CN202253420U - High-power monocrystal LED (Light-emitting Diode) colorful optical module for projection display equipment - Google Patents
High-power monocrystal LED (Light-emitting Diode) colorful optical module for projection display equipment Download PDFInfo
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- CN202253420U CN202253420U CN2011203437017U CN201120343701U CN202253420U CN 202253420 U CN202253420 U CN 202253420U CN 2011203437017 U CN2011203437017 U CN 2011203437017U CN 201120343701 U CN201120343701 U CN 201120343701U CN 202253420 U CN202253420 U CN 202253420U
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Abstract
The utility model discloses a high-power monocrystal LED (Light-emitting Diode) colorful optical module for projection display equipment, which comprises a metal base plate with high heat conduction property and an LED chip, wherein the metal base plate with the high heat conduction property comprises a pure metal base plate with high heat conduction property and an alloy base plate, the LED chip is a monolithic monocolor LED chip, the LED chip is directly, fixedly and electrically connected on the metal base plate with the high heat conduction property, the anode and the cathode of the LED chip are respectively positioned at vertical structural chips at two ends of the chip, and the light-emitting area of the LED chip is more than or equal to 1.5 square millimeters. By the structure, the radiating efficiency is greatly improved, the structure and the production process are simple, the cost is lower, and the structure of the large-area monolithic monocolor LED chip can meet the requirements of occasions on color temperature, color and brightness.
Description
Technical field
The utility model relates to the great-power electronic product scope, particularly a kind of high-power monocrystalline LED colour optics module that is used for projection display apparatus.
Background technology
Along with the develop rapidly of LED technology and reaching its maturity of great power LED production technology, its low consumption that has, efficient, volume is little, in light weight and numerous advantages such as long-life, and it is widely used; The Development of Packaging Technology of great power LED; Accelerated the application of great power LED at lighting field greatly, along with the development of color LED chip technology, high-brightness LED colour optics module begins to be applied to fields such as illumination that the color and the colour temperature of light are had relatively high expectations or demonstration; The encapsulation of LED colour optics module is had relatively high expectations; Not only to the heat dissipation problem of led chip, and arrangements of chips arranged and problem such as spacing, all proposed higher requirement.The method for packing of present low-thermal resistance high-power LED, complex manufacturing, product structure is also complicated; Need metal substrate, insulating barrier, cover copper layer, electrode layer and external insulation layer, its metal substrate center is provided with pit, and led chip is installed in the said pit; Cause procedure more, production cost is higher, in addition; Insulating barrier below the copper-clad plate has also increased thermal resistance; Present existing led chip module light-emitting area is less simultaneously, and the color and the colour temperature of its emission light can not satisfy the requirement of some high standard application scenarios, can't expand application.
The utility model content
For addressing the above problem, the purpose of the utility model is to provide a kind of good heat conductivity, and what have good electrical insulation properties again is used for high-power monocrystalline LED colour optics module of projection display apparatus and preparation method thereof.
For achieving the above object; The technical scheme of the utility model is: a kind of high-power monocrystalline LED colour optics module that is used for projection display apparatus; Comprise high heat conductive metal substrate and led chip; Said high heat conductive metal substrate comprises the simple metal substrate and the alloy substrate of high heat conduction, and said led chip is the monochromatic LED chip of monolithic, and said led chip directly fixedly is electrically connected on the said high heat conductive metal substrate; Said led chip is the vertical stratification chip that both positive and negative polarity lays respectively at the chip two ends, the light-emitting area of said led chip >=1.5 square millimeter.
Preferably, the length-width ratio of the light-emitting area of said led chip is 1.3 to 1.8.
Preferably, said led chip is red LED chip, blue-light LED chip, green light LED chip, yellow light LED chip or White-light LED chip.
Preferably, said led chip is the single-chip light source.
Preferably, said led chip is red LED chip, blue-light LED chip, green light LED chip, yellow light LED chip or White-light LED chip, or applies the green light LED chip or the red LED chip of fluorescent material preparation by blue-light LED chip.
Preferably, said led chip is smooth chip base with the end that said high heat conductive metal substrate fixedly is electrically connected, and this chip base is the negative or positive electrode of said led chip.
