CN202246937U - Silver plating device for lead frame - Google Patents
Silver plating device for lead frame Download PDFInfo
- Publication number
- CN202246937U CN202246937U CN2011203174806U CN201120317480U CN202246937U CN 202246937 U CN202246937 U CN 202246937U CN 2011203174806 U CN2011203174806 U CN 2011203174806U CN 201120317480 U CN201120317480 U CN 201120317480U CN 202246937 U CN202246937 U CN 202246937U
- Authority
- CN
- China
- Prior art keywords
- jet mould
- lead frame
- wheel
- silver
- silver plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a silver plating device for a lead frame. The silver plating device comprises an electroplating jet mould which is arranged on a pair of brackets; a compacting device is arranged above the electroplating jet mould and comprises a ballasting wheel; both ends of the ballasting wheel are connected with hanging wheels through a belt respectively; the two hanging wheels are respectively located at both sides of the electroplating jet mould; the ballasting wheel is connected with a ballasting block; a front roller and a rear roller are arranged at the front end and rear end of the electroplating jet mould respectively; and the lead frame product passes through the front roller, the electroplating jet mould and the rear roller respectively. Compressed by a belt device, the products are tightly attached on the electroplating jet mould so as to ensure good silver plating evenness.
Description
Technical field
The utility model relates to the silver-plated device of a kind of lead frame.
Background technology
Lead frame is as the chip carrier of unicircuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit leading-out end and outer lead; Form the key structure spare of electric loop, it has played the function served as bridge that is connected with outer lead, all need use lead frame in the semi-conductor integrated package of the overwhelming majority; Thereby lead frame is a base mateiral important in the electronics and information industry.
The lead frame product type has TO, DIP, ZIP, SIP, SOP, SSOP, QFP (QFJ), SOD, SOT etc.Mainly produce with die stamping method and chemical etching method.
Silver-plated device is one of visual plant during lead frame is produced, and existing silver-plated device exists silver-plated efficient low, ropy defective.
The utility model content
The utility model technical issues that need to address just are to overcome the defective of prior art, provide a kind of lead frame silver-plated device, and it compresses product through belt dressing, product is close to is electroplated on the jet mould, have guaranteed silver plated good uniformity.
For addressing the above problem, the utility model adopts following technical scheme:
The utility model provides a kind of lead frame silver-plated device, and said silver-plated device comprises the plating jet mould, and said plating jet mould is installed on a pair of carriage, and said plating jet mould top is equipped with holddown.
Said holddown comprises a ballast wheel, and said ballast wheel two ends connect hanging wheel through belt respectively, and two hanging wheels lay respectively at the both sides of electroplating jet mould, and said ballast wheel connects a ballast and joins piece.
The front-end and back-end of said plating jet mould are respectively arranged with front wheel and rear roller, and lead frame product is successively through front wheel, plating jet mould and rear roller.
The utility model compresses product through belt dressing, product is close to is electroplated on the jet mould, has guaranteed silver plated good uniformity.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
As shown in Figure 1, the utility model provides a kind of lead frame silver-plated device, and said silver-plated device comprises electroplates jet mould 1, and said plating jet mould is installed on a pair of carriage 2, and said plating jet mould top is equipped with holddown.
Said holddown comprises a ballast wheel 3, and said ballast wheel two ends connect 5, two hanging wheels of hanging wheel through belt 4 respectively and lay respectively at the both sides of electroplating jet mould, and said ballast wheel connects a ballast and joins piece 6.
The front-end and back-end of said plating jet mould are respectively arranged with front wheel 7 and rear roller 8, and lead frame product 9 is successively through front wheel, plating jet mould and rear roller.
The utility model compresses product through belt dressing, product is close to is electroplated on the jet mould, has guaranteed silver plated good uniformity.
What should explain at last is: obviously, the foregoing description only be for explain clearly that the utility model does for example, and be not qualification to embodiment.For the those of ordinary skill in affiliated field, on the basis of above-mentioned explanation, can also make other multi-form variation or change.Here need not also can't give exhaustive to all embodiments.And conspicuous variation of being amplified out thus or change still are among the protection domain of the utility model.
Claims (3)
1. silver-plated device of lead frame, it is characterized in that: said silver-plated device comprises the plating jet mould, and said plating jet mould is installed on a pair of carriage, and said plating jet mould top is equipped with holddown.
2. the silver-plated device of lead frame as claimed in claim 1; It is characterized in that: said holddown comprises a ballast wheel; Said ballast wheel two ends connect hanging wheel through belt respectively, and two hanging wheels lay respectively at the both sides of electroplating jet mould, and said ballast wheel connects a ballast and joins piece.
3. the silver-plated device of lead frame as claimed in claim 2, it is characterized in that: the front-end and back-end of said plating jet mould are respectively arranged with front wheel and rear roller, and lead frame product is successively through front wheel, plating jet mould and rear roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203174806U CN202246937U (en) | 2011-08-29 | 2011-08-29 | Silver plating device for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203174806U CN202246937U (en) | 2011-08-29 | 2011-08-29 | Silver plating device for lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202246937U true CN202246937U (en) | 2012-05-30 |
Family
ID=46108207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203174806U Expired - Fee Related CN202246937U (en) | 2011-08-29 | 2011-08-29 | Silver plating device for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202246937U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106400091A (en) * | 2016-11-23 | 2017-02-15 | 江阴康强电子有限公司 | Ultra-wide-row and high-precision lead frame electroplating assembly line and production technology thereof |
| CN108385145A (en) * | 2018-05-24 | 2018-08-10 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating device |
-
2011
- 2011-08-29 CN CN2011203174806U patent/CN202246937U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106400091A (en) * | 2016-11-23 | 2017-02-15 | 江阴康强电子有限公司 | Ultra-wide-row and high-precision lead frame electroplating assembly line and production technology thereof |
| CN106400091B (en) * | 2016-11-23 | 2018-05-29 | 江阴康强电子有限公司 | Ultra-wide row lead frame plating line and its production technology |
| CN108385145A (en) * | 2018-05-24 | 2018-08-10 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20160829 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |