CN202148674U - Low temperature heating solid composite floor - Google Patents
Low temperature heating solid composite floor Download PDFInfo
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- CN202148674U CN202148674U CN201120234122U CN201120234122U CN202148674U CN 202148674 U CN202148674 U CN 202148674U CN 201120234122 U CN201120234122 U CN 201120234122U CN 201120234122 U CN201120234122 U CN 201120234122U CN 202148674 U CN202148674 U CN 202148674U
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Abstract
The utility model provides a low temperature heating solid composite floor, comprising an exterior surface layer, an upper base material layer, a heating layer and a lower base material layer, which are orderly stacked up and thermally pressed. The heating layer and the lower base material layer have nine layers after being thermally pressed; the heating layer is located at the fifth, sixth and seventh layers; the upper base material layer is located above the heating layer while the lower base material layer is located below the heating layer; the upper base material layer is composed of third, fourth and fifth layers while the lower base material layer is composed of fourth, fifth and sixth layers; and the exterior surface layer is arranged on the upper base material layer in a thermal pressing manner. The low temperature heating solid composite floor prepared through the method provided in the utility model can reduce the design power in a unit area of the floor so that the highest temperature on the surface of the floor is 50-55 DEG C; the problems that the floor deforms and cracks and the like are solved; and the heat radiation and transmission are improved. The low temperature heating solid composite floor has uniform heating, energy conversation, environment friendliness, harmlessness on users, low cost, simple structure, is safe and convenient to use.
Description
Technical field
The utility model relates to a kind of solid wooden compound floor, is specifically related to a kind of low temperature heating solid wooden compound floor.
Background technology
At present, the heating temp of existing heating floor is higher, damage the floor easily and cause accidents such as fire, and all there is deficiency in aspect such as insulation, temperature control, application life, stability.
Chinese patent publication No. CN101600270 discloses a kind of conductive exothermal material and has comprised the floor and the manufacturing approach of this conductive exothermal material; Main graphite of exothermic material in this floor and conductive black are prepared into conductive exothermal coating, then with electrically-conducting paint with the printing mode attached on the wood floor base material.Because its exothermic material adopts graphite and electrically-conducting paint, and the exothermic material that graphite and electrically-conducting paint are processed ability loss-rate is big, so make floor surface temperature too high; Through actual test, test data shows that its maximum surface temperature can reach 80 ℃, makes wood flooring produce distortion, ftracture and burn easily; In a single day these situation appear in the floor of installing under construction; To bring economic loss to the customer, even need reinstall the floor, the serious generation that also can cause security incident.
In view of the above problems, the utility model discloses a kind of low temperature heating solid wooden compound floor and preparation method thereof.It has technical characterictic as mentioned below, to solve existing problem.
The utility model content
The purpose of the utility model provides a kind of low temperature heating solid wooden compound floor and preparation method thereof; It can reduce the design power of floor unit area; The maximum temperature that makes floor surface has solved the floor deformation problems of crack at 50 ℃-55 ℃, has improved the radiation and the conduction of heat.
The purpose of the utility model low temperature heating solid wooden compound floor and preparation method thereof realizes through following technical scheme: a kind of low temperature heating solid wooden compound floor comprises: the exterior trim surface layer, go up substrate layer, heating layer and down substrate layer stack successively and the hot pressing formation.
Described substrate layer, heating layer and after the substrate layer hot pressing totally 9 layers down gone up; Described heating layer is positioned at the 5-7 layer, and the top of described heating layer is last substrate layer, and the below of described heating layer is following substrate layer; The described substrate layer of going up constitutes by 3 to 5 layers, and described substrate layer down constitutes by 4 to 6 layers; Described exterior trim surface layer is arranged on the substrate layer through hot pressing.
Described exterior trim surface layer, last substrate layer, heating layer and following substrate layer are strip respectively; Be respectively equipped with a pair of copper-base on the two ends broadside of described heating layer, and copper-base and heating layer are with wide; Described going up between substrate layer bottom and heating layer, following substrate layer top and the heating layer is respectively equipped with one deck fireprotection layer; The described bottom of substrate layer down is provided with one deck reflecting layer.
The described substrate layer of going up is by the crisscross hierarchal arrangement of multi-layer substrate blockboard and be bonded, and described substrate layer down is by the crisscross hierarchal arrangement of multilayer bottom plate and be bonded.
