CN202189206U - Frame sealing glue coating equipment - Google Patents

Frame sealing glue coating equipment Download PDF

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Publication number
CN202189206U
CN202189206U CN201120304694XU CN201120304694U CN202189206U CN 202189206 U CN202189206 U CN 202189206U CN 201120304694X U CN201120304694X U CN 201120304694XU CN 201120304694 U CN201120304694 U CN 201120304694U CN 202189206 U CN202189206 U CN 202189206U
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CN
China
Prior art keywords
equipment
emitter
envelope frame
jet hole
sebific duct
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201120304694XU
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Chinese (zh)
Inventor
张飞飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
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Beijing BOE Optoelectronics Technology Co Ltd
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Priority to CN201120304694XU priority Critical patent/CN202189206U/en
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Publication of CN202189206U publication Critical patent/CN202189206U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to the technical field of liquid crystal displays, particularly to frame sealing glue coating equipment, which is used for overcoming the phenomena of irregular coating and glue breaking in coating a glass base plate, and includes a frame sealing glue pipe, a spray nozzle and a nozzle opening, wherein the frame sealing glue pipe is connected with the nozzle opening through the spray nozzle; and the equipment also includes an emitting device, and the emitting opening of the emitting device faces the nozzle opening and is used for emitting waves to the nozzle opening to reduce the viscosity and the surface tension of the frame sealing glue sprayed from the nozzle opening. By adopting the equipment provided by the utility model embodiment, the phenomenon of irregularity during the hanging and coating processes of the frame sealing glue is removed.

