CN202188397U - Illuminating equipment for helping plants to grow - Google Patents

Illuminating equipment for helping plants to grow Download PDF

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Publication number
CN202188397U
CN202188397U CN2011202854821U CN201120285482U CN202188397U CN 202188397 U CN202188397 U CN 202188397U CN 2011202854821 U CN2011202854821 U CN 2011202854821U CN 201120285482 U CN201120285482 U CN 201120285482U CN 202188397 U CN202188397 U CN 202188397U
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CN
China
Prior art keywords
light
electrically connected
emitting diode
substrate body
backlight unit
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Expired - Fee Related
Application number
CN2011202854821U
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Chinese (zh)
Inventor
钟嘉珽
戴世能
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DONGGUAN PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO LTD
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DONGGUAN PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO LTD
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Priority to CN2011202854821U priority Critical patent/CN202188397U/en
Application granted granted Critical
Publication of CN202188397U publication Critical patent/CN202188397U/en
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Abstract

Illuminating equipment for helping plants to grow structurally comprises a base plate unit, a light emitting unit, a current limiting unit and a control unit. The base plate unit comprises a base plate body; the light emitting unit, the current limiting unit and the control unit are all arranged on the base plate body; the light emitting unit comprises a first light emitting module, a second light emitting module and a third light emitting module which respectively comprise a plurality of first, second and third light emitting diode chips electrically connected with the base plate body; the current limiting unit comprises a first current limiting chip electrically connected with the first light emitting module, a second current limiting chip electrically connected with the second light emitting module, and a third current limiting chip electrically connected with the third light emitting module; and the control unit comprises a first PWM (Pulse-Width Modulation) control module electrically connected with the first current limiting chip, a second PWM control module electrically connected with the second current limiting chip, and a third PWM control module electrically connected with the third current limiting chip.

Description

Be used to help the lighting apparatus of plant growth
Technical field
The utility model relates to a kind of lighting apparatus, refers to a kind of lighting apparatus that is used to help the plant growth especially.
Background technology
The invention of electric light can be described as the life style that has changed the whole mankind up hill and dale, if our life does not have electric light, when night or weather conditions are not good, the work of all will be stopped; If be subject to illumination, building construction mode or human life style are thoroughly changed, therefore the whole mankind will can't improve, the age that stays on and fall behind.Be with, today employed on the market lighting apparatus, for example: fluorescent lamp, tengsten lamp even the more popular till now Electricity-saving lamp bulb of being accepted are widely used in the middle of the daily life all.Yet this type of electric light has fast, the high power consumption of optical attenuation mostly, be easy to generate high heat, the life-span is short, frangible or shortcoming such as difficult recovery.Therefore, the encapsulating structure that uses light emitting diode in response to and give birth to.
The utility model content
The utility model technical problem to be solved is, to the deficiency of prior art, a kind of lighting apparatus that is used to help the plant growth is provided.
In order to solve the problems of the technologies described above, the utility model provides a kind of lighting apparatus that is used to help the plant growth, and it comprises: a base board unit, a luminescence unit, a current limliting unit, an and control module.Base board unit comprises a substrate body, wherein substrate body have one be positioned at the substrate body upper surface first crystal area, be positioned at the substrate body upper surface second crystal area, and one be positioned at the substrate body upper surface the 3rd crystal area.Luminescence unit comprise one be used to produce first kind of optical wavelength first light emitting module, be used to produce second kind of optical wavelength second light emitting module, and one be used to produce the third optical wavelength and a specific colour temperature the 3rd light emitting module; Wherein first light emitting module comprises a plurality of first light-emitting diode chip for backlight unit that are arranged on first crystal area and are electrically connected at substrate body; Second light emitting module comprises a plurality of second light-emitting diode chip for backlight unit that are arranged on second crystal area and are electrically connected at substrate body, and the 3rd light emitting module comprises a plurality of the 3rd light-emitting diode chip for backlight unit that are arranged on the 3rd crystal area and are electrically connected at substrate body.The current limliting unit comprise one be arranged on the substrate body and the first current limliting chip, that is electrically connected at first light emitting module be arranged on the substrate body and be electrically connected at second light emitting module the second current limliting chip, and one be arranged on the substrate body and be electrically connected at the 3rd current limliting chip of the 3rd light emitting module.Control module comprise one be arranged on the substrate body and the PWM control module, that is electrically connected at the first current limliting chip be arranged on the substrate body and be electrically connected at the second current limliting chip the 2nd PWM control module, and one be arranged on the substrate body and be electrically connected at the 3rd PWM control module of the 3rd current limliting chip.
The utility model also provides a kind of lighting apparatus that is used to help the plant growth, comprising: a base board unit, a luminescence unit, a current limliting unit, a control module, a frame unit and an encapsulation unit; This base board unit comprises a substrate body, wherein this substrate body have one be positioned at this substrate body upper surface first crystal area, be positioned at this substrate body upper surface second crystal area, and one be positioned at this substrate body upper surface the 3rd crystal area; This luminescence unit comprise one be used to produce first kind of optical wavelength first light emitting module, be used to produce second kind of optical wavelength second light emitting module, and one be used to produce the third optical wavelength and a specific colour temperature the 3rd light emitting module; Wherein this first light emitting module comprises a plurality of first light-emitting diode chip for backlight unit that are arranged on this first crystal area and are electrically connected at this substrate body; This second light emitting module comprises a plurality of second light-emitting diode chip for backlight unit that are arranged on this second crystal area and are electrically connected at this substrate body, and the 3rd light emitting module comprises a plurality of the 3rd light-emitting diode chip for backlight unit that are arranged on the 3rd crystal area and are electrically connected at this substrate body; This current limliting unit comprise one be arranged on this substrate body and the first current limliting chip, that is electrically connected at this first light emitting module be arranged on this substrate body and be electrically connected at this second light emitting module the second current limliting chip, and one be arranged on this substrate body and be electrically connected at the 3rd current limliting chip of the 3rd light emitting module; This control module comprise one be arranged on this substrate body and the PWM control module, that is electrically connected at this first current limliting chip be arranged on this substrate body and be electrically connected at this second current limliting chip the 2nd PWM control module, and one be arranged on this substrate body and be electrically connected at the 3rd PWM control module of the 3rd current limliting chip; This frame unit comprise one form in around ground this substrate body upper surface first around formula frame colloid, form in around ground this substrate body upper surface second around formula frame colloid, and one form in the 3rd of this substrate body upper surface with centering on and center on formula frame colloid; Wherein this first around formula frame colloid around above-mentioned a plurality of first light-emitting diode chip for backlight unit; To form a spacing space of first colloid corresponding to this first crystal area; This second around formula frame colloid around above-mentioned a plurality of second light-emitting diode chip for backlight unit; To form a spacing space of second colloid corresponding to this second crystal area; And the 3rd around formula frame colloid around above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit, to form a spacing space of the 3rd colloid corresponding to the 3rd crystal area; And this encapsulation unit comprises that one is filled in this spacing space of first colloid with first packing colloid, that covers above-mentioned a plurality of first light-emitting diode chip for backlight unit and is filled in this spacing space of second colloid with second packing colloid that covers above-mentioned a plurality of second light-emitting diode chip for backlight unit, and one is filled in the spacing space of the 3rd colloid to cover the 3rd packing colloid of above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit; Wherein this first packing colloid first is centered on around formula frame colloid by this; This second packing colloid this first around formula frame colloid with this second between the formula frame colloid, and the 3rd packing colloid second centers between the formula frame colloid around formula frame colloid and the 3rd at this.
The utility model more provides a kind of lighting apparatus that is used to help the plant growth, comprising: a base board unit, a luminescence unit, a current limliting unit and a control module; This base board unit comprises a substrate body, wherein this substrate body have one be positioned at this substrate body upper surface first crystal area, be positioned at this substrate body upper surface second crystal area, and one be positioned at this substrate body upper surface the 3rd crystal area; This luminescence unit comprise one be used to produce first kind of optical wavelength first light emitting module, be used to produce second kind of optical wavelength second light emitting module, and one be used to produce the third optical wavelength and a specific colour temperature the 3rd light emitting module; Wherein this first light emitting module comprises a plurality of first light-emitting diode chip for backlight unit that are arranged on this first crystal area and are electrically connected at this substrate body; This second light emitting module comprises a plurality of second light-emitting diode chip for backlight unit that are arranged on this second crystal area and are electrically connected at this substrate body, and the 3rd light emitting module comprises a plurality of the 3rd light-emitting diode chip for backlight unit that are arranged on the 3rd crystal area and are electrically connected at this substrate body; This current limliting unit, it comprise one be arranged on this substrate body and the first current limliting chip, that is electrically connected at this first light emitting module be arranged on this substrate body and be electrically connected at this second light emitting module the second current limliting chip, and one be arranged on this substrate body and be electrically connected at the 3rd current limliting chip of the 3rd light emitting module; And this control module comprise one be arranged on this substrate body and the PWM control module, that is electrically connected at this first current limliting chip be arranged on this substrate body and be electrically connected at this second current limliting chip the 2nd PWM control module, and one be arranged on this substrate body and be electrically connected at the 3rd PWM control module of the 3rd current limliting chip.
In sum; The lighting apparatus that the utility model provided; It can through " a PWM control module can be used to control above-mentioned a plurality of first light-emitting diode chip for backlight unit and produces a predetermined pulse frequency; the 2nd PWM control module can be used to control above-mentioned a plurality of second light-emitting diode chip for backlight unit and produces a predetermined pulse frequency; and the 3rd PWM control module can be used to control above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit and produces a predetermined pulse frequency " design so that the lighting apparatus of the utility model can be used to help the plant growth.
Be characteristic and the technology contents of further understanding the utility model, see also following detailed description and accompanying drawing, yet appended accompanying drawing formula only provides reference and explanation usefulness, is not to be used for the utility model is limited about the utility model.
Description of drawings
Figure 1A is the schematic top plan view of the utility model embodiment one;
Figure 1B is the side-looking generalized section of the utility model embodiment one;
Fig. 1 C is the functional block diagram of the utility model embodiment one;
Fig. 1 D is that the utility model embodiment one uses on the part of a plurality of subsequent use weld pads and looks sketch map;
Fig. 2 is the functional block diagram of the utility model embodiment two;
Fig. 3 is the functional block diagram of the utility model embodiment three;
Fig. 4 is the functional block diagram of the utility model embodiment four;
Fig. 5 A is the schematic top plan view of the utility model embodiment five;
Fig. 5 B is the side-looking generalized section of the utility model embodiment five;
Fig. 6 A is the schematic top plan view of the utility model embodiment six;
Fig. 6 B is the side-looking generalized section of the utility model embodiment six.
[main element description of reference numerals]
Decide voltage source supplies device S
AC power A
Base board unit 1 substrate body 10
The first crystal area 10A
The second crystal area 10B
The 3rd crystal area 10C
Circuit substrate 100
Heat dissipating layer 101
Conductive welding pad 102
Anodal weld pad P
Negative pole weld pad N
Insulating barrier 103
Luminescence unit 2 utmost points 201
Negative pole 202
The first light emitting module 2A
The first light-emitting diode chip for backlight unit 20A
The second light emitting module 2B
The second light-emitting diode chip for backlight unit 20B
The 3rd light emitting module 2C
The 3rd light-emitting diode chip for backlight unit 20C
Current limliting unit 3 first current limliting chip 30A
The second current limliting chip 30B
The 3rd current limliting chip 30C
Around formula frame colloid 31
Packing colloid 32
Control module 4 a PWM control module 40A
PWM control module 40B
The 3rd PWM control module 40C
Frame unit 5 first is around formula frame colloid 50A
The spacing space 500A of first colloid
Second around formula frame colloid 50B
The spacing space 500B of second colloid
The 3rd around formula frame colloid 50C
The spacing space 500C of the 3rd colloid
Protuberance 5000
Circular arc tangential line T
Angle θ
Height H
Width D
Encapsulation unit 6 first packing colloid 60A
The second packing colloid 60B
The 3rd packing colloid 60C
Bridge rectifier unit 7 bridge rectifiers 70
The first bridge rectifier 70A
The second bridge rectifier 70B
The 3rd bridge rectifier 70C
The specific embodiment
(embodiment one)
See also shown in Figure 1A to Fig. 1 D; The utility model embodiment one provides a kind of lighting apparatus that is used to help the plant growth, and it comprises: a base board unit 1, a luminescence unit 2, a current limliting unit 3, a control module 4, a frame unit 5, an and encapsulation unit 6.
At first; Cooperate shown in Figure 1A and Figure 1B; Base board unit 1 comprises a substrate body 10, wherein substrate body 10 have one be positioned at substrate body 10 upper surfaces the first crystal area 10A, be positioned at substrate body 10 upper surfaces the second crystal area 10B, and one be positioned at substrate body 10 upper surfaces the 3rd crystal area 10C.For instance, substrate body 10 can comprise that a circuit substrate 100, is arranged at the heat dissipating layer 101 of circuit substrate 100 bottoms, a plurality of conductive welding pad 102 that is arranged at circuit substrate 100 upper surfaces, and one is arranged at circuit substrate 100 upper surfaces and is used to expose the insulating barrier 103 of above-mentioned a plurality of conductive welding pad 102.Therefore, heat dissipating layer 101 can be used for increasing the heat dissipation of circuit substrate 100, and above-mentioned a plurality of insulating barrier 103 can be a kind of welding resisting layer that can be used for only letting above-mentioned a plurality of conductive welding pad 102 expose out and reach the limitation welding region.Yet the employed substrate body 10 of the utility model is not exceeded with the above-mentioned example of being takeed.
Moreover; Cooperate shown in Figure 1A and Figure 1B; Luminescence unit 2 comprise one be used to produce first kind of optical wavelength the first light emitting module 2A, be used to produce second kind of optical wavelength the second light emitting module 2B, and one be used to produce the third optical wavelength and a specific colour temperature the 3rd light emitting module 2C; Wherein the first light emitting module 2A comprises a plurality of first light-emitting diode chip for backlight unit 20A that the first crystal area 10A went up and be electrically connected at substrate body 10 that are arranged at; The second light emitting module 2B comprises a plurality of second light-emitting diode chip for backlight unit 20B that are arranged on the second crystal area 10B and are electrically connected at substrate body 10, and the 3rd light emitting module 2C comprises a plurality of the 3rd light-emitting diode chip for backlight unit 20C that the 3rd crystal area 10C went up and be electrically connected at substrate body 10 that are arranged at.For instance, each first light-emitting diode chip for backlight unit 20A can be a red light emitting diodes bare chip, and each second light-emitting diode chip for backlight unit 20B and each the 3rd light-emitting diode chip for backlight unit 20C all can be a blue LED bare chip.Each first light-emitting diode chip for backlight unit 20A, each second light-emitting diode chip for backlight unit 20B, and each the 3rd light-emitting diode chip for backlight unit 20C all can be through routing mode to be electrically connected at substrate body 10.
In addition; Cooperate Figure 1A, Figure 1B, and Fig. 1 C shown in, current limliting unit 3 comprise one be arranged on the substrate body 10 and the first current limliting chip 30A, that is electrically connected at the first light emitting module 2A be arranged on the substrate body 10 and be electrically connected at the second light emitting module 2B the second current limliting chip 30B, and one be arranged on the substrate body 10 and be electrically connected at the 3rd current limliting chip 30C of the 3rd light emitting module 2C.For instance, the first current limliting chip 30A, the second current limliting chip 30B, and the 3rd current limliting chip 30C all can be through routing mode to be electrically connected at substrate body 10.In addition; The first current limliting chip 30A can be centered on and covered by a packing colloid 32 around formula packing colloid 31 by one; The second current limliting chip 30B can be centered on and covered by a packing colloid 32 around formula packing colloid 31 by one; The 3rd current limliting chip 30C can be centered on and covered by a packing colloid 32 around formula packing colloid 31 by one, and each packing colloid 32 can be a light tight colloid.Moreover; When current limliting unit 3 is electrically connected at (shown in Fig. 1 C) when deciding between voltage source supplies device S and the luminescence unit 2; Because current limliting unit 3 can be used as the bridge of deciding between voltage source supplies device S and the luminescence unit 2, so that luminescence unit 2 can obtain stable electric current supply from deciding voltage source supplies device S.
In addition; Cooperate Figure 1A, Figure 1B, and Fig. 1 C shown in, control module 4 comprise one be arranged on the substrate body 10 and the PWM control module 40A (PWM is the abbreviation of Pulse Width Modulation (pulse width modifieds tone)), that is electrically connected at the first current limliting chip 30A be arranged on the substrate body 10 and be electrically connected at the second current limliting chip 30B the 2nd PWM control module 40B, reach one and be arranged on the substrate body 10 and be electrically connected at the 3rd PWM control module 40C of the 3rd current limliting chip 30C.For instance; When control module 4 is electrically connected at when deciding between voltage source supplies device S and the current limliting unit 3; The one PWM control module 40A can be used to control above-mentioned a plurality of first light-emitting diode chip for backlight unit 20A produce a predetermined pulse frequency (for example 50Hz, 60Hz ... 120Hz ... Or the like); The 2nd PWM control module 40B can be used to control above-mentioned a plurality of second light-emitting diode chip for backlight unit 20B and produces a predetermined pulse frequency, and the 3rd PWM control module 40C can be used to control above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit 20C and produces a predetermined pulse frequency.