Above-mentioned low temperature heating solid wooden compound floor, wherein, described heating layer is an electric conduction of carbon fiber paper, and on electric conduction of carbon fiber paper, is provided with a plurality of apertures; Described copper-base is pressed to prick by the copper aluminium foil and is formed.
Above-mentioned low temperature heating solid wooden compound floor, wherein, the described two ends of substrate layer down are respectively equipped with a pair of through hole, and the position of copper-base is corresponding on the position of through hole and the heating layer.
Above-mentioned low temperature heating solid wooden compound floor, wherein: also comprise connector and temperature-sensitive assembly;
Described connector comprises male terminal, female terminal, connects male terminal, connects female terminal and a pair of connection lead, and described connection male terminal is with to be connected the female terminal size suitable; Described male terminal and female terminal size are suitable; Female terminal is arranged on down in the through hole of substrate layer, contacts with the copper-base of heating layer, and a pair of connection lead is pressed together on the male terminal; Connect male terminal external another with the connection female terminal in the device, connect female terminal external another with the male terminal in the device;
The temperature-sensitive assembly is arranged on the male terminal.
The utility model low temperature heating solid wooden compound floor and preparation method thereof makes it compared with prior art owing to adopted such scheme, has following advantage and good effect:
1, the maximum temperature of the utility model low temperature heating solid wooden compound floor is 50 ℃-55 ℃, during its persistent fever, belongs to low-temperature condition, can not make wood flooring produce distortion, ftracture and burn.
2, the utility model low temperature heating solid wooden compound floor has adopted electric conduction of carbon fiber paper, and the thermal conversion efficiency of electric conduction of carbon fiber paper can reach 97%, and is more energy-conservation than traditional material.The transmission of electric conduction of carbon fiber paper heat is main with far infrared radiation mainly, but also discharges the far infrared rays light wave of 8 μ m-18 μ m, and hydrone in the activating human body improves oxygen content of blood, strengthens cell viability, improves microcirculation in human body, enhances metabolism.
3, about 6%, it is an isolator to the utility model low temperature heating solid wooden compound floor through the floor base material moisture content of high-temperature shaping.Adding that electric conduction of carbon fiber paper (220V) whole face under general voltage all is the electronics path, current density is minimum, and it combines with the floor base material performance, and human body is had no injury, and is safe in utilization.
Below; To do further explanation through concrete embodiment; Yet embodiment only is giving an example of the optional embodiment of the utility model, and its disclosed characteristic only is used to explain and set forth the technical scheme of the utility model, and is not used in the protection domain that limits the utility model.
Description of drawings
In order better to understand the utility model, the accompanying drawing for your guidance that can quote with reference to this manual, in the accompanying drawing:
Fig. 1 is the structural representation of the heating layer of the utility model low temperature heating solid wooden compound floor.
Fig. 2 is the structural representation of optimal way of the heating layer of the utility model low temperature heating solid wooden compound floor.
Fig. 3 is the structural representation of the following substrate layer of the utility model low temperature heating solid wooden compound floor.
Fig. 4 is the structural representation of the utility model low temperature heating solid wooden compound floor.
Fig. 5 is the terminal structure sketch map of the utility model low temperature heating solid wooden compound floor.
Fig. 6 is the connector structural representation of the utility model low temperature heating solid wooden compound floor.
The specific embodiment
According to the claim and the disclosed content of utility model content of the utility model, the technical scheme of the utility model is specific as follows said.
See also shown in the accompanying drawing 1-accompanying drawing 6, the utility model low temperature heating solid wooden compound floor comprises exterior trim surface layer 1, goes up substrate layer 2, heating layer 3 and down substrate layer 4 stack successively and hot pressing constitutes; Last substrate layer 2, heating layer 3 and after substrate layer 4 hot pressing totally 9 layers down, heating layer 3 is positioned at the 5-7 layer, preferred the 6th layer; The top of heating layer 3 is last substrate layer 2; The below of heating layer 3 is following substrate layer 4, and last substrate layer 2 constitutes by 3 to 5 layers, and following substrate layer 4 constitutes by 4 to 6 layers; Exterior trim surface layer 1 is arranged on the substrate layer 2 through the mode of hot pressing.Exterior trim surface layer 1, last substrate layer 2, heating layer 3 and following substrate layer 4 are strip respectively; Be respectively equipped with a pair of copper-base 31 on the two ends broadside of heating layer 3; And copper-base 31 and heating layer 3 are with wide; Can be covered with pet resin 32 respectively at the tow sides of heating layer 3, pet resin 32 is bonding through the mode and the heating layer 3 of hot pressing.Be provided with one deck fireprotection layer 5 between last substrate layer 2 bottoms and the heating layer 3; Be provided with one deck fireprotection layer 5 between following substrate layer 4 tops and the heating layer 3; Fireprotection layer 5 can adopt melamine impregnated paper, distinguishes hot pressing to this laminate face when substrate layer 2 is with following substrate layer 4 in hot pressing; The bottom of following substrate layer 4 is provided with one deck reflecting layer 41.
