Background technology
The manufacturing of liquid crystal panel is the pillar and the assurance of current electronics and information industry high speed development, mainly comprises this glass substrate of two types of array base palte and color membrane substrates in the liquid crystal panel; Comprise array base palte and color membrane substrates involutoryly in the manufacture process of liquid crystal panel, it is bonding each other through sealing frame glue with color membrane substrates to be about to array base palte, and detailed process is following:
As shown in Figure 1, envelope frame gluing equipment comprises envelope frame sebific duct lid 11, be used to place envelope frame glue envelope frame sebific duct 12,, shower nozzle 13 and jet hole 14; Actual use-pattern to above-mentioned envelope frame gluing equipment is following:
Through ambient pressure extruding envelope frame sebific duct lid 11, will seal frame glue and extrude from jet hole 14, and be coated on a glass substrate wherein around; On another glass substrate, splash into liquid crystal then, through pressure that two glass substrates are bonding; At last, the position that is stained with envelope frame glue is cured and heat curing, makes two firm being bonded together of glass substrate through ultraviolet ray.
The main effect of envelope frame glue is exactly to prevent that liquid crystal from leaking outside, and makes liquid crystal between two bonding glass substrates not receive the influence of outside air, also plays the balance of keeping the thickness between array base palte and color membrane substrates, guarantees the effect of LCD panel display effect.
But the inventor finds, because the principal ingredient of envelope frame glue comprises epoxy resin, acrylic ester; Various initiating agents, additives such as spun glass, metal ball also comprise other filling agents etc.; Make envelope frame glue have bigger viscosity, about the about 300000mPas of its viscosity (25 ℃), therefore; Envelope frame glue has very big surface tension, promptly when coating, can the kiss-coating phenomenon occur at jet hole 14 places; When being coated with fabric width frame glue at glass substrate, and when producing the kiss-coating phenomenon at jet hole 14 places, can be in the phenomenon that produces on the glass substrate like the crawling 202 shown among Fig. 2, perhaps like the phenomenon of the disconnected glue 201 shown among Fig. 2.
Embodiment
The utility model embodiment provides a kind of envelope frame glue coating device, is used for emission port with emitter towards jet hole, sends the ripple that reduces this envelope frame adhesiveness to the envelope frame glue of jet hole ejection; When reducing viscosity, also can reduce the surface tension of envelope frame glue, therefore, this equipment can be eliminated envelope frame glue kiss-coating and in coating process, produce uneven phenomenon.Below with the specific embodiment introduction:
Embodiment one:
The utility model embodiment one provides first kind of envelope frame glue coating device, and Fig. 3 a is the construction profile of this device, and Fig. 3 b is the structure figure of this device, and wherein link position 31 is junctions of emitter 21 and shower nozzle 13; This equipment comprises envelope frame gluing equipment, and said envelope frame gluing equipment comprises envelope frame sebific duct 12 and the jet hole 14 that has lid 11, and said envelope frame sebific duct 12 is connected with said jet hole 14 through shower nozzle 13, and said equipment also comprises:
Emitter 21 is connected with said shower nozzle 13, and the emission port 22 of said emitter 21 is towards said jet hole 14; Be used for sending the ripple of reduction by the reduction envelope frame adhesiveness of jet hole 14 ejections to said jet hole 14.
Embodiment two:
The utility model embodiment two provides second kind of envelope frame glue coating device, and Fig. 4 a is the construction profile of this device, and Fig. 4 b is the structure figure of this device, and link position 41 wherein is junctions of emitter 21 and envelope frame sebific duct 12; This equipment comprises envelope frame gluing equipment, and said envelope frame gluing equipment comprises envelope frame sebific duct 12 and the jet hole 14 that has lid 11, and said envelope frame sebific duct 12 is connected with said jet hole 14 through shower nozzle 13, and said equipment also comprises:
Emitter 21, the emission port 22 of said emitter 21 is towards said jet hole 14; Be used for sending the ripple of reduction by the reduction envelope frame adhesiveness of jet hole 14 ejections to said jet hole 14;
Said emitter 21 is installed on the said envelope frame sebific duct 12.
