扁各自形成复数个扁平的焊接区，LED芯片的正极端焊接于其中一根导线上的焊接区，LED芯片的负极端通过一连接线与另一根导线上的对应焊接区电性连接；其有益效果在于：本实用新型采用铜漆包线代替传统LED芯片的支架，将LED芯片电性连接于铜漆包线上，该铜漆包线上可依次电性连接若干LED芯片形成完整的LED灯串，制作过程简单，避免了传统的LED灯制作成灯串时需要进过二次加工等复杂处理，此外，其结构简单，使用灵活方便。

Description

LED铜线灯串
【技术领域】
本实用新型涉及灯串，特别是一种LED铜线灯串。
【背景技术】
LED是近年来快速发展的一种新型光源，LED灯因具有体积小、低功耗、使用寿命长、高亮度、低热量、环保等优点已被广泛应用。随着LED技术的发展，LED灯的形式越来越多，而LED产品中的LED灯串不仅仅应用于圣诞节等各种节日的应景装饰，并且应用于家庭装修及城市亮化工程和各种娱乐活动场所，LED灯串与传统的白炽灯串有着不可比拟的优点，具有色彩艳丽，可实现色彩的多种变化，并有效的降低了能耗，组成的七彩变色灯串不仅能起到照明的作用，其装饰作用更是让不同的节目和不同的场合增添了喜庆的气氛，然而，参照图1所示，传统的LED是在单个的支架2上固定电性连接LED芯片1，即采用铜片作为LED的两个电极，此工艺出来的LED产品也是单个的，如果需要多个产品组合成LED灯串，则必须要依靠二次加工来实现，例如，通过导线将各个LED灯的电极铜片连接起来等方式，而且其体积大小也受制约。
【实用新型内容】
本实用新型的目的在于提供一种可有效克服上述不足、一次成型的LED铜线灯串，其结构简单，使用灵活方便。
本实用新型的目的是这样是实现的：它包括复数个LED芯片，其改进在于：还包括两根导线，所述两导线上的对应位置经压扁各自形成复数个扁平的焊接区，LED芯片的正极端焊接于其中一根导线上的焊接区，LED芯片的负极端通过一连接线与另一根导线上的对应焊接区电性连接；
上述结构中，所述LED芯片及LED芯片与两导线连接部分的外部包覆有透明的密封胶体；
上述结构中，所述导线为铜漆包线；
上述结构中，所述连接线为铝线；
上述结构中，所述密封胶体为环氧树脂。
本实用新型的有益效果是：本实用新型采用铜漆包线代替传统LED芯片的支架，将LED芯片电性连接于铜漆包线上，该铜漆包线上可依次电性连接若干LED芯片形成完整的LED灯串，制作的过程中，把铜漆包线绕在特制的模具上，然后把铜漆包线需要放LED芯片的位置去漆，压扁形成焊接区，再将LED芯片的两电极端对应焊接于两铜漆包线的扁平焊接区上即可，由于在模具上的铜漆包线是一次绕制的，所以制成成品后脱模即成一串完整的LED，制作过程简单，避免了传统的LED灯制作成灯串时需要进过二次加工等复杂处理，此外，其结构简单，使用灵活方便。
【附图说明】
图1为本实用新型LED铜线灯串的结构示意图
图2为现有技术中LED灯的结构示意图
图3为本实用新型的单个LED灯的结构示意图
图4为本实用新型的单个LED灯的剖视图
图中：1、LED芯片2、支架3、导线4、焊接区5、连接线6、密封胶体7、焊料
【具体实施方式】
下面结合附图及具体的实施方式对本实用新型作进一步说明：
参照图1、图3及图4所示，本实用新型为一种LED铜线灯串，它包括复数个LED芯片1及两根导线3，所述两导线3上的对应位置经压扁各自形成复数个扁平的焊接区4，各个LED芯片1的正极端通过焊料7焊接于其中一根导线3上的焊接区4，LED芯片1的负极端通过一连接线5与另一根导线上的对应焊接区4电性连接，即各LED芯片1的两个电极端分别对应电性连接于两根导线3上的焊接区；于所述LED芯片1及LED芯片1与两导线3连接部分的外部包覆有透明的密封胶体6，该密封胶体6的上表面呈弧形。本实施例中，所述导线3采用铜漆包线；所述连接线5为铝线；所述密封胶体6为环氧树脂。
由于本实用新型采用铜漆包线代替传统LED芯片1的支架2，将LED芯片1电性连接于铜漆包线上，该铜漆包线上可依次电性连接若干LED芯片1形成完整的LED灯串，制作的过程中，把铜漆包线绕在特制的模具上，然后将铜漆包线需要放LED芯片1的位置去漆，压扁形成焊接区4，再将LED芯片1的两电极端对应焊接于两铜漆包线的扁平的焊接区4上即可，由于在模具上的铜漆包线是一次绕制的，所以制成成品后脱模即成一串完整的LED灯串，制作过程简单，避免了传统的LED灯制作成灯串时需要进过二次加工等复杂处理，此外，其结构简单，使用灵活方便。
根据上述说明书的揭示和教导，本实用新型所属领域的技术人员还可以对上述实施方式进行适当的变更和修改。因此，本实用新型并不局限于上面揭示和描述的具体实施方式，对本实用新型的一些修改和变更也应当落入本实用新型的权利要求的保护范围内。此外，尽管本说明书中使用了一些特定的术语，但这些术语只是为了方便说明，并不对本实用新型构成任何限制。

Claims (5)

1.一种LED铜线灯串，它包括复数个LED芯片，其特征在于：还包括两根导线，所述两导线上的对应位置经压扁各自形成复数个扁平的焊接区，LED芯片的正极端焊接于其中一根导线上的焊接区，LED芯片的负极端通过一连接线与另一根导线上的对应焊接区电性连接。
2.根据权利要求1所述的LED铜线灯串，其特征在于：所述LED芯片及LED芯片与两导线连接部分的外部包覆有透明的密封胶体。
3.根据权利要求1所述的LED铜线灯串，其特征在于：所述导线为铜漆包线。
4.根据权利要求1所述的LED铜线灯串，其特征在于：所述连接线为铝线。
5.根据权利要求2所述的LED铜线灯串，其特征在于：所述密封胶体为环氧树脂。
CN2011203910176U 2011-10-14 2011-10-14 Led铜线灯串 Expired - Fee Related CN202259299U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104390169A (zh) * 2014-11-13 2015-03-04 许国大 一种新型led铜线灯的制作工艺

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104390169A (zh) * 2014-11-13 2015-03-04 许国大 一种新型led铜线灯的制作工艺

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