CN202205150U - Heat radiation air duct structure for electronic equipment - Google Patents

Heat radiation air duct structure for electronic equipment Download PDF

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Publication number
CN202205150U
CN202205150U CN2011203350916U CN201120335091U CN202205150U CN 202205150 U CN202205150 U CN 202205150U CN 2011203350916 U CN2011203350916 U CN 2011203350916U CN 201120335091 U CN201120335091 U CN 201120335091U CN 202205150 U CN202205150 U CN 202205150U
Authority
CN
China
Prior art keywords
heat radiation
electronic equipment
fan
air duct
lower cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2011203350916U
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Chinese (zh)
Inventor
张俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing era Olympic Science and Technology Co., Ltd.
Original Assignee
BEIJING OSEE DIGITAL TECHNOLOGY Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BEIJING OSEE DIGITAL TECHNOLOGY Ltd filed Critical BEIJING OSEE DIGITAL TECHNOLOGY Ltd
Priority to CN2011203350916U priority Critical patent/CN202205150U/en
Application granted granted Critical
Publication of CN202205150U publication Critical patent/CN202205150U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a heat radiation air duct structure for electronic equipment, which comprises an upper cover, a lower cover and a fan, wherein a flow guide plate is arranged between the upper cover and the lower cover, an air outlet is formed in a part of the upper cover corresponding to the fan, and an air inlet is formed in a part of the lower cover corresponding to the flow guide plate. The heat radiation air duct structure has the advantages that a higher heat radiation effect is obtained at lower power consumption through combining the fan with a heat radiation air duct built by the flow guide plate, in addition, the structure is simple, the cost is low, and the heat radiation air duct structure is suitable for being popularized and applied.

Description

The heat dissipation wind channel structure of electronic equipment
Technical field
The utility model relates to a kind of heat dissipation wind channel structure of electronic equipment.
Background technology
Printed circuit board (PCB) in the electronic equipment or other heater element can produce heating problem, to this problem, generally are fan directly to be installed reducing temperature in equipment, but this mode inefficiency often, radiating effect is not good.It is to build simple and easy convection current air channel that kind of a method is also arranged, but heat loss through convection is limited by the cabinet inside topology layout, can not bring into play the fan power consumption to greatest extent.Notification number: CN201444272U; The Chinese patent document of the day for announcing: 2010.04.28 has been announced a kind of " computing machine that has the heat dissipation wind channel cooling device "; In this computer casing and between the heat dissipation element, be provided with heat dissipation wind channel and flexibly connect the cooling device that is provided with casing.This utility model is provided with heat dissipation wind channel and cooling device, has effectively improved radiating rate, but this heat dissipation wind channel is according to the setting of cabinet inside structure, and radiating efficiency is still not high, and cooling device takies chassis space, and practicality is relatively poor.
The utility model content
The purpose of the utility model provides a kind of heat dissipation wind channel structure of electronic equipment, solved existing electronic equipment fan and heat dissipation wind channel the collocation bad, the problem that radiating efficiency is low.
For realizing above-mentioned purpose, adopt following technical scheme:
A kind of heat dissipation wind channel structure of electronic equipment; Comprise loam cake, lower cover, fan; Be provided with fair water fin between said loam cake and the lower cover, the corresponding fan of said loam cake place has air outlet, and the corresponding air deflector of said lower cover has air intake vent; Said air intake vent is a reticulate texture, and air outlet is a cellular structure.
The beneficial effect of the utility model does, the heat dissipation wind channel through fair water fin builds combines fan again, has obtained higher radiating effect with lower power consumption, and simple in structure, and cost is low.
Description of drawings
According to embodiment and accompanying drawing the utility model is done further explain below.
Fig. 1 is the utility model one-piece construction decomposing schematic representation.
Among the figure:
1, lower cover; 2, fan; 3, loam cake; 4, air outlet; 5, fair water fin; 6, heater element; 7, air intake vent.
Embodiment
Below in conjunction with accompanying drawing, further specify the utility model through embodiment.
As shown in Figure 1; The heat dissipation wind channel structure of the described a kind of electronic equipment of the utility model comprises lower cover 1, fan 2 and loam cake 3, wherein is provided with fair water fin 5 between loam cake 3 and the lower cover 1; Loam cake 3 corresponding fans 2 places have air outlet 4, and lower cover 1 corresponding fair water fin 5 places have air intake vent 7.When heater element 6 work, fan 2 runnings, cold wind sucks from air intake vent 7, and the mobile profile of fair water fin 5 that receives of air limits, and the heater element 6 that directly dispels the heat from needs flows through takes away heat, and hot blast is got rid of from air outlet 4 through fan 2 effects.
The utility model heat dissipation wind channel structure guides air to emphasis heating position through fan and fair water fin acting in conjunction, and radiating efficiency significantly improves, and simple in structure, and cost is low.

Claims (2)

1. the heat dissipation wind channel structure of an electronic equipment comprises loam cake, lower cover, fan, it is characterized in that, is provided with fair water fin between said loam cake and the lower cover, and the corresponding fan of loam cake place has air outlet, and the corresponding air deflector of lower cover has air intake vent.
2. the heat dissipation wind channel structure of a kind of electronic equipment according to claim 1 is characterized in that, said air intake vent is a reticulate texture, and air outlet is a cellular structure.
CN2011203350916U 2011-09-07 2011-09-07 Heat radiation air duct structure for electronic equipment Expired - Lifetime CN202205150U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203350916U CN202205150U (en) 2011-09-07 2011-09-07 Heat radiation air duct structure for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203350916U CN202205150U (en) 2011-09-07 2011-09-07 Heat radiation air duct structure for electronic equipment

Publications (1)

Publication Number Publication Date
CN202205150U true CN202205150U (en) 2012-04-25

Family

ID=45969263

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011203350916U Expired - Lifetime CN202205150U (en) 2011-09-07 2011-09-07 Heat radiation air duct structure for electronic equipment

Country Status (1)

Country Link
CN (1) CN202205150U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508653B (en) * 2014-06-10 2015-11-11 Wistron Corp Detachable guiding mechanism and related electronic device
TWI792253B (en) * 2021-04-06 2023-02-11 其陽科技股份有限公司 Heat dissipation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508653B (en) * 2014-06-10 2015-11-11 Wistron Corp Detachable guiding mechanism and related electronic device
TWI792253B (en) * 2021-04-06 2023-02-11 其陽科技股份有限公司 Heat dissipation device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: BEIJING OSEE TECHNOLOGY CO., LTD.

Free format text: FORMER NAME: BEIJING OSEE DIGITAL TECHNOLOGY CO., LTD.

CP03 Change of name, title or address

Address after: 100094, Beijing, Haidian District North Road, No. 68, building No. 22 and the west side of the two floor, Beijing times Austrian Polytron Technologies Inc

Patentee after: OSEE TECHNOLOGY CO., LTD.

Address before: 100085, room 702, block D, Jinyu Ka Wah building, No. 9, 3rd Street, Haidian District, Beijing

Patentee before: Beijing Osee Digital Technology Ltd.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 100094 Beijing, Haidian District, North Road 68, 22 floor, 22 and two floors west side of the Beijing era Polytron Technologies Inc

Patentee after: Beijing era Olympic Science and Technology Co., Ltd.

Address before: 100094 Beijing, Haidian District, North Road 68, 22 floor, 22 and two floors west side of the Beijing era Polytron Technologies Inc

Patentee before: OSEE TECHNOLOGY CO., LTD.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20120425