Embodiment three:
The utility model embodiment three provides the third envelope frame glue coating device and softening plant, and Fig. 5 a is the construction profile of this device, and Fig. 5 b is the structure figure of this device; This equipment comprises envelope frame gluing equipment, and said envelope frame gluing equipment comprises envelope frame sebific duct 12 and the jet hole 14 that has lid 11, and said envelope frame sebific duct 12 is connected with said jet hole 14 through shower nozzle 13, and said equipment also comprises:
Emitter 21, the emission port 22 of said emitter 21 is towards said jet hole 14; Be used for sending the ripple of reduction by the reduction envelope frame adhesiveness of jet hole 14 ejections to said jet hole 14;
Said equipment also comprises: equipment supporter 51 and emitter support 52;
Emitter support 52, one ends connect said emitter 21; Other end connection device support 51;
Said equipment supporter 51, one ends connect said emitter support 52; The other end connects said envelope frame sebific duct 12;
When said emission port 22 during towards said jet hole 14, the distance between said equipment supporter 51 and the said jet hole 14 is predefined distance;
Said emitter 21 is connected with said envelope frame sebific duct 12 through said emitter support 52 and said equipment supporter 51.
Embodiment four:
The utility model embodiment four provides the 4th kind of envelope frame glue coating device and softening plant, and Fig. 6 a is the construction profile of this device, and Fig. 6 b is the structure figure of this device; This equipment comprises envelope frame gluing equipment, and said envelope frame gluing equipment comprises envelope frame sebific duct 12 and the jet hole 14 that has lid 11, and said envelope frame sebific duct 12 is connected with said jet hole 14 through shower nozzle 13, and said equipment also comprises:
Emitter 21, the emission port 22 of said emitter 21 is towards said jet hole 14; Be used for sending the ripple of reduction by the envelope frame adhesiveness of jet hole 14 ejections to said jet hole 14.
Said equipment also comprises: equipment supporter 51 and emitter support 52;
Said emitter support 52 comprises stationary pipes 61 and moves pipe 62;
Emitter support 52, one ends connect said emitter 21; Other end connection device support 51;
Said equipment supporter 51 is used to connect the stationary pipes 61 and said envelope frame sebific duct 12 of said emitter support 52;
When said emission port 22 during towards said jet hole 14, the distance between said equipment supporter 51 and the said jet hole 14 is predefined distance;
One end of said stationary pipes 61 links to each other with said equipment supporter 51; And the other end inserts said mobile pipe 62 inside;
Said mobile pipe 62 1 end openings are used for said stationary pipes 61 and insert, and the other end links to each other with said emitter 21, and said mobile pipe 62 can move up and down along said stationary pipes.
Preferable, among above-mentioned all embodiment, for the viscosity that makes envelope frame glue remains under the same viscosity always, said emitter 21 every sending to said jet hole 14 at a distance from the predefined time cycle can be reduced the ripple that seals the frame adhesiveness; Preferable, the said predefined time cycle is 5 seconds to 10 seconds; In order to guarantee that said emitter can accurately send ripple to the envelope frame glue that jet hole 14 places occur, can with the emission port of said emitter aim at said jet hole under;
Preferable, in the foregoing description one to four, said emitter 21 can be for producing the wave producer with warm wave beam, for example ultrasonic generator etc.; Said ultrasonic generator is every to send 1 second to 2 seconds ultrasound wave at a distance from 5 seconds to 10 seconds, owing to frequency of ultrasonic is higher than 20000 hertz, and good directionality, energy are easy to concentrate, penetration capacity is strong, can penetrate general solid; When hyperacoustic high-energy ultrasonic wave energy imports envelope frame glue inside into; Envelope frame glue inside will receive the effect of alternation sound field; This action effect is following: receive tension in hyperacoustic negative pressure in mutually; Envelope frame glue is bigger because of viscosity, disperses uneven and micro-bubble that cause will become big along with the increasing of tension; The malleation that comes one after the other mutually in, these bubbles are compressed again, therefore, under action of ultrasonic waves, the micro-bubble in the envelope frame glue alternately is in expansion, contraction state.When hyperacoustic energy surpassed certain threshold value, these micro-bubbles can't be kept original state under the effect of powerful external pressure, can produce the HTHP of moment simultaneously in the part with high speed collapse.The energy that is produced during the bubble instant failure increases bubble molecular kinetic energy on every side, is higher than the internal friction that molecule moves, and makes