Description

A kind of envelope frame glue coating device
Technical field
The utility model relates to the LCD Technology field, relates in particular to a kind of envelope frame glue coating device.
Background technology
The manufacturing of liquid crystal panel is the pillar and the assurance of current electronics and information industry high speed development, mainly comprises this glass substrate of two types of array base palte and color membrane substrates in the liquid crystal panel; Comprise array base palte and color membrane substrates involutoryly in the manufacture process of liquid crystal panel, it is bonding each other through sealing frame glue with color membrane substrates to be about to array base palte, and detailed process is following:
As shown in Figure 1, envelope frame gluing equipment comprises envelope frame sebific duct lid 11, be used to place envelope frame glue envelope frame sebific duct 12,, shower nozzle 13 and jet hole 14; Actual use-pattern to above-mentioned envelope frame gluing equipment is following:
Through ambient pressure extruding envelope frame sebific duct lid 11, will seal frame glue and extrude from jet hole 14, and be coated on a glass substrate wherein around; On another glass substrate, splash into liquid crystal then, through pressure that two glass substrates are bonding; At last, the position that is stained with envelope frame glue is cured and heat curing, makes two firm being bonded together of glass substrate through ultraviolet ray.
The main effect of envelope frame glue is exactly to prevent that liquid crystal from leaking outside, and makes liquid crystal between two bonding glass substrates not receive the influence of outside air, also plays the balance of keeping the thickness between array base palte and color membrane substrates, guarantees the effect of LCD panel display effect.
But the inventor finds, because the principal ingredient of envelope frame glue comprises epoxy resin, acrylic ester; Various initiating agents, additives such as spun glass, metal ball also comprise other filling agents etc.; Make envelope frame glue have bigger viscosity, about the about 300000mPas of its viscosity (25 ℃), therefore; Envelope frame glue has very big surface tension, promptly when coating, can the kiss-coating phenomenon occur at jet hole 14 places; When being coated with fabric width frame glue at glass substrate, and when producing the kiss-coating phenomenon at jet hole 14 places, can be in the phenomenon that produces on the glass substrate like the crawling 202 shown among Fig. 2, perhaps like the phenomenon of the disconnected glue 201 shown among Fig. 2.
The utility model content
The utility model embodiment provides a kind of envelope frame glue coating device, is used to solve the problem that when glass substrate is coated with, produces the phenomenon of crawling and disconnected glue.
A kind of envelope frame glue coating device, this equipment comprise envelope frame sebific duct, shower nozzle and jet hole; Said envelope frame sebific duct is connected with said jet hole through shower nozzle, and said equipment also comprises:
Emitter, the emission port of said emitter are used for sending the ripple of reduction by the envelope frame adhesiveness of jet hole ejection to said jet hole towards said jet hole.
A kind of softening plant comprises emitter, and said device also comprises:
The emitter support, the bottom of said emitter support links to each other with said emitter.
It is thus clear that the equipment that adopts the utility model embodiment to provide towards jet hole, sends the ripple that reduce this envelope frame adhesiveness to the envelope frame glue of jet hole ejection with the emission port of emitter; When the viscosity of envelope frame glue reduced, surface tension also can reduce, and therefore can eliminate envelope frame glue kiss-coating and in coating process, produce uneven phenomenon.
Description of drawings
Fig. 1 is the structural representation of envelope frame gluing equipment in the prior art;
Fig. 2 is for using the effect synoptic diagram of envelope frame gluing equipment coated glass substrate in the prior art;
Fig. 3 a is first kind of structural representation that seals frame glue coating device side that the utility model embodiment one provides;
Fig. 3 b is first kind of structural representation that seals the frame glue coating device back side that the utility model embodiment one provides;
Fig. 4 a is second kind of structural representation that seals frame glue coating device side that the utility model embodiment two provides;
Fig. 4 b is second kind of structural representation that seals the frame glue coating device back side that the utility model embodiment two provides;
Fig. 5 a is the structural representation of the third envelope frame glue coating device side of providing of the utility model embodiment three;
Fig. 5 b is the structural representation at the third envelope frame glue coating device back side of providing of the utility model embodiment three;
Fig. 6 a is the 4th kind of structural representation that seals frame glue coating device side that the utility model embodiment four provides;
Fig. 6 b is the 4th kind of structural representation that seals the frame glue coating device back side that the utility model embodiment four provides.
Embodiment
The utility model embodiment provides a kind of envelope frame glue coating device, is used for emission port with emitter towards jet hole, sends the ripple that reduces this envelope frame adhesiveness to the envelope frame glue of jet hole ejection; When reducing viscosity, also can reduce the surface tension of envelope frame glue, therefore, this equipment can be eliminated envelope frame glue kiss-coating and in coating process, produce uneven phenomenon.Below with the specific embodiment introduction:
Embodiment one:
