CN202133323U - High heat-radiation diaphragm of interactive fin structure - Google Patents
High heat-radiation diaphragm of interactive fin structure Download PDFInfo
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- CN202133323U CN202133323U CN201020685511U CN201020685511U CN202133323U CN 202133323 U CN202133323 U CN 202133323U CN 201020685511 U CN201020685511 U CN 201020685511U CN 201020685511 U CN201020685511 U CN 201020685511U CN 202133323 U CN202133323 U CN 202133323U
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- high heat
- diaphragm
- heat radiation
- fin
- fin structure
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Abstract
The utility model provides a high heat-radiation diaphragm of interactive fin structure, which belongs to the technical field of high heat-radiation materials. The high heat-radiation diaphragm comprises a substrate high heat-radiation diaphragm and a fin-shaped high heat-radiation diaphragm adhering to the substrate high heat-radiation diaphragm. With the arrangement of the substrate high heat-radiation diaphragm and the fin-shaped high heat-radiation diaphragm, the high heat-radiation diaphragm of interactive fin structure can greatly increase heat-radiation area and achieve the aim of efficient heat radiation.
Description
Technical field
The utility model belongs to high heat sink material technical field.
Background technology
Numerous areas such as electronic product, machinery, electric power, communication, chemical industry in the process of the processing of product, production, and in the process of using, all can produce the different heat of quantity.And, if the heat that is produced can not effectively be distributed, then can all might impact the processing and the use of product.
Be widely used at present various heat sink materials are arranged.Dissimilar heat sink materials can have different performances.Such as the heat conductivility of metal material is good, wherein a part of metal material particularly, and like copper, aluminium, silver etc., its heat conductivility is especially good.Such as, the radiator of copper radiator, aluminium matter is all used very general.
Enumerate the thermal conductivity performance of some heat sink materials commonly used below:
Aluminium: 237W/mK;
Copper: 401W/mK;
Silver: 420W/mK;
Gold: 318W/mK.
Because price factor, most radiators of current use adopt copper material or aluminum material to make; But some special places are arranged, also use silver or golden material, come as heat sink material.The shape of radiator and structure, size etc. have difference mutually based on different application scenarios.Such as, various CUP go up the radiator that uses, and the radiator that uses on the circuit board, are the radiating element with waveform heat radiation groove mostly.
And in the utility model, can be applied to membrane material with high heat dispersion.
Wherein, utilize the height heat radiation graphite film of carbon component made, have very high heat-sinking capability, can reach: 1500～1750W/mK.
And, then having more powerful heat-sinking capability at present as the grapheme material of research focus, its thermal conductivity is about 5000W/mK.
The membrane material of high rate of heat dissipation like this is the radiating equipment in the various products, and new selection is provided.
Existing Graphene is that film thickness is monatomic, and thickness has influenced the performance of its heat conductivility as thin as a wafer to a certain extent.
The utility model is hoped for addressing this problem a kind of scheme that provides.
The utility model content
The purpose of the utility model is to provide the high heat radiation of a kind of mutual fin structure type diaphragm, and this height heat radiation diaphragm improves radiating efficiency through improving area of dissipation.
The described a kind of mutual fin structure type height of the utility model dispels the heat diaphragm by the high heat radiation of substrate diaphragm, and forms attached to the fin-shaped height heat radiation diaphragm two parts on the high diaphragm that dispels the heat of substrate.
Preferably, described high heat dissipation film is height heat radiation graphite film and graphene film one of which at least.
Preferably, described high heat radiation graphite film, thickness is between the 1-300 micron.
Preferably, the high heat radiation of described fin-shaped diaphragm is strip, and length is 0.1cm～10cm.
Preferably, the high heat radiation of described fin-shaped diaphragm is arranged with the form of mutual array on the high heat radiation of substrate diaphragm, forms mutual fin structure.
Preferably, the high heat radiation of described substrate diaphragm adopts graphene film, and the high heat radiation of fin-shaped diaphragm is high heat radiation graphite film.
The advantage of the utility model is:
Through the high heat radiation of substrate diaphragm, and, can increase considerably area of dissipation, thereby realize the purpose of high efficiency and heat radiation attached to the high heat radiation of the fin-shaped diaphragm on the high heat radiation of the substrate diaphragm.
Description of drawings
Below in conjunction with accompanying drawing the utility model is explained in more detail.
Fig. 1-1 is respectively the finished product sketch map of being produced to the two kinds of different high heat radiation of mutual fin structure type diaphragm manufactures with Fig. 1-2.
Fig. 2-1 is respectively the product longitudinal section sketch map of being produced to the two kinds of different high heat radiation of mutual fin structure type diaphragm manufactures with Fig. 2-2.
Fig. 3-1 and Fig. 3-2 shown the idiographic flow of two kinds of distinct methods that prepare the high heat radiation of mutual fin structure type diaphragm respectively.
The specific embodiment
With reference to the accompanying drawings, in conjunction with specific embodiments the utility model is made further description.
