CN202238738U - Special spraying nozzle in precleaning system of silicon-chip degumming cleaning machine - Google Patents
Special spraying nozzle in precleaning system of silicon-chip degumming cleaning machine Download PDFInfo
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- CN202238738U CN202238738U CN2011203329883U CN201120332988U CN202238738U CN 202238738 U CN202238738 U CN 202238738U CN 2011203329883 U CN2011203329883 U CN 2011203329883U CN 201120332988 U CN201120332988 U CN 201120332988U CN 202238738 U CN202238738 U CN 202238738U
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- silicon chip
- spraying nozzle
- cleaning machine
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Abstract
The utility model relates to the field of special spraying nozzle equipment in a precleaning system of a silicon chip degumming cleaning machine. A special spraying nozzle for the precleaning system of the silicon chip degumming cleaning machine mainly comprises a thread interface, a through hole and a spraying port, wherein one end of the special spraying nozzle is the thread interface, and the other end of the special spraying nozzle is provided with the through groove which is internally provided with a V-shaped groove; the V-shaped groove is provided with the elliptical spraying port communicated with the through hole; the value parameter range of the eccentricity ratio e of the ellipse is as follows: e is more than or equal to 0.6 and less than or equal to 0.8; a sector-shaped sprayed water column ejected by the special spraying nozzle is matched with the corresponding spraying pressure; and the spraying position is a viscose surface area of a silicon chip and glass, so that the cleaned water flows out from top to bottom under the action of gravity, and the bonding part of the silicon chip and the glass generates 20%-30% water flow for overlapping. According to the special spraying nozzle, the edge effect caused by the gravity of the earth is effectively reduced, the cleaning efficiency and the finished product ratio of the silicon chip are improved, the cleaning effect of the surface of the silicon chip is enhanced and the probability of forming piebald on the surface of the silicon chip is reduced.
Description
Technical field
The utility model relates to the special nozzle apparatus field in the silicon wafer stripping cleaning machine prerinse system.
Background technology
The solar silicon wafers that is used for photovoltaic industry is to accomplish through the silicon chip that monocrystalline silicon or polysilicon barred body is cut into the certain specification size; Because monocrystalline silicon or polysilicon is very crisp and very thin through the solar silicon wafers that is cut into; For example a kind of thickness of finished product monocrystalline silicon piece commonly used has only 0.2mm; The conventional way that adopts is to adopt glue special that monocrystalline silicon or polysilicon barred body are bonded in to cut on the glass plate in order to improve the cutting yield rate, accomplishes after the cutting silicon chip that is cut into and glass plate disengaging.Existing silicon chip and glass disengaging mode are that employing possesses prerinse, the silicon wafer stripping cleaning machine of the function of coming unstuck; The conical water column that the special nozzle ejection of installing on the silicon wafer stripping cleaning machine has uniform temperature; The spray position is the bonding whole side of silicon chip and glass; Water column carries out prerinse to foreign ions such as potassium, sodium, iron, aluminium and organic matter in silicon, silica, di-iron trioxide, carborundum, polyethylene glycol, iron oxide and the production process of the residual silicon chip surface in silicon chip cutting back, for the follow-up cleaning of silicon chip lays the foundation.If the prerinse of silicon chip can not reach desirable effect; Then can't reach impurity such as removing the silicon chip surface organic matter; Finally cause mass defects such as residual electrodeposited coating of silicon chip surface and oxide layer, pollutant; Thereby form piebald at silicon chip surface, and piebald does over again and become qualified probability less than 10%, thereby influence the yield rate of product.
Summary of the invention
The utility model is to be solved to provide a kind of special nozzle that is used for silicon wafer stripping cleaning machine prerinse system, in order to solve the generation of piebald in the silicon chip cleaning process.The fan-shaped spray water column that ejects through special nozzle cooperates corresponding spray pressure; The spray position is the mucilage glue surface zone of silicon chip and glass; Water after make cleaning flows out under the effect of gravity and overlapping with the current that the glass bonding portion produces 20%-30% at silicon chip from top to down, effectively reduces the edge effect that terrestrial gravitation causes, has improved the efficient and the yield rate of silicon chip cleaning; Strengthen the cleaning performance of silicon chip surface, reduced the probability that silicon chip surface forms piebald.
The utility model is for solving the problems of the technologies described above, and the technical scheme of employing is:
The special nozzle that is used for silicon wafer stripping cleaning machine prerinse system mainly is made up of hickey, tightening platform, through hole, spout; One end of special nozzle is a hickey, and the other end has groove, and the groove middle part is provided with V-butt; Have spout on the V-butt, spout communicates with through hole.
Wherein groove is a strip matrix groove, and the groove width is generally 40% to 60% of nozzle diameter, and wherein the width of V-butt is 40% to 60% of a groove length.
Wherein nozzle configuration is oval, and the numerical parameter scope of oval eccentric ratio e is: 0.6≤e≤0.8, and long axis of ellipse is identical with the groove direction, and the length of major axis is 80% to 90% of V-butt width.
Wherein spout be shaped as ellipse, oval eccentric ratio e equals 0.7.
Effective effect of the utility model: the fan-shaped spray water column that the special nozzle in the silicon wafer stripping cleaning machine prerinse system ejects cooperates corresponding spray pressure; Make that the spray position is the mucilage glue surface zone of silicon chip and glass; The feasible water that sprays out flows out under the effect of gravity and overlapping with the current of glass bonding portion generation 20%-30% at silicon chip from top to down; Solve the conventional spout of installing on the silicon wafer stripping cleaning machine and can't realize silicon chip hickie or piebald problem in middle or the two side areas; Improved cleaning efficiency and cleaning performance, eliminated because of piebald and cause the lower technological deficiency of yield rate.Do not compare before with using special nozzle, the average fraction defective of piebald sheet is reduced to 0.26% by 1.41%, obtains good economic benefit.