The utility model embodiment one provides first kind of envelope frame glue coating device, and Fig. 3 a is the construction profile of this device, and Fig. 3 b is the structure figure of this device, and wherein link position 31 is junctions of emitter 21 and shower nozzle 13; This equipment comprises envelope frame gluing equipment, and said envelope frame gluing equipment comprises envelope frame sebific duct 12 and the jet hole 14 that has lid 11, and said envelope frame sebific duct 12 is connected with said jet hole 14 through shower nozzle 13, and said equipment also comprises:
Emitter 21 is connected with said shower nozzle 13, and the emission port 22 of said emitter 21 is towards said jet hole 14; Be used for sending the ripple of reduction by the reduction envelope frame adhesiveness of jet hole 14 ejections to said jet hole 14.
Embodiment two:
The utility model embodiment two provides second kind of envelope frame glue coating device, and Fig. 4 a is the construction profile of this device, and Fig. 4 b is the structure figure of this device, and link position 41 wherein is junctions of emitter 21 and envelope frame sebific duct 12; This equipment comprises envelope frame gluing equipment, and said envelope frame gluing equipment comprises envelope frame sebific duct 12 and the jet hole 14 that has lid 11, and said envelope frame sebific duct 12 is connected with said jet hole 14 through shower nozzle 13, and said equipment also comprises:
Emitter 21, the emission port 22 of said emitter 21 is towards said jet hole 14; Be used for sending the ripple of reduction by the reduction envelope frame adhesiveness of jet hole 14 ejections to said jet hole 14;
Said emitter 21 is installed on the said envelope frame sebific duct 12.
Embodiment three:
The utility model embodiment three provides the third envelope frame glue coating device and softening plant, and Fig. 5 a is the construction profile of this device, and Fig. 5 b is the structure figure of this device; This equipment comprises envelope frame gluing equipment, and said envelope frame gluing equipment comprises envelope frame sebific duct 12 and the jet hole 14 that has lid 11, and said envelope frame sebific duct 12 is connected with said jet hole 14 through shower nozzle 13, and said equipment also comprises:
Emitter 21, the emission port 22 of said emitter 21 is towards said jet hole 14; Be used for sending the ripple of reduction by the reduction envelope frame adhesiveness of jet hole 14 ejections to said jet hole 14;
Said equipment also comprises: equipment supporter 51 and emitter support 52;
Emitter support 52, one ends connect said emitter 21; Other end connection device support 51;
Said equipment supporter 51, one ends connect said emitter support 52; The other end connects said envelope frame sebific duct 12;
When said emission port 22 during towards said jet hole 14, the distance between said equipment supporter 51 and the said jet hole 14 is predefined distance;
Said emitter 21 is connected with said envelope frame sebific duct 12 through said emitter support 52 and said equipment supporter 51.
Embodiment four:
The utility model embodiment four provides the 4th kind of envelope frame glue coating device and softening plant, and Fig. 6 a is the construction profile of this device, and Fig. 6 b is the structure figure of this device; This equipment comprises envelope frame gluing equipment, and said envelope frame gluing equipment comprises envelope frame sebific duct 12 and the jet hole 14 that has lid 11, and said envelope frame sebific duct 12 is connected with said jet hole 14 through shower nozzle 13, and said equipment also comprises:
Emitter 21, the emission port 22 of said emitter 21 is towards said jet hole 14; Be used for sending the ripple of reduction by the envelope frame adhesiveness of jet hole 14 ejections to said jet hole 14.
Said equipment also comprises: equipment supporter 51 and emitter support 52;
Said emitter support 52 comprises stationary pipes 61 and moves pipe 62;
Emitter support 52, one ends connect said emitter 21; Other end connection device support 51;
Said equipment supporter 51 is used to connect the stationary pipes 61 and said envelope frame sebific duct 12 of said emitter support 52;
When said emission port 22 during towards said jet hole 14, the distance between said equipment supporter 51 and the said jet hole 14 is predefined distance;
One end of said stationary pipes 61 links to each other with said equipment supporter 51; And the other end inserts said mobile pipe 62 inside;
Said mobile pipe 62 1 end openings are used for said stationary pipes 61 and insert, and the other end links to each other with said emitter 21, and said mobile pipe 62 can move up and down along said stationary pipes.
Preferable, among above-mentioned all embodiment, for the viscosity that makes envelope frame glue remains under the same viscosity always, said emitter 21 every sending to said jet hole 14 at a distance from the predefined time cycle can be reduced the ripple that seals the frame adhesiveness; Preferable, the said predefined time cycle is 5 seconds to 10 seconds; In order to guarantee that said emitter can accurately send ripple to the envelope frame glue that jet hole 14 places occur, can with the emission port of said emitter aim at said jet hole under;