Exterior trim surface layer 1 can adopt the conventional surface layer of base plate industries such as oak, teak, seal eggplant wood, Cumaru.
Aluminium foil can be adopted in reflecting layer 41, and the thickness range of aluminium foil is approximately 0.05mm-0.2mm; Reflecting layer 41 is fixed on down the bottom of substrate layer 4 through the mode of hot pressing, and the pressure of hot pressing is approximately 80 tons-150 tons, and hot pressing time was approximately 5 minutes-30 minutes.
The two ends of following substrate layer 4 are respectively equipped with a pair of through hole 42, and the pore diameter range of through hole 42 is about 6mm-12mm; The position of copper-base 31 is corresponding on the position of through hole 42 and the heating layer 3.Following substrate layer 4 is by the orderly crisscross hierarchal arrangement of multilayer bottom plate and be bonded, and base plate can adopt the one or more combination in Liu An, poplar, beech or the import weedtree to form, preferred beech.
Also comprise connector 6 and temperature-sensitive assembly (not shown); Described connector 6 comprises male terminal 61, female terminal 62; Connect male terminal 65, connect female terminal 64 and a pair of connection lead 63; Described connection male terminal 65 is with to be connected female terminal 64 size suitable, and described male terminal 61 is suitable with female terminal 62 sizes, and female terminal 62 is arranged on down in the through hole 42 of substrate layer 4; Contact with the copper-base 31 of heating layer 3; A pair of connection lead 63 is pressed together on the male terminal 61, connect male terminal 65 external another with the connection female terminal in the device, connect female terminal 64 external another with the male terminal in the device; The polylith low temperature of having connected thus heating solid wooden compound floor, connector 6 are the terminal that point connects between the every low temperature heating solid wooden compound floor.The temperature-sensitive assembly is nested with on male terminal 61; The maximum temperature that the temperature-sensitive assembly carries is 55 ℃-65 ℃; The maximum current that carries is 160mA-240mA; When the maximum temperature of low temperature heating solid wooden compound floor base material and electric current reached high-bearing value, the temperature-sensitive assembly can be cut off the electricity supply automatically the generate heat temperature and the electric current of solid wooden compound floor base material of low temperature played a protective role.
The utility model low temperature heating solid wooden compound floor also comprises temperature controller, and temperature controller comprises the compositions such as power switch, temperature control, time control and measurement and control of temperature probe that are connected in parallel on respectively on the connection lead 63.
Foregoing is enumerated for the specific embodiment of the utility model low temperature heating solid wooden compound floor and preparation method thereof, for the wherein not equipment of detailed description and structure, is to be understood that to taking existing common apparatus in this area and universal method to implement.
Claims (4)
1. low temperature heating solid wooden compound floor is characterized in that, comprising: exterior trim surface layer (1), go up substrate layer (2), heating layer (3) and down substrate layer (4) stack and successively hot pressing constitute;
Described substrate layer (2), heating layer (3) and after substrate layer (4) hot pressing totally 9 layers down gone up; Described heating layer (3) is positioned at the 5-7 layer; The top of described heating layer (3) is last substrate layer (2); The below of described heating layer (3) is following substrate layer (4), and the described substrate layer (2) of going up constitutes by 3 to 5 layers, and described substrate layer (4) down constitutes by 4 to 6 layers; Described exterior trim surface layer (1) is arranged on the substrate layer (2) through hot pressing;
Described exterior trim surface layer (1), last substrate layer (2), heating layer (3) and following substrate layer (4) are strip respectively; Be respectively equipped with a pair of copper-base (31) on the two ends broadside of described heating layer (3), and copper-base (31) and heating layer (3) are with wide; Described going up between substrate layer (2) bottom and heating layer (3), following substrate layer (4) top and the heating layer (3) is respectively equipped with one deck fireprotection layer (5); The described bottom of substrate layer (4) down is provided with one deck reflecting layer (41);
The described substrate layer (2) of going up is by the crisscross hierarchal arrangement of multi-layer substrate blockboard and be bonded, and described substrate layer (4) down is by the crisscross hierarchal arrangement of multilayer bottom plate and be bonded.