the viscosity of envelope frame glue reduce; And because hyperacoustic energy is inner in envelope frame glue, the speed aggravation of molecular motion with the point of the physical crosslinking between the saboteur, has reduced the resistance of molecular motion, and the viscosity of envelope frame glue is reduced.Because; The surface tension of organism and superpolymer reduces along with the rising of temperature; Ultrasound wave raises envelope frame glue temperature; And then the surface tension of envelope frame glue is reduced, can eliminate envelope frame glue kiss-coating when the viscosity of sealing frame glue, when surface tension reduces and in coating process, produce uneven phenomenon; Said emitter 21 can also be microwave generator, and the ripple that is sent is a microwave;
Preferable, in the foregoing description one to four, said emitter 21 can also be for producing the optical generator with heating effect light, for example infrared generator, ultraviolet generator etc.; Said equipment whenever sent 1 second to 2 seconds ripple at a distance from 5 seconds to 10 seconds, i.e. infrared ray, perhaps ultraviolet ray; These low-grade fever ripples can suitably melt envelope frame glue, in the process of melting, can reduce the viscosity and the surface tension of said envelope frame glue, therefore can eliminate envelope frame glue kiss-coating and in coating process, produce uneven phenomenon;
Preferable, in order to guarantee the stability between said emitter 21 and the said envelope frame adhesive dispenser, a plurality of equipment supporters 51 can be installed between said emitter 21 and said envelope frame adhesive dispenser;
Preferable, in the foregoing description one to four, under the corresponding said jet hole of the emission port of said emitter.
In sum, beneficial effect:
The equipment that adopts the utility model embodiment to provide with the emission port corresponding nozzle mouth of emitter, sends the ripple of this envelope frame adhesiveness of reduction to the envelope frame glue of jet hole ejection; Emitter be for can produce the wave producer with warm wave beam, for example ultrasonic generator, microwave generator etc.; When for said ultrasonic generator being, said ripple is a ultrasound wave, because frequency of ultrasonic is higher than 20000 hertz, and good directionality, energy are easy to concentrate, penetration capacity is strong, can penetrate general solid; When hyperacoustic high-energy ultrasonic wave energy imports envelope frame glue inside into; Envelope frame glue inside will receive the effect of alternation sound field; This action effect is following: receive tension in hyperacoustic negative pressure in mutually; Envelope frame glue is bigger because of viscosity, disperses uneven and micro-bubble that cause will become big along with the increasing of tension; The malleation that comes one after the other mutually in, these bubbles are compressed again, therefore, under action of ultrasonic waves, the micro-bubble in the envelope frame glue alternately is in expansion, contraction state.When hyperacoustic energy surpassed certain threshold value, these micro-bubbles can't be kept original state under the effect of powerful external pressure, can produce the HTHP of moment simultaneously in the part with high speed collapse.The energy that is produced during the bubble instant failure increases bubble molecular kinetic energy on every side, is higher than the internal friction that molecule moves, and makes the viscosity of envelope frame glue reduce; And because hyperacoustic energy is inner in envelope frame glue, the speed aggravation of molecular motion with the point of the physical crosslinking between the saboteur, has reduced the resistance of molecular motion, and the viscosity of envelope frame glue is reduced.Because; The surface tension of organism and superpolymer reduces along with the rising of temperature; Ultrasound wave raises envelope frame glue temperature; And then the surface tension of envelope frame glue is reduced, can eliminate envelope frame glue kiss-coating when the viscosity of sealing frame glue, when surface tension reduces and in coating process, produce uneven phenomenon; When emitter for can produce optical generator with heating effect light; When for example infrared generator, ultraviolet generator etc. can send the equipment of thermal effect light; Said equipment sends infrared ray, perhaps ultraviolet ray, and these low-grade fever ripples can suitably melt envelope frame glue; In the process of melting, can reduce the viscosity and the surface tension of said envelope frame glue, therefore also can eliminate envelope frame glue kiss-coating and in coating process, produce uneven phenomenon.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from the spirit and the scope of the utility model.Like this, belong within the scope of the utility model claim and equivalent technologies thereof if these of the utility model are revised with modification, then the utility model also is intended to comprise these changes and modification interior.