Preferable, in the foregoing description one to four, said emitter 21 can be for producing the wave producer with warm wave beam, for example ultrasonic generator etc.; Said ultrasonic generator is every to send 1 second to 2 seconds ultrasound wave at a distance from 5 seconds to 10 seconds, owing to frequency of ultrasonic is higher than 20000 hertz, and good directionality, energy are easy to concentrate, penetration capacity is strong, can penetrate general solid; When hyperacoustic high-energy ultrasonic wave energy imports envelope frame glue inside into; Envelope frame glue inside will receive the effect of alternation sound field; This action effect is following: receive tension in hyperacoustic negative pressure in mutually; Envelope frame glue is bigger because of viscosity, disperses uneven and micro-bubble that cause will become big along with the increasing of tension; The malleation that comes one after the other mutually in, these bubbles are compressed again, therefore, under action of ultrasonic waves, the micro-bubble in the envelope frame glue alternately is in expansion, contraction state.When hyperacoustic energy surpassed certain threshold value, these micro-bubbles can't be kept original state under the effect of powerful external pressure, can produce the HTHP of moment simultaneously in the part with high speed collapse.The energy that is produced during the bubble instant failure increases bubble molecular kinetic energy on every side, is higher than the internal friction that molecule moves, and makes the viscosity of envelope frame glue reduce; And because hyperacoustic energy is inner in envelope frame glue, the speed aggravation of molecular motion with the point of the physical crosslinking between the saboteur, has reduced the resistance of molecular motion, and the viscosity of envelope frame glue is reduced.Because; The surface tension of organism and superpolymer reduces along with the rising of temperature; Ultrasound wave raises envelope frame glue temperature; And then the surface tension of envelope frame glue is reduced, can eliminate envelope frame glue kiss-coating when the viscosity of sealing frame glue, when surface tension reduces and in coating process, produce uneven phenomenon; Said emitter 21 can also be microwave generator, and the ripple that is sent is a microwave;
Preferable, in the foregoing description one to four, said emitter 21 can also be for producing the optical generator with heating effect light, for example infrared generator, ultraviolet generator etc.; Said equipment whenever sent 1 second to 2 seconds ripple at a distance from 5 seconds to 10 seconds, i.e. infrared ray, perhaps ultraviolet ray; These low-grade fever ripples can suitably melt envelope frame glue, in the process of melting, can reduce the viscosity and the surface tension of said envelope frame glue, therefore can eliminate envelope frame glue kiss-coating and in coating process, produce uneven phenomenon;
Preferable, in order to guarantee the stability between said emitter 21 and the said envelope frame adhesive dispenser, a plurality of equipment supporters 51 can be installed between said emitter 21 and said envelope frame adhesive dispenser;
Preferable, in the foregoing description one to four, under the corresponding said jet hole of the emission port of said emitter.
In sum, beneficial effect:
The equipment that adopts the utility model embodiment to provide with the emission port corresponding nozzle mouth of emitter, sends the ripple of this envelope frame adhesiveness of reduction to the envelope frame glue of jet hole ejection; Emitter be for can produce the wave producer with warm wave beam, for example ultrasonic generator, microwave generator etc.; When for said ultrasonic generator being, said ripple is a ultrasound wave, because frequency of ultrasonic is higher than 20000 hertz, and good directionality, energy are easy to concentrate, penetration capacity is strong, can penetrate general solid; When hyperacoustic high-energy ultrasonic wave energy imports envelope frame glue inside into; Envelope frame glue inside will receive the effect of alternation sound field; This action effect is following: receive tension in hyperacoustic negative pressure in mutually; Envelope frame glue is bigger because of viscosity, disperses uneven and micro-bubble that cause will become big along with the increasing of tension; The malleation that comes one after the other mutually in, these bubbles are compressed again, therefore, under action of ultrasonic waves, the micro-bubble in the envelope frame glue alternately is in expansion, contraction state.When hyperacoustic energy surpassed certain threshold value, these micro-bubbles can't be kept original state under the effect of powerful external pressure, can produce the HTHP of moment simultaneously in the part with high speed collapse.The energy that is produced during the bubble instant failure increases bubble molecular kinetic energy on every side, is higher than the internal friction that molecule moves, and makes the viscosity of envelope frame glue reduce; And because hyperacoustic energy is inner in envelope frame glue, the speed aggravation of molecular motion with the point of the physical crosslinking between the saboteur, has reduced the resistance of molecular motion, and the viscosity of envelope frame glue is reduced.Because; The surface tension of organism and superpolymer reduces along with the rising of temperature; Ultrasound wave raises envelope frame glue temperature; And then the surface tension of envelope frame glue is reduced, can eliminate envelope frame glue kiss-coating when the viscosity of sealing frame glue, when surface tension reduces and in coating process, produce uneven phenomenon; When emitter for can produce optical generator with heating effect light; When for example infrared generator, ultraviolet generator etc. can send the equipment of thermal effect light; Said equipment sends infrared ray, perhaps ultraviolet ray, and these low-grade fever ripples can suitably melt envelope frame glue; In the process of melting, can reduce the viscosity and the surface tension of said envelope frame glue, therefore also can eliminate envelope frame glue kiss-coating and in coating process, produce uneven phenomenon.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from the spirit and the scope of the utility model.Like this, belong within the scope of the utility model claim and equivalent technologies thereof if these of the utility model are revised with modification, then the utility model also is intended to comprise these changes and modification interior.