Moreover; Cooperate shown in Figure 1A and Figure 1B; Frame unit 5 comprise one form in around ground substrate body 10 upper surfaces first around formula frame colloid 50A, form in around ground substrate body 10 upper surfaces second around formula frame colloid 50B, and one form in the 3rd of substrate body 10 upper surfaces with centering on and center on formula frame colloid 50C; Wherein first around formula frame colloid 50A around above-mentioned a plurality of first light-emitting diode chip for backlight unit 20A; To form one corresponding to the spacing space 500A of first colloid of the first crystal area 10A; Second around formula frame colloid 50B around above-mentioned a plurality of second light-emitting diode chip for backlight unit 20B; Forming one corresponding to the spacing space 500B of second colloid of the second crystal area 10B, and the 3rd around formula frame colloid 50C around above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit 20C, to form one corresponding to the spacing space 500C of the 3rd colloid of the 3rd crystal area 10C.In addition; First around formula frame colloid 50A, second around formula frame colloid 50B, and the 3rd can a specific range separated from one another around formula frame colloid 50C, and the spacing space 500A of first colloid, the spacing space 500B of second colloid, and the spacing space 500C of the 3rd a colloid specific range also separated from one another.
For instance; First the preparation method around formula frame colloid 50A (or second around formula frame colloid 50B or the 3rd around formula frame colloid 50C); At least comprise following several steps: (1) at first; The liquid glue material of coating (figure does not show) is in substrate body 10 upper surfaces around ground; Wherein liquid glue material can optionally be surrounded into predetermined shape (for example circular, square, a rectangle ... Or the like); The thixotropic index (thixotropic index) of liquid glue material can be between 4 to 6, and being coated with liquid glue material can be between 350 to 450kpa in the pressure of substrate body 10 upper surfaces, and being coated with liquid glue material can be between 5 to 15mm/s in the speed of substrate body 10 upper surfaces; And the starting point around the liquid glue material of ground coating in substrate body 10 upper surfaces be about identical position with terminating point, so the confluce of starting point and terminating point will form one and show slightly the protuberance 5000 that protrudes outward appearance; (2) then, solidify liquid glue material again to form first around formula frame colloid 50A, wherein liquid glue material can harden through the mode of baking, and the temperature of baking can be between 120 to 140 degree, and the time of baking can be between 20 to 40 minutes.Therefore; First upper surface around formula frame colloid 50A can present a circular arc; First can be between 40 to 50 degree with respect to the angle θ of the circular arc tangential line T of substrate body 10 upper surfaces around formula frame colloid 50A; First can be between 0.3 to 0.7mm with respect to the height H of substrate body 10 upper surfaces around the end face of formula frame colloid 50A; First can be between 1.5 to 3mm around the width D of formula frame colloid 50A bottom, and first can be between 4 to 6 around the thixotropic index of formula frame colloid 50A, and first around formula frame colloid 50A can be one be mixed with inorganic additive white hot sclerosis frame colloid.
In addition; Cooperate shown in Figure 1A and Figure 1B; Encapsulation unit 6 comprises that one is filled in the spacing space 500A of first colloid with the first packing colloid 60A, that covers above-mentioned a plurality of first light-emitting diode chip for backlight unit 20A and is filled in the spacing space 500B of second colloid with the second packing colloid 60B that covers above-mentioned a plurality of second light-emitting diode chip for backlight unit 20B, and one is filled in the spacing space 500C of the 3rd colloid to cover the 3rd packing colloid 60C of above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit 20C; Wherein the first packing colloid 60A is centered on around formula frame colloid 50A by first; The second packing colloid 60B is centered on around formula frame colloid 50B by second, and the 3rd packing colloid 60C is centered on around formula frame colloid 50C by the 3rd.
For instance, because the first packing colloid 60A can be a transparent colloid, so first kind of optical wavelength that the first light emitting module 2A (for example using a plurality of red light emitting diodes bare chips) is produced can be between between the 600nm to 700nm.Because the second packing colloid 60B can be a transparent colloid, so second kind of optical wavelength that the second light emitting module 2B (for example using a plurality of blue LED bare chips) is produced can be between between the 400nm to 500nm.Because the 3rd packing colloid 60C can be a fluorescent colloid; Therefore the third optical wavelength of being produced of the 3rd light emitting module 2C (for example using a plurality of blue LED bare chips) can be between between the 400nm to 700nm, and the specific colour temperature that the 3rd light emitting module 2C is produced can be between between the 2700K to 10000K.Yet the employed encapsulation unit 6 of the utility model does not exceed with the above-mentioned example of being takeed.
Moreover shown in Fig. 1 D, base board unit 1 has a plurality of anodal weld pad P and a plurality of negative pole weld pad N that are arranged at substrate body 10 upper surfaces that are arranged at substrate body 10 upper surfaces.Each first light-emitting diode chip for backlight unit 20A has anodal 201 and one negative pole 202; The positive pole 201 of each first light-emitting diode chip for backlight unit 20A is corresponding at least two among above-mentioned a plurality of anodal weld pad P, and the negative pole 202 of each first light-emitting diode chip for backlight unit 20A is corresponding at least two among above-mentioned a plurality of negative pole weld pad N.Each second light-emitting diode chip for backlight unit 20B has anodal 201 and one negative pole 202; The positive pole 201 of each second light-emitting diode chip for backlight unit 20B is corresponding at least two among above-mentioned a plurality of anodal weld pad P, and the negative pole 202 of each second light-emitting diode chip for backlight unit 20B is corresponding at least two among above-mentioned a plurality of negative pole weld pad N.Each the 3rd light-emitting diode chip for backlight unit 20C has anodal 201 and one negative pole 202; The positive pole 201 of each the 3rd light-emitting diode chip for backlight unit 20C is corresponding at least two among above-mentioned a plurality of anodal weld pad P, and the negative pole 202 of each the 3rd light-emitting diode chip for backlight unit 20C is corresponding at least two among above-mentioned a plurality of negative pole weld pad N.
