CN202165831U

CN202165831U - White-light LED integrated module with adjustable color temperature and color rendering index

Info

Publication number: CN202165831U
Application number: CN2011200251726U
Authority: CN
Inventors: 郭伟玲; 崔德胜; 崔碧峰; 刘莹
Original assignee: Beijing University of Technology
Current assignee: Beijing University of Technology
Priority date: 2011-01-25
Filing date: 2011-01-25
Publication date: 2012-03-14
Anticipated expiration: 2021-01-25

Abstract

The utility model relates to a packaging structure of an LED integrated module and a preparation process thereof. The LED integrated module comprises a red-light LED chip 7, a blue-light LED chip 8, an LED rack 1 with independent electrodes 3, 4 and 5, a ceramic substrate 6, fluorescent powders 10 and silica gels 11. The red-light LED chip 7 and the blue-light LED chip 8 are fixed in the LED rack 1. Both chips are uniformly coated with the fluorescent powders 10 and the silica gels 11. Under the environment where different color temperatures and color rendering indexes are required, the white-light LED integrated module of the utility model allows adjustment of the light intensity of the red-light LED chip at any time so as to realize the change in the color temperature and the color rendering index, without the need of employing multiple independent LED integrated modules with different color temperatures. In this way, the lamp design is simplified, the amount of fluorescent powders consumed is reduced, the number of control power sources is decreased, and the cost is greatly reduced.

Description

The white light LEDs integration module that a kind of colour temperature and colour rendering index are adjustable

Technical field

The present invention relates to the encapsulating structure and the technology of the adjustable white light LEDs integration module of a kind of colour temperature and colour rendering index, belong to the LED encapsulation field.

Technical background

LED is a kind of solid-state semiconductor devices; As a kind of novel lighting source; Because its good stability, the life-span is long, brightness is high and many advantages such as energy-conservation, application prospect is extensive, since the nineties in last century; Along with gallium nitride is the semi-conductive rise of the third generation of representative and the research success of white light LEDs, makes and realize that the semiconductor White-light LED illumination becomes possibility.White light LEDs is described as the light source of 21 century most worthy, will cause an illumination revolution.

The LED integration module is because volume is little; Brightness advantages of higher and being widely used; The encapsulation of white light LEDs integration module at present mainly is to make the LED integration module with certain limit colour temperature as requested; If but needed different colour temperature and colour rendering index in the different time section in same occasion, just a plurality of independently LED integration modules must be installed, and the raising of colour rendering index to be added red fluorescence powder in fluorescent material; Thereby reduced the light efficiency of LED integration module, this has just increased cost greatly in application.

Summary of the invention

For solving the shortcoming and defect in the above-mentioned technology; The present invention provides the encapsulating structure and the technology of the adjustable white light LEDs integration module of a kind of colour temperature and colour rendering index, and purpose is to make the white light LEDs integration module can be when the different colour temperature of needs and during colour rendering index and adjustment at any time, needn't use the LED integration module of a plurality of independently different-colours; Thereby simplify the design of light fixture; And reduced the use amount of fluorescent material, and reduced the quantity of control power supply, reduced cost significantly.

Technical scheme of the present invention is following:

The white light LEDs integration module that a kind of colour temperature and colour rendering index are adjustable; Comprise red LED chip 7 and blue-light LED chip 8, led support 1, ceramic substrate 6, fluorescent material 10, transparent silica gel 11 with absolute electrode; It is characterized in that: the mid portion at led support 1 is fixed with ceramic substrate 6; Be pressed with copper sheet electrode 9 on the ceramic substrate 6, be fixed with red LED chip 7 on the copper sheet electrode, be fixed with the identical blue-light LED chip of quantity 8 on the support plane of the both sides of ceramic substrate 6; The blue chip 8 of ceramic substrate 6 both sides is connected with third electrode 5 with first electrode 3 respectively, and red light chips 7 is connected with the second middle electrode 4; Above said structure, be covered with layer of fluorescent powder 10 and layer of transparent silica gel 11; The power supply of described encapsulating structure is single channel or multiple constant current module.