Description of drawings
Fig. 1 silicon wafer stripping cleaning machine prerinse system carries out prewashed operation principle sketch map to silicon chip
The operation principle sketch map of the tradition spray of the employing conventional spout in Fig. 2 silicon wafer stripping cleaning machine prerinse system
The nozzle configuration sketch map of the conventional spout that adopts in Fig. 3 accompanying drawing 2
Adopt the operation principle sketch map that sprays behind the special nozzle in Fig. 4 silicon wafer stripping cleaning machine prerinse system
The nozzle configuration sketch map of the special nozzle that adopts in 4 in Fig. 5 accompanying drawing
Fig. 6 special nozzle structural front view
The vertical view of Fig. 7 accompanying drawing 6
The left view of Fig. 8 accompanying drawing 6
The water flow jet sketch map of Fig. 9 conventional spout
The water flow jet sketch map of Figure 10 special nozzle;
Among the figure
1. nozzle; 2. glass plate; 3. silicon rod; 4. glue-line; 5. spout; 6. through hole; 7. hickey; 8. tightening platform; 9.V shape groove; 10. groove;
The specific embodiment
Below in conjunction with accompanying drawing the utility model is done further to describe in detail, proves absolutely the specific embodiment of the utility model:
As shown in Figure 1; The one side of silicon rod sticks on the glass plate with glue before cutting and cuts, and after cutting was accomplished, silicon rod was cut into the minimum silicon chip of blocks of spacing; One side of all silicon chips still neatly sticks on the glass plate; The cleaning machine prerinse system of coming unstuck is that the current of the nozzle ejection uniform temperature through some clean silicon chip surface, so that wash the dirty of silicon chip surface, the adhesive face to silicon chip and glass plate washes simultaneously.
Shown in accompanying drawing 2, accompanying drawing 3 and accompanying drawing 9, the centre of conventional spout is a through hole, and the through hole top is a spout, and the nozzle configuration of conventional spout is circular, and the current via through holes flows into the back from the spout ejection, and it is conical that the water column shape of ejection is.
Shown in accompanying drawing 4, accompanying drawing 5, accompanying drawing 6, accompanying drawing 7, accompanying drawing 8 and accompanying drawing 10; Special nozzle that the utility model adopted and conventional spout difference are that the nozzle configuration of special nozzle is oval; Spout is positioned on the V-butt; V-butt is positioned at groove, and the water column that the current via through holes sprays from spout is shaped as fan-shaped, and congruent region (can be adjusted through the position of spray water column) between 20%-30% when making the spray water column arrive silicon chip surface; Reach a kind of new spray mode; Then through the level water spray angle of adjustment shower, the incoming position that makes the top of water column arrive the silicon chip both sides is the bonding glue-line position of silicon rod, and the incoming position that the bottom of water column arrives the silicon chip both sides is centre position (going up the water pressure of water column and the position of flux depression).The edge of the water column of per two adjacent nozzles ejection is overlapped, forms the marginal eclipsing effects of current, increases intensity and cleaning performance that current clean.Pressure according to silicon chip size adjustment spray water column makes the spray water column flow down from the silicon chip upper surface with parabolical shape, and wherein the parabola peak of upper strata water column generation intersects the point midway at silicon chip.
Wherein just can be fastened on the delivery port of prerinse system through hickey with special nozzle with wrench rotation tightening platform.
Claims (2)
1. special nozzle that is used for silicon wafer stripping cleaning machine prerinse system, special nozzle mainly is made up of hickey, tightening platform, through hole, spout, and an end of special nozzle is a hickey; The other end has groove, and groove is provided with V-butt in the middle part, has spout on the V-butt; Spout communicates with through hole; It is characterized in that, spout be shaped as ellipse, the numerical parameter scope of oval eccentric ratio e is: 0.6≤e≤0.8; Long axis of ellipse is identical with the groove direction, and the length of major axis is 80% to 90% of V-butt width.
2. the special nozzle that is used for silicon wafer stripping cleaning machine prerinse system according to claim 1 is characterized in that: spout be shaped as ellipse, oval eccentric ratio e equals 0.7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203329883U CN202238738U (en) | 2011-09-06 | 2011-09-06 | Special spraying nozzle in precleaning system of silicon-chip degumming cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203329883U CN202238738U (en) | 2011-09-06 | 2011-09-06 | Special spraying nozzle in precleaning system of silicon-chip degumming cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202238738U true CN202238738U (en) | 2012-05-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203329883U Expired - Fee Related CN202238738U (en) | 2011-09-06 | 2011-09-06 | Special spraying nozzle in precleaning system of silicon-chip degumming cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202238738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112371612A (en) * | 2020-10-13 | 2021-02-19 | 江苏亚电科技有限公司 | Basket-free wafer cleaning method |
-
2011
- 2011-09-06 CN CN2011203329883U patent/CN202238738U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112371612A (en) * | 2020-10-13 | 2021-02-19 | 江苏亚电科技有限公司 | Basket-free wafer cleaning method |
| CN112371612B (en) * | 2020-10-13 | 2021-08-24 | 江苏亚电科技有限公司 | Basket-free wafer cleaning method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20140906 |
|
| EXPY | Termination of patent right or utility model |