In addition; Shown in Fig. 1 D; The positive pole 201 of each first light-emitting diode chip for backlight unit 20A can be electrically connected at one of them among above-mentioned at least two anodal weld pad P through the mode of routing, and the negative pole 202 of each first light-emitting diode chip for backlight unit 20A can be electrically connected among above-mentioned at least two negative pole weld pad N one of them through the mode of routing.The positive pole 201 of each second light-emitting diode chip for backlight unit 20B can be electrically connected at one of them among above-mentioned at least two anodal weld pad P through the mode of routing, and the negative pole 202 of each second light-emitting diode chip for backlight unit 20B can be electrically connected among above-mentioned at least two negative pole weld pad N one of them through the mode of routing.The positive pole 201 of each the 3rd light-emitting diode chip for backlight unit 20C can be electrically connected at one of them among above-mentioned at least two anodal weld pad P through the mode of routing, and the negative pole 202 of each the 3rd light-emitting diode chip for backlight unit 20C can be electrically connected among above-mentioned at least two negative pole weld pad N one of them through the mode of routing.
(embodiment two)
See also shown in Figure 2ly, the utility model embodiment two provides a kind of lighting apparatus that is used to help the plant growth.Comparison by Fig. 2 and Fig. 1 C can be known; The utility model embodiment two is with embodiment one maximum difference: embodiment two further comprises: a bridge rectifier unit 7; It comprises one be arranged on the substrate body 10 and the first bridge rectifier 70A, that is electrically connected at the first current limliting chip 30A be arranged on the substrate body 10 and be electrically connected at the second current limliting chip 30B the second bridge rectifier 70B, and one be arranged on the substrate body 10 and be electrically connected at the 3rd bridge rectifier 70C of the 3rd current limliting chip 30C, and control module 4 is electrically connected between bridge rectifier unit 7 and the current limliting unit 3.Moreover, because bridge rectifier unit 7 can convert AC power A to dc source, but and 3 supplies on restriction of current limliting unit give the direct current flow of luminescence unit 2 so that luminescence unit 2 can access the supply of galvanic current stream.
(embodiment three)
See also shown in Figure 3ly, the utility model embodiment three provides a kind of lighting apparatus that is used to help the plant growth.Comparison by Fig. 3 and Fig. 1 C can be known; The utility model embodiment three is with embodiment one maximum difference: embodiment three further comprises: a bridge rectifier unit 7; It comprises at least one bridge rectifier 70 that is arranged on the substrate body 10; Wherein above-mentioned at least one bridge rectifier 70 is electrically connected at the first current limliting chip 30A, the second current limliting chip 30B simultaneously, reaches the 3rd current limliting chip 30C, and control module 4 is electrically connected between bridge rectifier unit 7 and the current limliting unit 3.
(embodiment four)
See also shown in Figure 4ly, the utility model embodiment four provides a kind of lighting apparatus that is used to help the plant growth.Comparison by Fig. 4 and Fig. 2 or Fig. 3 can be known; The maximum difference of the utility model embodiment four and second or three embodiment is: in embodiment four; When each first light-emitting diode chip for backlight unit 20A, each second light-emitting diode chip for backlight unit 20B, and each the 3rd light-emitting diode chip for backlight unit 20C be all AC light emitting diode (AC LED), the use that then can omit bridge rectifier unit 7.
(embodiment five)
See also shown in Fig. 5 A and the 5B, the utility model embodiment five provides a kind of lighting apparatus that is used to help the plant growth.By the comparison of Fig. 5 A and Figure 1A, and the comparison of Fig. 5 B and Figure 1B can know; The utility model embodiment five is with embodiment one maximum difference: in embodiment five, first around formula frame colloid 50A, second around formula frame colloid 50B, and the 3rd can be close to together in regular turn around formula frame colloid 50C.
(embodiment six)
See also shown in Fig. 6 A and the 6B, the utility model embodiment six provides a kind of lighting apparatus that is used to help the plant growth.By the comparison of Fig. 6 A and Figure 1A, and the comparison of Fig. 6 B and Figure 1B can know; The utility model embodiment six is with embodiment one maximum difference: in embodiment six; The first packing colloid 60A is centered on around formula frame colloid 50A by first; The second packing colloid 60B centers between the formula frame colloid 50B around formula frame colloid 50A and second first, and the 3rd packing colloid 60C centers between the formula frame colloid 50C around formula frame colloid 50B and the 3rd second.Moreover; Second centers on first around formula frame colloid 50B centers on formula frame colloid 50A; The 3rd centers on second around formula frame colloid 50C centers on formula frame colloid 50B; Above-mentioned a plurality of second light-emitting diode chip for backlight unit 20B centers between the formula frame colloid 50B around formula frame colloid 50A and second first, and above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit 20C centers between the formula frame colloid 50C around formula frame colloid 50B and the 3rd second.
In sum; The lighting apparatus that the utility model provided; It can through " a PWM control module can be used to control above-mentioned a plurality of first light-emitting diode chip for backlight unit and produces a predetermined pulse frequency; the 2nd PWM control module can be used to control above-mentioned a plurality of second light-emitting diode chip for backlight unit and produces a predetermined pulse frequency; and the 3rd PWM control module can be used to control above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit and produces a predetermined pulse frequency " design so that the lighting apparatus of the utility model can be used to help the plant growth.
The above is merely the preferable possible embodiments of the utility model, and the claim of non-so limitation the utility model is so the equivalence techniques that all utilization the utility model specifications and accompanying drawing content are done variation all is contained in the protection domain of the utility model.