Preferably, the light-emitting area of said led chip is of a size of 1.6mmx1.0mm, 1.5mmx1.2mm or 4mmx3mm.
Preferably; The said high-power monocrystalline LED colour optics module that is used for projection display apparatus also is provided with transparent protective cover; Said protective cover covers on the said led chip, and the part that said protective cover is positioned at directly over the said led chip is plane, spherical lens or non-spherical lens.
Preferably, said metal substrate is provided with the optical alignment hole of at least one assist location.
Preferably, the said high-power monocrystalline LED colour optics module that is used for projection display apparatus also is provided with and prevents that said led chip from crossing cause thermal damage and can control the device for monitoring temperature of said led chip on/off.
Preferably, said led chip is connected on the said metal substrate through the tin cream or the solid crystalline substance of silver slurry of thermal conductivity factor >=20w/mK, silver content >=80%;
Preferably, the thickness of silver slurry bottom the said led chip or tin cream is between 15 microns to 100 microns.
Adopt the beneficial effect of present technique scheme to be: said high heat conductive metal substrate comprises the simple metal substrate and the alloy substrate of high heat conduction; Said led chip is the monochromatic LED chip of monolithic; Said led chip directly fixedly is electrically connected on the said high heat conductive metal substrate; Said led chip is the vertical stratification chip that both positive and negative polarity lays respectively at the chip two ends, the light-emitting area of said led chip >=1.5 square millimeter.This structure makes radiating efficiency improve greatly, and structure and production technology are simple, and cost is lower, and large-area monolithic monochromatic LED chip structure can satisfy the demand of high request occasion to colour temperature, color and brightness.
Description of drawings
Fig. 1 is a kind of sketch map that is used for the high-power monocrystalline LED colour optics module of projection display apparatus of the utility model;
Fig. 2 is a kind of cutaway view that is used for the high-power monocrystalline LED colour optics module of projection display apparatus of the utility model.
The numeral corresponding component title represented among the figure with letter:
1. metal substrate 2.LED chip 3. pins 4. fixing holes 5. optical alignment holes.
6. articulamentum 7. protective covers.
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the utility model is done further detailed explanation.
Embodiment 1,
As depicted in figs. 1 and 2; A kind of high-power monocrystalline LED colour optics module that is used for projection display apparatus; Comprise high heat conductive metal substrate 1 and led chip 2; Said high heat conductive metal substrate 1 comprises the simple metal substrate and the alloy substrate of high heat conduction, and said led chip 2 is the monochromatic LED chip of monolithic, and said led chip 2 directly fixedly is electrically connected on the said high heat conductive metal substrate 1; Said led chip 2 lays respectively at the vertical stratification chip at chip two ends for both positive and negative polarity, the light-emitting area of said led chip 2 >=1.5 square millimeter.Directly be total to anode (or common cathode) welding led chip 2 above the metal substrate 1; This installation mode makes the part of metal substrate as circuit; Structure is simpler; Omitted circuit layer and insulating barrier, radiating effect is better, and has further improved the electrical connection properties between led chip 2 and the metal substrate 1.Said led chip 2 is connected on the said metal substrate 1 through the tin cream or the solid crystalline substance of silver slurry of thermal conductivity factor >=20w/mK, silver content >=80%; The silver slurry of said led chip 2 bottoms or the thickness of tin cream are between 15 microns to 100 microns.Can obtain optimum electrical connection properties and heat conduction (low thermal resistance) performance like this.The silver slurry layer of said led chip 2 bottoms or tin paste layer are the articulamentum 6 between led chip 2 and the metal substrate 1.And said led chip 2 is smooth chip base with the end that said high heat conductive metal substrate 2 fixedly is electrically connected, and this chip base is the negative or positive electrode of said led chip 2; Like this; The negative or positive electrode of led chip 2 directly is connected with said metal substrate 1, has simplified product structure, has saved many production processes; Practice thrift cost, improved radiating efficiency.Pin 3 is generally two; Be connected with negative electricity with the positive pole of led chip 2 respectively; One of them pin directly is electrically connected promptly with metal substrate 1 and is electrically connected with an end of led chip 2; Between another and the metal substrate 1 insulating barrier is set, and with the other end of led chip through led chip pin, lead or conduct electricity soft charged the connection.
