CN202196771U - 用于电动汽车半导体的新型双面冷却器 - Google Patents

用于电动汽车半导体的新型双面冷却器 Download PDF

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CN202196771U
CN202196771U CN2011203063659U CN201120306365U CN202196771U CN 202196771 U CN202196771 U CN 202196771U CN 2011203063659 U CN2011203063659 U CN 2011203063659U CN 201120306365 U CN201120306365 U CN 201120306365U CN 202196771 U CN202196771 U CN 202196771U
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semiconductor
coldplate
novel
electromobile
radiating
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李庭福
罗季芳
胡国梁
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Dali Yangbi Anyi Electrombile Industry Co., Ltd.
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SICHUAN SOFTWARE MEASUREMENT TECHNOLOGY INSPECTION CENTER Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本实用新型公开了一种用于电动汽车半导体的新型双面冷却器，与半导体连接，所述半导体的两端均安装有散热板，所述散热板与所述半导体面面接触，所述散热板的另一面安装有冷却板。进一步，所述散热板与所述冷却板之间还设置有绝缘板；所述冷却板为铝材水循环冷却板。本实用新型通过在半导体的两端均设置冷却板，使半导体的散热效率显著提高，相对于传统的单面冷却器，本实用新型的热阻可降低50%左右，有利于电动汽车电路***工作稳定。

Description

用于电动汽车半导体的新型双面冷却器
技术领域
 本实用新型涉及一种半导体冷却器，尤其涉及一种可显著提高半导体的散热效率的用于电动汽车半导体的新型双面冷却器。
背景技术
在电动汽车的电路***中，PCU（功率控制单元）主体由控制底板电路、功率半导体元件、层叠型冷却器及电容器等构成，PCU具有升降压转换器和逆变器功能，是电动汽车电路***的重要组成部分，但其发热较快，所以，为了保证PCU正常工作，如何散热成为一个重要问题。
PCU中主要的发热部件是功率半导体元件，随着电动汽车的功率不断增大，其半导体的发热量也不断增加，大功率电动汽车的半导体元件上流过的电流甚至达到300A以上，会产生大量的热能，若不能高效散热，很可能导致电路***的损坏。
现有的半导体元件的散热方法，是在半导体的一个端面紧贴安装冷却板，冷却板一般通过冷水循环实现低温，这种结构在小功率电动汽车中应用没有问题，但在大功率电动汽车中就有点问题了，其散热效果不佳，经常因为半导体温度过高而导致电路***罢工，在停用冷却一段时间后又恢复正常。这已经比较严重地影响到电动汽车行业的发展。
发明内容
本实用新型的目的就在于为了解决上述问题而提供一种可显著提高半导体的散热效率的用于电动汽车半导体的新型双面冷却器。
本实用新型通过以下技术方案来实现上述目的：
本实用新型与半导体连接，所述半导体的两端均安装有散热板，所述散热板与所述半导体面面接触，所述散热板的另一面安装有冷却板。
进一步，所述散热板与所述冷却板之间还设置有绝缘板；所述冷却板为铝材水循环冷却板。
本实用新型结构虽然简单，但由于同时对半导体两端进行散热，效率几乎达到单面冷却器的两倍，所以效果是非常显著的。
本实用新型的有益效果在于：
由于同时对半导体两端进行散热，而且使用散热板和绝缘板辅助导热，扩大了散热面积，所以本实用新型的效率几乎达到单面冷却器的两倍，其散热效果显著提高，有利于保证电动汽车电路***正常工作，为电动汽车向大功率化方向发展打下基础。
附图说明
附图是本实用新型的结构示意图。
具体实施方式
下面结合附图对本实用新型作进一步说明：
如附图所示，本实用新型与半导体3连接，半导体3的两端均安装有散热板5，散热板5与半导体3面面接触，散热板5的另一面紧贴安装有绝缘板4，绝缘板4的另一面与冷却板2面面接触。
如附图所示，冷却板2为铝材水循环冷却板。
如附图所示，散热板5和半导体3通过封装树脂6封装在一起，同时被封装的还有电流端子1和控制端子8，半导体3与控制端子8通过引线7连接在一起。
结合附图，本实用新型被加工成层叠型结构。在加工过程中，先重叠若干冷却板2完成冷却板组的制作，然后重叠半导体3，再将半导体3***冷却板组。为了便于***半导体3，可增加冷却板之间的间隔，但间隔不能太大，如果冷却板2与半导体3之间有空隙，则会降低半导体3的性能，所以，在***半导体3后，还要在两端的冷却板2上加压，使每一个半导体3都与两边的冷却板2紧密贴合，保证半导体3的性能不变。
本实用新型结构虽然简单，但由于同时对半导体3两端同时进行散热，其散热效率几乎达到单面冷却器的两倍，所以效果是非常显著的。

Claims (3)

1.一种用于电动汽车半导体的新型双面冷却器，与半导体连接，其特征在于：所述半导体的两端均安装有散热板，所述散热板与所述半导体面面接触，所述散热板的另一面安装有冷却板。
2.根据权利要求1所述的用于电动汽车半导体的新型双面冷却器，其特征在于：所述散热板与所述冷却板之间还设置有绝缘板。
3.根据权利要求1或2所述的用于电动汽车半导体的新型双面冷却器，其特征在于：所述冷却板为铝材水循环冷却板。
CN2011203063659U 2011-08-22 2011-08-22 用于电动汽车半导体的新型双面冷却器 Expired - Fee Related CN202196771U (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104097382A (zh) * 2013-04-11 2014-10-15 三星显示有限公司 冷却显示设备的粘合层的装置及分离面板的方法
CN104966706A (zh) * 2015-07-20 2015-10-07 南通明诺机械有限公司 集成功率控制单元
CN109906020A (zh) * 2019-01-07 2019-06-18 深圳市环宇鼎鑫科技有限公司 一种电池管理***的功率模块
CN111158411A (zh) * 2020-01-17 2020-05-15 深圳市曼恩斯特科技有限公司 一种恒温装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104097382A (zh) * 2013-04-11 2014-10-15 三星显示有限公司 冷却显示设备的粘合层的装置及分离面板的方法
CN104097382B (zh) * 2013-04-11 2018-10-19 三星显示有限公司 冷却显示设备的粘合层的装置及分离面板的方法
CN104966706A (zh) * 2015-07-20 2015-10-07 南通明诺机械有限公司 集成功率控制单元
CN109906020A (zh) * 2019-01-07 2019-06-18 深圳市环宇鼎鑫科技有限公司 一种电池管理***的功率模块
CN109906020B (zh) * 2019-01-07 2020-07-21 深圳市环宇鼎鑫科技有限公司 一种电池管理***的功率模块
CN111158411A (zh) * 2020-01-17 2020-05-15 深圳市曼恩斯特科技有限公司 一种恒温装置
CN111158411B (zh) * 2020-01-17 2021-05-18 深圳市曼恩斯特科技股份有限公司 一种恒温装置

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