Claims (20)

1. a lighting apparatus that is used to help the plant growth is characterized in that, comprising:
One base board unit; It comprises a substrate body, wherein this substrate body have one be positioned at this substrate body upper surface first crystal area, be positioned at this substrate body upper surface second crystal area, and one be positioned at this substrate body upper surface the 3rd crystal area;
One luminescence unit; It comprises one be used to produce first kind of optical wavelength first light emitting module, be used to produce second kind of optical wavelength second light emitting module, and one be used to produce the third optical wavelength and a specific colour temperature the 3rd light emitting module; Wherein this first light emitting module comprises a plurality of first light-emitting diode chip for backlight unit that are arranged on this first crystal area and are electrically connected at this substrate body; This second light emitting module comprises a plurality of second light-emitting diode chip for backlight unit that are arranged on this second crystal area and are electrically connected at this substrate body, and the 3rd light emitting module comprises a plurality of the 3rd light-emitting diode chip for backlight unit that are arranged on the 3rd crystal area and are electrically connected at this substrate body;
One current limliting unit, it comprise one be arranged on this substrate body and the first current limliting chip, that is electrically connected at this first light emitting module be arranged on this substrate body and be electrically connected at this second light emitting module the second current limliting chip, and one be arranged on this substrate body and be electrically connected at the 3rd current limliting chip of the 3rd light emitting module;
One control module, it comprise one be arranged on this substrate body and the PWM control module, that is electrically connected at this first current limliting chip be arranged on this substrate body and be electrically connected at this second current limliting chip the 2nd PWM control module, and one be arranged on this substrate body and be electrically connected at the 3rd PWM control module of the 3rd current limliting chip;
One frame unit; It comprises one form in around ground this substrate body upper surface first around formula frame colloid, form in around ground this substrate body upper surface second around formula frame colloid, and one form in the 3rd of this substrate body upper surface with centering on and center on formula frame colloid; Wherein this first around formula frame colloid around above-mentioned a plurality of first light-emitting diode chip for backlight unit; To form a spacing space of first colloid corresponding to this first crystal area; This second around formula frame colloid around above-mentioned a plurality of second light-emitting diode chip for backlight unit; Forming a spacing space of second colloid corresponding to this second crystal area, and the 3rd around formula frame colloid around above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit, to form a spacing space of the 3rd colloid corresponding to the 3rd crystal area; And
One encapsulation unit; It comprises that one is filled in this spacing space of first colloid with first packing colloid, that covers above-mentioned a plurality of first light-emitting diode chip for backlight unit and is filled in this spacing space of second colloid with second packing colloid that covers above-mentioned a plurality of second light-emitting diode chip for backlight unit, and one is filled in the spacing space of the 3rd colloid to cover the 3rd packing colloid of above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit; Wherein this first packing colloid first is centered on around formula frame colloid by this; This second packing colloid second is centered on around formula frame colloid by this, and the 3rd packing colloid is centered on around formula frame colloid by the 3rd.
2. the lighting apparatus that is used to help the plant growth as claimed in claim 1; It is characterized in that; This first around formula frame colloid, this is second around formula frame colloid, and the 3rd around a formula frame colloid specific range separated from one another or be close to together in regular turn, and this spacing space of first colloid, this spacing space of second colloid, and the spacing space of the 3rd a colloid specific range separated from one another.
3. the lighting apparatus that is used to help the plant growth as claimed in claim 1; It is characterized in that; First kind of optical wavelength of this first light emitting module is between between the 600nm to 700nm; Second kind of optical wavelength of this second light emitting module is between between the 400nm to 500nm, and the third optical wavelength of the 3rd light emitting module is between between the 400nm to 700nm, and the specific colour temperature of the 3rd light emitting module is between between the 2700K to 10000K.
4. the lighting apparatus that is used to help the plant growth as claimed in claim 1 is characterized in that this base board unit has a plurality of anodal weld pad and a plurality of negative pole weld pads that are arranged at this substrate body upper surface that are arranged at this substrate body upper surface; Wherein each first light-emitting diode chip for backlight unit has an anodal and negative pole; The positive pole of each first light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each first light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of negative pole weld pads; Wherein each second light-emitting diode chip for backlight unit has an anodal and negative pole; The positive pole of each second light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each second light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of negative pole weld pads; Wherein each the 3rd light-emitting diode chip for backlight unit has an anodal and negative pole; The positive pole of each the 3rd light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each the 3rd light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of negative pole weld pads.
5. the lighting apparatus that is used to help the plant growth as claimed in claim 4; It is characterized in that; The positive pole of each first light-emitting diode chip for backlight unit is electrically connected at one of them in above-mentioned at least two anodal weld pads, and the negative pole of each first light-emitting diode chip for backlight unit is electrically connected in above-mentioned at least two negative pole weld pads one of them; Wherein the positive pole of each second light-emitting diode chip for backlight unit is electrically connected at one of them in above-mentioned at least two anodal weld pads, and the negative pole of each second light-emitting diode chip for backlight unit is electrically connected in above-mentioned at least two negative pole weld pads one of them; Wherein the positive pole of each the 3rd light-emitting diode chip for backlight unit is electrically connected at one of them in above-mentioned at least two anodal weld pads, and the negative pole of each the 3rd light-emitting diode chip for backlight unit is electrically connected in above-mentioned at least two negative pole weld pads one of them.
6. the lighting apparatus that is used to help the plant growth as claimed in claim 1; It is characterized in that; Further comprise: a bridge rectifier unit; It comprises at least one bridge rectifier that is arranged on this substrate body, and wherein above-mentioned at least one bridge rectifier is electrically connected at this first current limliting chip, this second current limliting chip simultaneously, reaches the 3rd current limliting chip, and this control module is electrically connected between this bridge rectifier unit and this current limliting unit.
7. the lighting apparatus that is used to help the plant growth as claimed in claim 1; It is characterized in that; Further comprise: a bridge rectifier unit; It comprises one be arranged on this substrate body and first bridge rectifier, that is electrically connected at this first current limliting chip be arranged on this substrate body and be electrically connected at this second current limliting chip second bridge rectifier, and one be arranged on this substrate body and be electrically connected at the 3rd bridge rectifier of the 3rd current limliting chip, and this control module is electrically connected between this bridge rectifier unit and this current limliting unit.
