CN202259196U - Removing device for silicon wafer edge oxidation films within various ranges - Google Patents
Removing device for silicon wafer edge oxidation films within various ranges Download PDFInfo
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- CN202259196U CN202259196U CN 201120354468 CN201120354468U CN202259196U CN 202259196 U CN202259196 U CN 202259196U CN 201120354468 CN201120354468 CN 201120354468 CN 201120354468 U CN201120354468 U CN 201120354468U CN 202259196 U CN202259196 U CN 202259196U
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201120354468 CN202259196U (en) | 2011-09-21 | 2011-09-21 | Removing device for silicon wafer edge oxidation films within various ranges |
Applications Claiming Priority (1)
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CN 201120354468 CN202259196U (en) | 2011-09-21 | 2011-09-21 | Removing device for silicon wafer edge oxidation films within various ranges |
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CN202259196U true CN202259196U (en) | 2012-05-30 |
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CN 201120354468 Expired - Lifetime CN202259196U (en) | 2011-09-21 | 2011-09-21 | Removing device for silicon wafer edge oxidation films within various ranges |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111341704A (en) * | 2020-05-20 | 2020-06-26 | 西安奕斯伟硅片技术有限公司 | Edge removing device and edge removing method for silicon wafer back sealing layer |
CN113889399A (en) * | 2021-09-08 | 2022-01-04 | 上海中欣晶圆半导体科技有限公司 | Liquid seepage prevention trimming process |
-
2011
- 2011-09-21 CN CN 201120354468 patent/CN202259196U/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111341704A (en) * | 2020-05-20 | 2020-06-26 | 西安奕斯伟硅片技术有限公司 | Edge removing device and edge removing method for silicon wafer back sealing layer |
CN113889399A (en) * | 2021-09-08 | 2022-01-04 | 上海中欣晶圆半导体科技有限公司 | Liquid seepage prevention trimming process |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: GRINM ADVANCED MATERIALS CO., LTD. Free format text: FORMER NAME: GRINM SEMICONDUCTOR MATERIALS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Patentee after: YOUYAN NEW MATERIAL CO., LTD. Address before: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Patentee before: GRINM Semiconductor Materials Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Free format text: FORMER OWNER: GRINM ADVANCED MATERIALS CO., LTD. Effective date: 20150612 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150612 Address after: 101300 Beijing city Shunyi District Shuanghe Linhe Industrial Development Zone on the south side of the road Patentee after: You Yan Semi Materials Co., Ltd. Address before: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Patentee before: YOUYAN NEW MATERIAL CO., LTD. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee after: Youyan semiconductor silicon materials Co.,Ltd. Address before: 101300 south side of Shuanghe Road, Linhe Industrial Development Zone, Shunyi District, Beijing Patentee before: GRINM SEMICONDUCTOR MATERIALS Co.,Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20120530 |