In the present embodiment, said led chip is red LED chip, blue-light LED chip, green light LED chip, yellow light LED chip or White-light LED chip, or applies the green light LED chip or the red LED chip of fluorescent material preparation by blue-light LED chip.The application of monochromatic LED chip, purpose are to satisfy the harsh requirement of some occasion to the colour temperature of light source colour, such as the colour projection field of carrying out independent control in the redgreenblue monochromatic source and mixing.
The light-emitting area of said led chip 2 is of a size of 1.6mmx1.0mm; Roughly near the Aspect Ratio of 16:9; When during like this for the image of projection 16:9 or for the zone of 16:9 illumination being provided; The service efficiency of light source be can improve greatly, rather than illumination or the projected area of 16:9 obtained with the mode of blocking shearing.
In the present embodiment, said led chip is the single-chip light source, also can use through strict screening, and the extremely approaching same color chip of performance is arranged closely to be welded on the said metal substrate and constituted, and just performance is not as good as the single-chip light source.
In the present embodiment; In order to protect led chip 2 and the dustproof needs that wait; The said high-power monocrystalline LED colour optics module that is used for projection display apparatus also is provided with transparent protective cover 7; Said protective cover cover 7 is located on the said led chip 2, and the part that said protective cover 7 is positioned at directly over the said led chip 2 is plane, spherical lens or non-spherical lens.And can apply anti-reflection film and improve luminous flux.Spherical lens and non-spherical lens can make the light of led chip 2 emissions converge, to satisfy the needs of some application.
In addition, said metal substrate is provided with optical alignment hole 5 and two fixing holes 4 of two assist location, and the quantity of optical alignment hole 5 and fixing hole 4 also can be 1,3 or other quantity that needs.
In order to prevent that chip overheating from burning, the said high-power monocrystalline LED colour optics module that is used for projection display apparatus also is provided with the device for monitoring temperature that prevents said led chip 2 mistake cause thermal damage and can control said led chip on/off.This device for monitoring temperature can be thermistor or other temperature sensor.
All the other are identical with embodiment 1, and difference is that the light-emitting area of said led chip 2 is of a size of 4:3.Directly to satisfy the requirement of 4:3 display size, improved the service efficiency of light source greatly.
In the foregoing description; The length-width ratio of the light-emitting area of said led chip 2 can be selected the numerical value between 1.3 to 1.8; To adapt to the needs of 16:9 or 4:3 system, to select such as the similar numerical value of 1.5mmx1.2mm near 16:9, the selection of these numerical value is confirmed according to actual needs.
Adopt the beneficial effect of present technique scheme to be: said high heat conductive metal substrate comprises the simple metal substrate and the alloy substrate of high heat conduction; Said led chip is the monochromatic LED chip of monolithic; Said led chip directly fixedly is electrically connected on the said high heat conductive metal substrate; Said led chip is the vertical stratification chip that both positive and negative polarity lays respectively at the chip two ends, the light-emitting area of said led chip >=1.5 square millimeter.This structure directly is total to anode (or common cathode) welding led chip 2, and this installation mode makes the part of metal substrate 1 as circuit, and structure is simpler; Circuit layer and insulating barrier have been omitted; Further improved the electrical connection properties between led chip 2 and the metal substrate 1, made radiating efficiency improve greatly, and structure and production technology are simple; Cost is lower, and large-area monolithic monochromatic LED chip structure can satisfy the demand of high request occasion to colour temperature, color and brightness.
Said metal substrate 1 is that thermal conductivity factor is at 50w/mk and above sheet metal, like satisfactory copper, silver, aluminium or other alloy.
Above-described only is the preferred implementation of the utility model; Should be pointed out that for the person of ordinary skill of the art, under the prerequisite that does not break away from the utility model creation design; Can also make some distortion and improvement, these all belong to the protection domain of the utility model.
Claims (12)
1. high-power monocrystalline LED colour optics module that is used for projection display apparatus; Comprise high heat conductive metal substrate and led chip, said high heat conductive metal substrate comprises the simple metal substrate and the alloy substrate of high heat conduction, it is characterized in that; Said led chip is the monochromatic LED chip of monolithic
Said led chip directly fixedly is electrically connected on the said high heat conductive metal substrate, and said led chip is the vertical stratification chip that both positive and negative polarity lays respectively at the chip two ends, the light-emitting area of said led chip >=1.5 square millimeter.