8. a lighting apparatus that is used to help the plant growth is characterized in that, comprising:
One base board unit; It comprises a substrate body, wherein this substrate body have one be positioned at this substrate body upper surface first crystal area, be positioned at this substrate body upper surface second crystal area, and one be positioned at this substrate body upper surface the 3rd crystal area;
One luminescence unit; It comprises one be used to produce first kind of optical wavelength first light emitting module, be used to produce second kind of optical wavelength second light emitting module, and one be used to produce the third optical wavelength and a specific colour temperature the 3rd light emitting module; Wherein this first light emitting module comprises a plurality of first light-emitting diode chip for backlight unit that are arranged on this first crystal area and are electrically connected at this substrate body; This second light emitting module comprises a plurality of second light-emitting diode chip for backlight unit that are arranged on this second crystal area and are electrically connected at this substrate body, and the 3rd light emitting module comprises a plurality of the 3rd light-emitting diode chip for backlight unit that are arranged on the 3rd crystal area and are electrically connected at this substrate body;
One current limliting unit, it comprise one be arranged on this substrate body and the first current limliting chip, that is electrically connected at this first light emitting module be arranged on this substrate body and be electrically connected at this second light emitting module the second current limliting chip, and one be arranged on this substrate body and be electrically connected at the 3rd current limliting chip of the 3rd light emitting module;
One control module, it comprise one be arranged on this substrate body and the PWM control module, that is electrically connected at this first current limliting chip be arranged on this substrate body and be electrically connected at this second current limliting chip the 2nd PWM control module, and one be arranged on this substrate body and be electrically connected at the 3rd PWM control module of the 3rd current limliting chip;
One frame unit; It comprises one form in around ground this substrate body upper surface first around formula frame colloid, form in around ground this substrate body upper surface second around formula frame colloid, and one form in the 3rd of this substrate body upper surface with centering on and center on formula frame colloid; Wherein this first around formula frame colloid around above-mentioned a plurality of first light-emitting diode chip for backlight unit; To form a spacing space of first colloid corresponding to this first crystal area; This second around formula frame colloid around above-mentioned a plurality of second light-emitting diode chip for backlight unit; Forming a spacing space of second colloid corresponding to this second crystal area, and the 3rd around formula frame colloid around above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit, to form a spacing space of the 3rd colloid corresponding to the 3rd crystal area; And
One encapsulation unit; It comprises that one is filled in this spacing space of first colloid with first packing colloid, that covers above-mentioned a plurality of first light-emitting diode chip for backlight unit and is filled in this spacing space of second colloid with second packing colloid that covers above-mentioned a plurality of second light-emitting diode chip for backlight unit, and one is filled in the spacing space of the 3rd colloid to cover the 3rd packing colloid of above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit; Wherein this first packing colloid first is centered on around formula frame colloid by this; This second packing colloid this first around formula frame colloid with this second between the formula frame colloid, and the 3rd packing colloid second centers between the formula frame colloid around formula frame colloid and the 3rd at this.
9. the lighting apparatus that is used to help the plant growth as claimed in claim 8; It is characterized in that; This second around formula frame colloid around this first around formula frame colloid; The 3rd around formula frame colloid around this second around formula frame colloid; Above-mentioned a plurality of second light-emitting diode chip for backlight unit this first around formula frame colloid with this second between the formula frame colloid, and above-mentioned a plurality of the 3rd light-emitting diode chip for backlight unit second centers between the formula frame colloid around formula frame colloid and the 3rd at this.
10. the lighting apparatus that is used to help the plant growth as claimed in claim 8; It is characterized in that; First kind of optical wavelength of this first light emitting module is between between the 600nm to 700nm; Second kind of optical wavelength of this second light emitting module is between between the 400nm to 500nm, and the third optical wavelength of the 3rd light emitting module is between between the 400nm to 700nm, and the specific colour temperature of the 3rd light emitting module is between between the 2700K to 10000K.
11. the lighting apparatus that is used to help the plant growth as claimed in claim 8 is characterized in that this base board unit has a plurality of anodal weld pad and a plurality of negative pole weld pads that are arranged at this substrate body upper surface that are arranged at this substrate body upper surface; Wherein each first light-emitting diode chip for backlight unit has an anodal and negative pole; The positive pole of each first light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each first light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of negative pole weld pads; Wherein each second light-emitting diode chip for backlight unit has an anodal and negative pole; The positive pole of each second light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each second light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of negative pole weld pads; Wherein each the 3rd light-emitting diode chip for backlight unit has an anodal and negative pole; The positive pole of each the 3rd light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each the 3rd light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of negative pole weld pads.
12. the lighting apparatus that is used to help the plant growth as claimed in claim 11; It is characterized in that; The positive pole of each first light-emitting diode chip for backlight unit is electrically connected at one of them in above-mentioned at least two anodal weld pads, and the negative pole of each first light-emitting diode chip for backlight unit is electrically connected in above-mentioned at least two negative pole weld pads one of them; Wherein the positive pole of each second light-emitting diode chip for backlight unit is electrically connected at one of them in above-mentioned at least two anodal weld pads, and the negative pole of each second light-emitting diode chip for backlight unit is electrically connected in above-mentioned at least two negative pole weld pads one of them; Wherein the positive pole of each the 3rd light-emitting diode chip for backlight unit is electrically connected at one of them in above-mentioned at least two anodal weld pads, and the negative pole of each the 3rd light-emitting diode chip for backlight unit is electrically connected in above-mentioned at least two negative pole weld pads one of them.
13. the lighting apparatus that is used to help the plant growth as claimed in claim 8; It is characterized in that; Further comprise: a bridge rectifier unit; It comprises at least one bridge rectifier that is arranged on this substrate body, and wherein above-mentioned at least one bridge rectifier is electrically connected at this first current limliting chip, this second current limliting chip simultaneously, reaches the 3rd current limliting chip, and this control module is electrically connected between this bridge rectifier unit and this current limliting unit.
14. the lighting apparatus that is used to help the plant growth as claimed in claim 8; It is characterized in that; Further comprise: a bridge rectifier unit; It comprises one be arranged on this substrate body and first bridge rectifier, that is electrically connected at this first current limliting chip be arranged on this substrate body and be electrically connected at this second current limliting chip second bridge rectifier, and one be arranged on this substrate body and be electrically connected at the 3rd bridge rectifier of the 3rd current limliting chip, and this control module is electrically connected between this bridge rectifier unit and this current limliting unit.