With shown in Fig. 1-2, they are respectively the finished product sketch map of being produced to the two kinds of different high heat radiation of mutual fin structure type diaphragm manufactures like Fig. 1-1.
Mode one in the manufacturing approach of Fig. 1-1 correspondence through pressing mode, is dispelled the heat diaphragm 200 with the 100 fusion moulding of the high heat radiation of substrate diaphragm with the fin-shaped height.
Can find out that by Fig. 1-1 described a kind of mutual fin structure type height dispels the heat diaphragm by the high heat radiation of substrate diaphragm 100, and form attached to fin-shaped height heat radiation diaphragm 200 two parts on the high diaphragm 100 that dispels the heat of substrate.
The high heat radiation of fin-shaped diaphragm 200 is arranged with the form of mutual array on the high heat radiation of substrate diaphragm 100, forms mutual fin structure.
The high heat radiation of fin-shaped diaphragm 200 directly contacts with the high heat radiation of substrate diaphragm 100, does not have other supplementary elements.
Mode two in the manufacturing approach of Fig. 1-2 correspondence is utilized adhesive, and the high heat radiation of fin-shaped diaphragm 200 is adhesion-molded with the high heat radiation of substrate diaphragm 100.
Can find out that by Fig. 1-2 described a kind of mutual fin structure type height dispels the heat diaphragm by the high heat radiation of substrate diaphragm 100, and form attached to fin-shaped height heat radiation diaphragm 200 two parts on the high diaphragm 100 that dispels the heat of substrate.In addition, with the high heat radiation of fin-shaped diaphragm 200 contacted positions auxiliary the two fixing adhesive 300 of moulding is arranged at the high heat radiation of substrate diaphragm 100.
The high heat radiation of fin-shaped diaphragm 200 is arranged with the form of mutual array on the high heat radiation of substrate diaphragm 100, forms mutual fin structure.
Shown in ginseng Fig. 2-1 and Fig. 2-2, they are respectively the product longitudinal section sketch map of being produced to the two kinds of different high heat radiation of mutual fin structure type diaphragm manufactures.
Mode one in the manufacturing approach of Fig. 2-1 correspondence through pressing mode, is dispelled the heat diaphragm 200 with the 100 fusion moulding of the high heat radiation of substrate diaphragm with the fin-shaped height.
Can find out that by Fig. 2-1 the high heat radiation of the fin-shaped diaphragm 200 of forming the high heat radiation of described a kind of mutual fin structure type diaphragm directly contacts with the high heat radiation of substrate diaphragm 100, does not have other supplementary elements.
Mode two in the manufacturing approach of Fig. 2-2 correspondence is utilized adhesive, and the high heat radiation of fin-shaped diaphragm 200 is adhesion-molded with the high heat radiation of substrate diaphragm 100.
Can find out by Fig. 2-2, the high heat radiation of the fin-shaped diaphragm 200 of forming the high heat radiation of described a kind of mutual fin structure type diaphragm with the high heat radiation of substrate diaphragm 100 through adhesive 300 moulding that is adhesively fixed.
Shown in ginseng Fig. 3-1 and Fig. 3-2, they have shown the idiographic flow of two kinds of distinct methods that prepare the high heat radiation of mutual fin structure type diaphragm respectively.
Description and specific embodiment below in conjunction with the front are elaborated to it respectively.
Mode one includes following steps:
Step 1 prepares the independently high heat radiation of fin-shaped diaphragm.
The high heat radiation of described fin-shaped diaphragm 200 has very high heat-sinking capability for the height heat radiation graphite film of carbon component made is arranged, and thermal conductivity can reach: 1500～1750W/mK.
Mode through cutting prepares the independently high heat radiation of fin-shaped diaphragm 200, and the high heat radiation of the fin-shaped after processing diaphragm 200 is a strip, and length is 0.1cm～10cm, and thickness is between the 1-300 micron.
Step 2 through pressing mode, is fused into type with the high heat radiation of fin-shaped diaphragm with the high heat radiation of substrate diaphragm.
The high heat radiation of described substrate diaphragm 100 is a graphene film, has more powerful heat-sinking capability, and its thermal conductivity is about 5000W/mK.
Through pressing mode, when pressure make the high heat radiation of fin-shaped diaphragm 200 with the surface atom of the high heat radiation of substrate diaphragm 100 contacts enough near the time because the effect of molecular separating force makes the high heat radiation of fin-shaped diaphragm 200 merge moulding with the high heat radiation of substrate diaphragm 100.
The high heat radiation of fin-shaped diaphragm 200 is arranged with the form of mutual array on the high heat radiation of substrate diaphragm 100, forms mutual fin structure.
The high heat radiation of the fin-shaped of arranging alternately diaphragm 200 has increased the area of dissipation of the high heat radiation of substrate diaphragm 100, the more effective radiating efficiency that improved.
Mode two includes following steps:
Step 1 prepares the independently high heat radiation of fin-shaped diaphragm.