2. the high-power monocrystalline LED colour optics module that is used for projection display apparatus according to claim 1 is characterized in that the length-width ratio of the light-emitting area of said led chip is 1.3 to 1.8.
3. the high-power monocrystalline LED colour optics module that is used for projection display apparatus according to claim 1 and 2 is characterized in that said led chip is red LED chip, blue-light LED chip, green light LED chip, yellow light LED chip or White-light LED chip.
4. the high-power monocrystalline LED colour optics module that is used for projection display apparatus according to claim 1 and 2 is characterized in that said led chip is the single-chip light source.
5. the high-power monocrystalline LED colour optics module that is used for projection display apparatus according to claim 4; It is characterized in that; Said led chip is red LED chip, blue-light LED chip, green light LED chip, yellow light LED chip or White-light LED chip, or applies the green light LED chip or the red LED chip of fluorescent material preparation by blue-light LED chip.
6. the high-power monocrystalline LED colour optics module that is used for projection display apparatus according to claim 4; It is characterized in that; Said led chip is smooth chip base with the end that said high heat conductive metal substrate fixedly is electrically connected, and this chip base is the negative or positive electrode of said led chip.
7. the high-power monocrystalline LED colour optics module that is used for projection display apparatus according to claim 4 is characterized in that the light-emitting area of said led chip is of a size of 1.6mmx1.0mm, 1.5mmx1.2mm or 4mmx3mm.
8. the high-power monocrystalline LED colour optics module that is used for projection display apparatus according to claim 4; It is characterized in that; The said high-power monocrystalline LED colour optics module that is used for projection display apparatus also is provided with transparent protective cover; Said protective cover covers on the said led chip, and the part that said protective cover is positioned at directly over the said led chip is plane, spherical lens or non-spherical lens.
9. the high-power monocrystalline LED colour optics module that is used for projection display apparatus according to claim 4 is characterized in that said metal substrate is provided with the optical alignment hole of at least one assist location.
10. the high-power monocrystalline LED colour optics module that is used for projection display apparatus according to claim 4; It is characterized in that the said high-power monocrystalline LED colour optics module that is used for projection display apparatus also is provided with and prevents that said led chip from crossing cause thermal damage and can control the device for monitoring temperature of said led chip on/off.
11., it is characterized in that said led chip is connected on the said metal substrate through the tin cream or the solid crystalline substance of silver slurry of thermal conductivity factor >=20w/mK, silver content >=80% like the said high-power monocrystalline LED colour optics module that is used for projection display apparatus of claim 4.
12. like the said high-power monocrystalline LED colour optics module that is used for projection display apparatus of claim 4, it is characterized in that,, the silver slurry of said led chip bottom or the thickness of tin cream are between 15 microns to 100 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203437017U CN202253420U (en) | 2011-09-14 | 2011-09-14 | High-power monocrystal LED (Light-emitting Diode) colorful optical module for projection display equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203437017U CN202253420U (en) | 2011-09-14 | 2011-09-14 | High-power monocrystal LED (Light-emitting Diode) colorful optical module for projection display equipment |
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| Publication Number | Publication Date |
|---|---|
| CN202253420U true CN202253420U (en) | 2012-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203437017U Expired - Fee Related CN202253420U (en) | 2011-09-14 | 2011-09-14 | High-power monocrystal LED (Light-emitting Diode) colorful optical module for projection display equipment |
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| Country | Link |
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| CN (1) | CN202253420U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103000797A (en) * | 2011-09-14 | 2013-03-27 | 苏州科医世凯半导体技术有限责任公司 | High-power single-crystal LED colorful optical module for projection display equipment |
-
2011
- 2011-09-14 CN CN2011203437017U patent/CN202253420U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103000797A (en) * | 2011-09-14 | 2013-03-27 | 苏州科医世凯半导体技术有限责任公司 | High-power single-crystal LED colorful optical module for projection display equipment |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20140914 |
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| EXPY | Termination of patent right or utility model |