15. a lighting apparatus that is used to help the plant growth is characterized in that, comprising:
One base board unit; It comprises a substrate body, wherein this substrate body have one be positioned at this substrate body upper surface first crystal area, be positioned at this substrate body upper surface second crystal area, and one be positioned at this substrate body upper surface the 3rd crystal area;
One luminescence unit; It comprises one be used to produce first kind of optical wavelength first light emitting module, be used to produce second kind of optical wavelength second light emitting module, and one be used to produce the third optical wavelength and a specific colour temperature the 3rd light emitting module; Wherein this first light emitting module comprises a plurality of first light-emitting diode chip for backlight unit that are arranged on this first crystal area and are electrically connected at this substrate body; This second light emitting module comprises a plurality of second light-emitting diode chip for backlight unit that are arranged on this second crystal area and are electrically connected at this substrate body, and the 3rd light emitting module comprises a plurality of the 3rd light-emitting diode chip for backlight unit that are arranged on the 3rd crystal area and are electrically connected at this substrate body;
One current limliting unit, it comprise one be arranged on this substrate body and the first current limliting chip, that is electrically connected at this first light emitting module be arranged on this substrate body and be electrically connected at this second light emitting module the second current limliting chip, and one be arranged on this substrate body and be electrically connected at the 3rd current limliting chip of the 3rd light emitting module; And
One control module, it comprise one be arranged on this substrate body and the PWM control module, that is electrically connected at this first current limliting chip be arranged on this substrate body and be electrically connected at this second current limliting chip the 2nd PWM control module, and one be arranged on this substrate body and be electrically connected at the 3rd PWM control module of the 3rd current limliting chip.
16. the lighting apparatus that is used to help the plant growth as claimed in claim 15; It is characterized in that; First kind of optical wavelength of this first light emitting module is between between the 600nm to 700nm; Second kind of optical wavelength of this second light emitting module is between between the 400nm to 500nm, and the third optical wavelength of the 3rd light emitting module is between between the 400nm to 700nm, and the specific colour temperature of the 3rd light emitting module is between between the 2700K to 10000K.
17. the lighting apparatus that is used to help the plant growth as claimed in claim 15 is characterized in that this base board unit has a plurality of anodal weld pad and a plurality of negative pole weld pads that are arranged at this substrate body upper surface that are arranged at this substrate body upper surface; Wherein each first light-emitting diode chip for backlight unit has an anodal and negative pole; The positive pole of each first light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each first light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of negative pole weld pads; Wherein each second light-emitting diode chip for backlight unit has an anodal and negative pole; The positive pole of each second light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each second light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of negative pole weld pads; Wherein each the 3rd light-emitting diode chip for backlight unit has an anodal and negative pole; The positive pole of each the 3rd light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of anodal weld pads, and the negative pole of each the 3rd light-emitting diode chip for backlight unit is corresponding at least two in above-mentioned a plurality of negative pole weld pads.
18. the lighting apparatus that is used to help the plant growth as claimed in claim 17; It is characterized in that; The positive pole of each first light-emitting diode chip for backlight unit is electrically connected at one of them in above-mentioned at least two anodal weld pads, and the negative pole of each first light-emitting diode chip for backlight unit is electrically connected in above-mentioned at least two negative pole weld pads one of them; Wherein the positive pole of each second light-emitting diode chip for backlight unit is electrically connected at one of them in above-mentioned at least two anodal weld pads, and the negative pole of each second light-emitting diode chip for backlight unit is electrically connected in above-mentioned at least two negative pole weld pads one of them; Wherein the positive pole of each the 3rd light-emitting diode chip for backlight unit is electrically connected at one of them in above-mentioned at least two anodal weld pads, and the negative pole of each the 3rd light-emitting diode chip for backlight unit is electrically connected in above-mentioned at least two negative pole weld pads one of them.
19. the lighting apparatus that is used to help the plant growth as claimed in claim 15; It is characterized in that; Further comprise: a bridge rectifier unit; It comprises at least one bridge rectifier that is arranged on this substrate body, and wherein above-mentioned at least one bridge rectifier is electrically connected at this first current limliting chip, this second current limliting chip simultaneously, reaches the 3rd current limliting chip, and this control module is electrically connected between this bridge rectifier unit and this current limliting unit.
20. the lighting apparatus that is used to help the plant growth as claimed in claim 15; It is characterized in that; Further comprise: a bridge rectifier unit; It comprises one be arranged on this substrate body and first bridge rectifier, that is electrically connected at this first current limliting chip be arranged on this substrate body and be electrically connected at this second current limliting chip second bridge rectifier, and one be arranged on this substrate body and be electrically connected at the 3rd bridge rectifier of the 3rd current limliting chip, and this control module is electrically connected between this bridge rectifier unit and this current limliting unit.
CN2011202854821U 2011-08-08 2011-08-08 Illuminating equipment for helping plants to grow Expired - Fee Related CN202188397U (en)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104681517A (en) * 2013-12-03 2015-06-03 上海北京大学微电子研究院 Multi-chip QFN (Quad Flat No Lead) package suitable for LED (Light Emitting Diode) illuminating application
CN106195722A (en) * 2015-05-05 2016-12-07 扬州艾笛森光电有限公司 The light emitting diode illuminating apparatus of alternating current power supply be can be used directly
CN108343901A (en) * 2017-01-25 2018-07-31 松下知识产权经营株式会社 Lighting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104681517A (en) * 2013-12-03 2015-06-03 上海北京大学微电子研究院 Multi-chip QFN (Quad Flat No Lead) package suitable for LED (Light Emitting Diode) illuminating application
CN106195722A (en) * 2015-05-05 2016-12-07 扬州艾笛森光电有限公司 The light emitting diode illuminating apparatus of alternating current power supply be can be used directly
CN108343901A (en) * 2017-01-25 2018-07-31 松下知识产权经营株式会社 Lighting device
CN108343901B (en) * 2017-01-25 2021-10-26 松下知识产权经营株式会社 Lighting device

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