2. a kind of low temperature heating solid wooden compound floor according to claim 1, it is characterized in that: described heating layer (3) is an electric conduction of carbon fiber paper, and on electric conduction of carbon fiber paper, is provided with a plurality of apertures (33); Described copper-base (31) is pressed to prick by the copper aluminium foil and is formed.
3. a kind of low temperature heating solid wooden compound floor according to claim 1 and 2; It is characterized in that: the two ends of described following substrate layer (4) are respectively equipped with a pair of through hole (42), and the position of through hole (42) is corresponding with the position of the last copper-base (31) of heating layer (3).
4. a kind of low temperature heating solid wooden compound floor according to claim 1 is characterized in that: also comprise connector (6) and temperature-sensitive assembly;
Described connector (6) comprises male terminal (61), female terminal (62); Connect male terminal (65), connect female terminal (64) and a pair of connection lead (63); Described connection male terminal (65) is with to be connected female terminal (64) size suitable; Described male terminal (61) is suitable with female terminal (62) size; Female terminal (62) is arranged on down in the through hole (42) of substrate layer (4), contacts with the copper-base (31) of heating layer (3), and a pair of connection lead (63) is pressed together on the male terminal (61); Connect male terminal (65) external another with the connection female terminal in the device, connect female terminal (64) external another with the connection male terminal in the device; The temperature-sensitive assembly is arranged on the male terminal (61).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120234122U CN202148674U (en) | 2011-07-05 | 2011-07-05 | Low temperature heating solid composite floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120234122U CN202148674U (en) | 2011-07-05 | 2011-07-05 | Low temperature heating solid composite floor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202148674U true CN202148674U (en) | 2012-02-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120234122U Expired - Fee Related CN202148674U (en) | 2011-07-05 | 2011-07-05 | Low temperature heating solid composite floor |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102312545A (en) * | 2011-07-05 | 2012-01-11 | 上海热丽电热材料有限公司 | Low-temperature heating solid wood composite floor and preparation method thereof |
| CN103696556A (en) * | 2013-12-31 | 2014-04-02 | 徐州中原木业有限公司 | Inorganic nano-silver-ion parquet and production method thereof |
| CN104213694A (en) * | 2014-09-05 | 2014-12-17 | 德清创诺尔新材料科技有限公司 | Wood floor capable of heating and supplying heat |
| CN107288311A (en) * | 2017-08-02 | 2017-10-24 | 德华兔宝宝装饰新材股份有限公司 | A kind of solid wood is combined self-heating floor |
-
2011
- 2011-07-05 CN CN201120234122U patent/CN202148674U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102312545A (en) * | 2011-07-05 | 2012-01-11 | 上海热丽电热材料有限公司 | Low-temperature heating solid wood composite floor and preparation method thereof |
| CN102312545B (en) * | 2011-07-05 | 2013-12-11 | 上海热丽电热材料有限公司 | Low-temperature heating solid wood composite floor and preparation method thereof |
| US8866048B2 (en) | 2011-07-05 | 2014-10-21 | Shanghai Rell Electric Heating Systems Co., Ltd | Low-temperature heat-generating solid wood laminate floor and preparation method thereof |
| CN103696556A (en) * | 2013-12-31 | 2014-04-02 | 徐州中原木业有限公司 | Inorganic nano-silver-ion parquet and production method thereof |
| CN104213694A (en) * | 2014-09-05 | 2014-12-17 | 德清创诺尔新材料科技有限公司 | Wood floor capable of heating and supplying heat |
| CN107288311A (en) * | 2017-08-02 | 2017-10-24 | 德华兔宝宝装饰新材股份有限公司 | A kind of solid wood is combined self-heating floor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Sun Bing Inventor after: Zhang Yuming Inventor before: Quan Juncheng |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: QUAN JUNCHENG TO: SUN BING ZHANG YUMING |
|
| C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI RELI TECHNOLOGY GROUP CO., LTD. Free format text: FORMER NAME: KOREA ELECTRIC MATERIAL CO., LTD. SHANGHAI HEAT |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Jinshan District Wei Chang Road 200120 Shanghai City No. 251, building third, first Patentee after: The Shanghai beautiful scientific and technological Group Co., Ltd of heat Address before: Jinshan District Wei Chang Road 200120 Shanghai City No. 251, building third, first Patentee before: Shanghai Reli Electric Heating Material Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120222 Termination date: 20200705 |