CN202259205U - 金丝球焊毛细管劈刀 - Google Patents

金丝球焊毛细管劈刀 Download PDF

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Publication number
CN202259205U
CN202259205U CN2011203232958U CN201120323295U CN202259205U CN 202259205 U CN202259205 U CN 202259205U CN 2011203232958 U CN2011203232958 U CN 2011203232958U CN 201120323295 U CN201120323295 U CN 201120323295U CN 202259205 U CN202259205 U CN 202259205U
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China
Prior art keywords
chopper
diameter
ball bonding
bonding capillary
gold
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Expired - Fee Related
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CN2011203232958U
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贺晋春
井立鹏
姚全斌
张志勋
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China Aviation Airspace Spaceflight Technology Group Co No9 Academy No772 Research Institute
Mxtronics Corp
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China Aviation Airspace Spaceflight Technology Group Co No9 Academy No772 Research Institute
Mxtronics Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

金丝球焊毛细管劈刀，瓶颈部分外形为圆台，瓶颈端部外侧有外倒角，劈刀的过线通孔与瓶颈端部内侧交接处有内倒角，内倒角与外倒角交接处形成劈刀的刀尖。本实用新型适应当今集成电路小型化的发展趋势，避免了焊接高密度芯片PAD时常出现的劈刀碰丝现象，并且该劈刀具有良好的强度，保证了电路的可靠性。

Description

金丝球焊毛细管劈刀
技术领域
本实用新型涉及金丝球焊毛细管劈刀，该劈刀在保持良好强度的前提下，能够有效避免金丝焊接芯片时常出现的碰丝现象。
背景技术
随着集成电路小型化的发展，芯片PAD尺寸和PAD点节距越来越小，现行金丝球焊毛细管劈刀在焊接新型的高密度芯片时，常因为结构的不合理而导致碰丝现象的产生，严重降低了电路的可靠性要球，使得采用新型高密度芯片的电子产品质量无法保证。
实用新型内容
本实用新型所要解决的技术问题是：克服现有技术的不足，提供一种适用于新型高密度集成电路芯片的金丝球焊毛细管劈刀。
本实用新型的技术解决方案是：金丝球焊毛细管劈刀瓶颈部分外形为圆台，瓶颈端部外侧有外倒角，劈刀的过线通孔与瓶颈端部内侧交接处有内倒角，内倒角与外倒角交接处形成劈刀的刀尖，劈刀的瓶颈高度为500um。当金丝直径为18um时，所述的过线通孔端部直径是25～26um，内倒角直径是29～31um，瓶颈端部直径是65～67um。当金丝直径为20um时，所述的过线通孔端部直径是29～31um，内倒角直径是37～39um，瓶颈端部直径是71～73um；当金丝直径为25um时，所述的过线通孔端部直径是32～34um，内倒角直径是42～44um，瓶颈端部直径是79～81um。
本实用新型与现有技术相比的有益效果是：
(1)设计了合理的劈刀结构，有效避免了高密度芯片焊接过程中常出现的劈刀碰丝现象；
(2)由于适当减小了内倒角直径和刀尖尖端直径的尺寸，使劈刀能适用于PAD点节距很小的新型高密度芯片；
(3)通过优化设计得到瓶颈高度、内倒角直径和刀尖尖端直径的最优匹配值，有效避免了劈刀因单个尺寸变化引起的强度下降问题。
附图说明
图1为本实用新型的结构示意图
具体实施方式
如图1所示，实用新型瓶颈部分外形为圆台；圆台锥角，也称头部夹角BTNKA是7°；劈刀端面半径，也称端面外圆半径OR是10um；劈刀的瓶颈高度BTNKH为500um；瓶颈端部外侧有外倒角，劈刀的过线通孔与瓶颈端部内侧交接处有内倒角，内倒角与外倒角交接处形成劈刀的刀尖；过线通孔内倒角ICA是45°；瓶颈端部外倒角，也称外端面夹角FA是15°；劈刀刀柄处锥角CA是20°；劈刀表面为粒状表面。
金丝直径为18um时，过线通孔端部直径，也称内孔直径H是25um，内倒角直径CD是30um，瓶颈端部直径，也称尖端直径T是66um；金丝直径为20um时，过线通孔端部直径，也称内孔直径H是30um，内倒角直径CD是38um，瓶颈端部直径，也称尖端直径T是72um；金丝直径为25um时，过线通孔端部直径，也称内孔直径H是33um，内倒角直径CD是43um，瓶颈端部直径，也称尖端直径T是80um。
劈刀接触焊件前，金丝先从劈刀过线通孔中穿出，金线末端在重力和加热作用下形成空气自由球，简称“金球”；该金球在表面张力作用下吸附在劈刀端部的斜面上，；之后，劈刀降落并进行第一点的压焊，当金球与芯片压点接触时，劈刀端部的内凹面在热能的作用下将金球压成钉头状的焊点，此时超声波发生器同步启动，并产生超声能量，以加速焊接的进行；劈刀升起到弧高的位置，丝夹张开，使金丝自动送出；劈刀移动到第二焊点，形成拱度；劈刀降落，以进行第二点的焊接，并用劈刀端部外侧把金丝压成楔形的焊点，此时超声波发生器同时启动，并产生超声能量，以加速焊接的进行；劈刀升起到一定高度准备断丝；丝夹夹紧金丝，把金丝从楔形焊点的端部拉断，成为一个无丝尾的焊点，劈刀的一次单元焊接结束。
本实用新型未公开技术属本领域技术人员公知常识。

Claims (4)

1.金丝球焊毛细管劈刀，其特征在于：所述的毛细管劈刀瓶颈部分外形为圆台，瓶颈端部外侧有外倒角，劈刀的过线通孔与瓶颈端部内侧交接处有内倒角，内倒角与外倒角交接处形成劈刀的刀尖，劈刀的瓶颈高度为500um。
2.根据权利要求1所述的金丝球焊毛细管劈刀，其特征在于：当金丝直径为18um时，所述的过线通孔端部直径是25um～26um，内倒角直径是29um～31um，瓶颈端部直径是65um～67um。
3.根据权利要求1所述的金丝球焊毛细管劈刀，其特征在于：当金丝直径为20um时，所述的过线通孔端部直径是29um～31um，内倒角直径是37um～39um，瓶颈端部直径是71um～73um。
4.根据权利要求1所述的金丝球焊毛细管劈刀，其特征在于：当金丝直径为25um时，所述的过线通孔端部直径是32um～34um，内倒角直径是42um～44um，瓶颈端部直径是79um～81um。
CN2011203232958U 2011-08-31 2011-08-31 金丝球焊毛细管劈刀 Expired - Fee Related CN202259205U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107301989A (zh) * 2017-06-06 2017-10-27 深圳国民飞骧科技有限公司 一种确定焊线芯片表面焊盘间距的方法
CN110265313A (zh) * 2019-07-25 2019-09-20 刘欢 能量整合焊接劈刀

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107301989A (zh) * 2017-06-06 2017-10-27 深圳国民飞骧科技有限公司 一种确定焊线芯片表面焊盘间距的方法
CN110265313A (zh) * 2019-07-25 2019-09-20 刘欢 能量整合焊接劈刀

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