The white light LEDs integration module that a kind of colour temperature and colour rendering index are adjustable, this packaging technology may further comprise the steps:

1) cleans led support: four jiaos of four angles that have four circular holes to be positioned at square set of this led support; Be used for fixing support, a ceramic enclosure wall is arranged on the support, chip is fixed on the copper base in the enclosure wall; The pottery inboard wall has a ladder; Have electrode and electrode to draw in the outside of ceramic enclosure wall on the ladder, said electrode comprises first electrode, second electrode and third electrode, and led support is dehumidified and cleans;

2) fixing ceramic substrate: this has copper sheet to be used for the bottom electrode as red LED chip above ceramic substrate, and ceramic substrate is fixed in the support and baking with insulating cement;

3) solid brilliant: led chip is fixed on the plane in the support with elargol, and wherein, a middle row is red light chips, and both sides are blue chip, and baking is fixed chip;

4) bonding wire: with the both positive and negative polarity of led chip respectively with support on first, second link to each other with third electrode;

5) dot fluorescent powder: the fluorescent material that will prepare and vacuumize evenly is coated on the led chip and baking;

6) sealing: on the fluorescent material after the baking, evenly cover transparent silica gel, through baking molding.

The white light LEDs integration module encapsulating structure that said colour temperature and colour rendering index are adjustable, wherein, three electrodes of LED integration module are separate.

The white light LEDs integration module encapsulating structure that said colour temperature and colour rendering index are adjustable, wherein, ceramic substrate is a kind of electric insulation highly heat-conductive material, can not influence the heat radiation of led chip, the copper sheet on the substrate is used to draw the electrode of chip lower end.

The white light LEDs integration module encapsulating structure that said colour temperature and colour rendering index are adjustable, wherein, described silica gel is transparent resin, said silica gel baking back Shore hardness reaches more than 75 degree.

The white light LEDs integration module encapsulating structure that said colour temperature and colour rendering index are adjustable, wherein, the power supply of control integration module comprises a multiple constant current module or two constant flow modules.

The white light LEDs integration module encapsulating structure that said colour temperature and colour rendering index are adjustable, wherein, ruddiness and blue-light LED chip are by the multiple constant current module controls; Perhaps red LED chip is controlled by a constant flow module, and all blue-light LED chips are by another constant flow module control, and the electric current of regulating red LED chip just can change the colour temperature and the colour rendering index of integration module.

The white light LEDs integration module packaging technology that said colour temperature and colour rendering index are adjustable, wherein, described upper/lower electrode red LED chip can use the red LED chip with lateral electrode to replace, and does not need ceramic substrate.

The white light LEDs integration module packaging technology that said colour temperature and colour rendering index are adjustable, wherein, said red LED chip can use orange led chip to replace, and can reach described effect.

The white light LEDs integration module packaging technology that said colour temperature and colour rendering index are adjustable, wherein, said blue chip can be 1 row, 2 rows ... n row.

Compare with existing white light LEDs integration module method for packing; The present invention adopts colour temperature and the adjustable white light LEDs integration module method for packing of colour rendering index; With ruddiness and blue-light LED chip fixing with support on, control each absolute electrode and can realize different colour temperatures and colour rendering index, satisfied different demands; And the reduction of colour temperature and the rising of colour rendering index are to realize through the luminous flux that increases red-light LED; Having changed in the past increases rouge and powder and causes light efficiency to descend in fluorescent material, improved the light extraction efficiency of every chips in the white light LEDs integration module, thereby whole light extraction efficiency is improved.

Description of drawings

Below in conjunction with accompanying drawing the present invention is further specified.

Fig. 1 is the sketch map behind the solid crystalline substance of the present invention.

Fig. 2 is the enlarged diagram of the ceramic substrate among the present invention.

Fig. 3 is the sketch map behind the bonding wire of the present invention.

Fig. 4 is the sketch map after the present invention applies fluorescent material.

Fig. 5 is the sketch map after the present invention accomplishes final technology.

Fig. 6 is that the present invention uses the sketch map after the homonymy red LED chip is accomplished final technology.

Wherein, 1LED support; 2 are used for fixing the circular hole of support; 3 first electrodes; 4 second electrodes; 5 third electrodes; 6 ceramic substrates; 7 red LED chips; 8 blue-light LED chips; Copper sheet electrode on 9 ceramic substrates; 10 fluorescent material; 11 transparent silica gel; Plane on the 12 ceramic enclosure walls

The specific embodiment

Embodiment 1:

With reference to accompanying drawing 1-5, the white light LEDs integration module packaging technology that a kind of colour temperature and colour rendering index are adjustable comprises following step, below each step describe.