Claims (10)

1. one kind is sealed frame glue coating device, and this equipment comprises envelope frame sebific duct, shower nozzle and jet hole; Said envelope frame sebific duct is connected with said jet hole through shower nozzle, it is characterized in that said equipment also comprises:
Emitter, the emission port of said emitter are used for sending envelope frame adhesiveness and the capillary ripple of reduction by the jet hole ejection to said jet hole towards said jet hole.
2. equipment as claimed in claim 1 is characterized in that, said emitter and said envelope frame sebific duct, and perhaps said shower nozzle connects.
3. equipment as claimed in claim 1 is characterized in that, said equipment also comprises:
The emitter support, an end connects said emitter; Other end connection device support;
Said equipment supporter, an end connect said emitter support; The other end connects said envelope frame sebific duct;
Said emitter is connected with said envelope frame sebific duct through said emitter support and said equipment supporter.
4. equipment as claimed in claim 3 is characterized in that, when said emission port during towards said jet hole, the distance between said equipment supporter and the said jet hole is predefined distance.
5. equipment as claimed in claim 3 is characterized in that, said emitter support comprises stationary pipes and moves pipe;
One end of said stationary pipes links to each other with said equipment supporter; And it is inner that the other end inserts said mobile pipe;
Said mobile pipe one end opening is used for said stationary pipes and inserts, and the other end links to each other with said emitter, and said mobile pipe can move up and down along said stationary pipes.
6. like claim 1 or 4 described equipment, it is characterized in that, under the corresponding said jet hole of the emission port of said emitter.
7. like the arbitrary described equipment of claim 1-5, it is characterized in that said emitter is for can produce the wave producer with warm wave beam.
8. equipment as claimed in claim 7 is characterized in that, said wave producer is a ultrasonic generator, and said ripple is a ultrasound wave; Perhaps,
When said wave producer was microwave generator, said ripple was a microwave.
9. like the arbitrary described equipment of claim 1-5, it is characterized in that said emitter is for can produce the optical generator with heating effect light.
10. equipment as claimed in claim 9 is characterized in that, said optical generator is an infrared generator, and said ripple is an infrared ray; Perhaps,
Said optical generator is a ultraviolet generator, and said ripple is ultraviolet ray.
CN201120304694XU 2011-08-19 2011-08-19 Frame sealing glue coating equipment Expired - Lifetime CN202189206U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201120304694XU CN202189206U (en) 2011-08-19 2011-08-19 Frame sealing glue coating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201120304694XU CN202189206U (en) 2011-08-19 2011-08-19 Frame sealing glue coating equipment

Publications (1)

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CN202189206U true CN202189206U (en) 2012-04-11

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Application Number Title Priority Date Filing Date
CN201120304694XU Expired - Lifetime CN202189206U (en) 2011-08-19 2011-08-19 Frame sealing glue coating equipment

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CN (1) CN202189206U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106154272A (en) * 2016-06-22 2016-11-23 深圳市华星光电技术有限公司 Frame glue separating surface detection method and device
WO2020191819A1 (en) * 2019-03-22 2020-10-01 深圳市华星光电半导体显示技术有限公司 Sealant coating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106154272A (en) * 2016-06-22 2016-11-23 深圳市华星光电技术有限公司 Frame glue separating surface detection method and device
WO2020191819A1 (en) * 2019-03-22 2020-10-01 深圳市华星光电半导体显示技术有限公司 Sealant coating device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD

Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD.

Effective date: 20150630

Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY

Effective date: 20150630

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150630

Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No.

Patentee after: BOE Technology Group Co., Ltd.

Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd.

Address before: 100176 Beijing city in Western Daxing District economic and Technological Development Zone, Road No. 8

Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20120411