The high heat radiation of described fin-shaped diaphragm 200 has very high heat-sinking capability for the height heat radiation graphite film of carbon component made is arranged, and thermal conductivity can reach: 1500～1750W/mK.
Mode through cutting prepares the independently high heat radiation of fin-shaped diaphragm 200, and the high heat radiation of the fin-shaped after processing diaphragm 200 is a strip, and length is 0.1cm～10cm, and thickness is between the 1-300 micron.
Step 2 is utilized adhesive, and the high heat radiation of fin-shaped diaphragm is adhesion-molded with the high heat radiation of substrate diaphragm.
The high heat radiation of described substrate diaphragm 100 is a graphene film, has more powerful heat-sinking capability, and its thermal conductivity is about 5000W/mK.
Described adhesive 300, for metal-to-metal adhesive, carbon back adhesive or other kind adhesive one of them.When described adhesive is metal,, be to be heated to metal molten, solidify the back at it and realize adhesive attraction in order to realize bonding mode.
In addition, described carbon back adhesive is high temperature shift to be the carbonaceous material of graphite.
The high heat radiation of fin-shaped diaphragm 200 is arranged with the form of mutual array on the high heat radiation of substrate diaphragm 100, forms mutual fin structure.
The high heat radiation of the fin-shaped of arranging alternately diaphragm 200 has increased the area of dissipation of the high heat radiation of substrate diaphragm 100, the more effective radiating efficiency that improved.
More than be to the description of the utility model and non-limiting, based on other embodiment of the utility model thought, all among the protection domain of the utility model.
Claims (5)
1. the high heat radiation of mutual fin structure type diaphragm, it is characterized in that: this height heat radiation diaphragm includes the high heat radiation of substrate diaphragm, and attached to the high heat radiation of the fin-shaped diaphragm on the high heat radiation of the substrate diaphragm.
2. the high heat radiation of a kind of mutual fin structure type according to claim 1 diaphragm is characterized in that: described high heat radiation graphite film, thickness is between the 1-300 micron.
3. the high heat radiation of a kind of mutual fin structure type according to claim 1 diaphragm is characterized in that: the high heat radiation of described fin-shaped diaphragm, be strip, and length is 0.1cm～10cm.
4. the high heat radiation of a kind of mutual fin structure type according to claim 1 diaphragm, it is characterized in that: the high heat radiation of described fin-shaped diaphragm is arranged with the form of mutual array on the high heat radiation of substrate diaphragm, forms mutual fin structure.
5. the high heat radiation of a kind of mutual fin structure type according to claim 1 diaphragm, it is characterized in that: the high heat radiation of described substrate diaphragm adopts graphene film, and the high heat radiation of fin-shaped diaphragm is high heat radiation graphite film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020685511U CN202133323U (en) | 2010-12-28 | 2010-12-28 | High heat-radiation diaphragm of interactive fin structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020685511U CN202133323U (en) | 2010-12-28 | 2010-12-28 | High heat-radiation diaphragm of interactive fin structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202133323U true CN202133323U (en) | 2012-02-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020685511U Expired - Fee Related CN202133323U (en) | 2010-12-28 | 2010-12-28 | High heat-radiation diaphragm of interactive fin structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202133323U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102555311A (en) * | 2010-12-28 | 2012-07-11 | 常州碳元科技发展有限公司 | Interactive fin structure type high heat dissipation membrane and manufacturing method thereof |
-
2010
- 2010-12-28 CN CN201020685511U patent/CN202133323U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102555311A (en) * | 2010-12-28 | 2012-07-11 | 常州碳元科技发展有限公司 | Interactive fin structure type high heat dissipation membrane and manufacturing method thereof |
| CN102555311B (en) * | 2010-12-28 | 2015-06-17 | 碳元科技股份有限公司 | Interactive fin structure type high heat dissipation membrane and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: TANYUAN SCIENCE AND TECHNOLOGY CO., LTD. Free format text: FORMER NAME: JIANGSU TANYUAN TECHNOLOGY CO., LTD Owner name: JIANGSU TANYUAN TECHNOLOGY CO., LTD Free format text: FORMER NAME: CHANGZHOU TANYUAN TECHNOLOGY DEVELOPMENT CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 213149 Jiangsu city of Changzhou province Wujin Dragon Road Economic Development Zone No. 2 Patentee after: TANYUAN TECHNOLOGY Co.,Ltd. Address before: 213149 Jiangsu city of Changzhou province Wujin Dragon Road Economic Development Zone No. 2 Patentee before: Jiangsu carbon dollar Polytron Technologies Inc. Address after: 213149 Jiangsu city of Changzhou province Wujin Dragon Road Economic Development Zone No. 2 Patentee after: Jiangsu carbon dollar Polytron Technologies Inc. Address before: 213149 Jiangsu city of Changzhou province Wujin Dragon Road Economic Development Zone No. 2 Patentee before: CHANGZHOU TANYUAN TECHNOLOGY DEVELOPMENT Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120201 Termination date: 20181228 |