1) with reference to Fig. 1, clean led support: this led support has four circular holes 2 to be used for fixing support for four jiaos, and said led support comprises that first electrode 3, second electrode 4 and 5, three electrodes of third electrode are separate, and led support is dehumidified and cleans;

2) fixing ceramic substrate 6: with reference to Fig. 2, this has copper sheet 9 to be used for the bottom electrode as red LED chip 7 above ceramic substrate, and ceramic substrate is fixed in the support 1 and baking with insulating cement;

3) solid brilliant: with reference to Fig. 3, red LED chip 7 usefulness elargol are fixed on the copper sheet 9 of ceramic substrate, blue-light LED chip 8 usefulness elargol are fixed on the plane in the support 1; Wherein, a middle row is red light chips, also can use orange led chip to replace; Both sides are blue chip; Blue chip can be 1 row, 2 rows ... n row, and baking is fixed chip then;

4) bonding wire: with reference to Fig. 3, with the both positive and negative polarity of led chip respectively with support on first, second link to each other with third electrode, wherein the bottom electrode bonding wire of red LED chip 7 is drawn by the copper sheet electrode 9 on the ceramic substrate, is bonded to the top electrode of adjacent chips;

5) dot fluorescent powder: with reference to Fig. 4, fluorescent material is mixed with silica gel and stirs, evenly be coated on the led chip after the fluorescent material 10 after stirring is vacuumized, the interior electrode of fluorescent material and ceramic enclosure wall is at same plane, baking molding then;

6) sealing: with reference to Fig. 5, on the fluorescent material after the baking, evenly cover transparent silica gel 11, plane 12 gets final product at grade on transparent silica gel 11 and the ceramic enclosure wall, through baking molding.

Embodiment 2:

With reference to accompanying drawing 6, the white light LEDs integration module packaging technology that a kind of colour temperature and colour rendering index are adjustable comprises following step, below each step describe.

1) clean led support: this led support has four circular holes 2 to be used for fixing support for four jiaos, and said led support comprises that first electrode 3, second electrode 4 and 5, three electrodes of third electrode are separate, and led support is dehumidified and cleans;

2) solid brilliant: as will to be fixed on the plane in the support 1 with blue-light LED chip 8 usefulness elargol with the red LED chip 7 of lateral electrode; Wherein, a middle row is red light chips, also can use orange led chip to replace; Both sides are blue chip; Blue chip can be 1 row, 2 rows ... n row, and baking is fixed chip then;

3) bonding wire: with the both positive and negative polarity of led chip respectively with support on first, second link to each other with third electrode;

4) dot fluorescent powder: fluorescent material is mixed with silica gel and stirs, evenly be coated on the led chip after the fluorescent material 10 after stirring is vacuumized, the interior electrode of fluorescent material and ceramic enclosure wall is at same plane, baking molding then;

5) sealing: on the fluorescent material after the baking, evenly cover transparent silica gel 11, plane 12 gets final product at grade on transparent silica gel 11 and the ceramic enclosure wall, through baking molding.

The above is merely preferred embodiment of the present invention, is not to be used for limiting practical range of the present invention; Both all equivalents of being done according to claim scope of the present invention are protection scope of the present invention and cover.

Claims

1. colour temperature and the adjustable white light LEDs integration module of colour rendering index; Comprise red LED chip (7) and blue-light LED chip (8), have led support (1), ceramic substrate (6), fluorescent material (10), the transparent silica gel (11) of absolute electrode; It is characterized in that: the mid portion at led support (1) is fixed with ceramic substrate (6); Be pressed with copper sheet electrode (9) on the ceramic substrate (6); Be fixed with red LED chip (7) on the copper sheet electrode; Be fixed with the identical blue-light LED chip of quantity (8) on the support plane of the both sides of ceramic substrate (6), the blue chip (8) of ceramic substrate (6) both sides is connected with third electrode (5) with first electrode (3) respectively, and red light chips (7) is connected with middle second electrode (4); Above said structure, be covered with layer of fluorescent powder (10) and layer of transparent silica gel (11); The power supply of described encapsulating structure is single channel or multiple constant current module.

2. the white light LEDs that a kind of colour temperature according to claim 1 and colour rendering index are adjustable is integrated, it is characterized in that: four angles of said led support (1) have the circular hole that is used for fixing support.

3. the white light LEDs integration module that colour temperature according to claim 1 and colour rendering index are adjustable is characterized in that, the power supply of control integration module comprises a multiple constant current module or two constant flow modules; Ruddiness and blue-light LED chip are by the multiple constant current module controls; Perhaps red LED chip is controlled by a constant flow module, and all blue-light LED chips are by another constant flow module control.

4. the white light LEDs integration module that colour temperature according to claim 1 and colour rendering index are adjustable is characterized in that described upper/lower electrode red LED chip can be the chip of the electrode of homonymy, does not need ceramic substrate simultaneously.

5. the white light LEDs integration module that colour temperature according to claim 1 and colour rendering index are adjustable is characterized in that, said red LED chip can use orange led chip to replace.

6. the white light LEDs integration module that colour temperature according to claim 1 and colour rendering index are adjustable is characterized in that, said blue chip can be 1 row, 2 rows ... n row.