CN202121859U - High reflecting mirror surface blind cup groove printed circuit board - Google Patents
High reflecting mirror surface blind cup groove printed circuit board Download PDFInfo
- Publication number
- CN202121859U CN202121859U CN2011201906161U CN201120190616U CN202121859U CN 202121859 U CN202121859 U CN 202121859U CN 2011201906161 U CN2011201906161 U CN 2011201906161U CN 201120190616 U CN201120190616 U CN 201120190616U CN 202121859 U CN202121859 U CN 202121859U
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- printed circuit
- circuit board
- pcb
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- blind cup
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Abstract
Provided is a high reflecting mirror surface blind cup groove printed circuit board, comprising a regular printed circuit board provided with a plurality of through holes and a metal layer arranged upon one bottom surface of the regular printed circuit board, wherein the metal layer comprises a metal bottom layer and a metal mirror surface layer which covers one surface of the metal bottom layer facing towards the regular printed circuit board; the other bottom surface of the regular printed circuit board is provided with a copper layer line; and the through holes of the regular printed circuit board and the metal mirror surface layer form a plurality of blind cup grooves used for installing LED illuminants. The utility model combines the printed circuit board utilizing the prior art with the metal mirror surface layer having high reflectivity. LED illuminants are arranged in every blind cup groove and the light emitted by the LED illuminants is reflected via the metal mirror surface layer at the bottom of the blind cup grooves. The LED of low power can be adopted, which can meet the demand for high brightness and save energy. Moreover, the heat radiation problem resulting from large power LED can also be avoided. The stability and reliability of the whole printed circuit board are also improved.
Description
Technical field
The utility model relates to the printed-board technology field, especially a kind of printed circuit board (PCB) with a plurality of LED luminous elements of installing of high reflection mirror face or led chip.
Background technology
(Printed Circuit Board PCB) is one of the vitals of electronics industry to printed circuit board (PCB).PCB can provide mechanical support fixing, assembling for electronic component, can realize being electrically connected between the electronic component.In addition, PCB is last all to be printed on the numbering and some figures of element, and this is that element plug-in mounting, inspection, maintenance provide convenience.Every kind of electronic equipment almost arrives computer, communication electronic equipment, military armament systems greatly to electronic watch, calculator for a short time, as long as electronic component such as integrated circuit is arranged, for the electric interconnection between them, all will use printed circuit board (PCB).
The LED lamp is as the new type light source that grew up in the last few years; Because it has the advantage that the significant life-span is long, luminance is big than conventional light source such as incandescent lamp, fluorescent lamp, halide lamps; In various fields, for example fields such as railways and mineies lamp, display etc., car light have obtained using widely.
Combining of a plurality of led light sources and printed circuit board (PCB) is the developing direction in electronic product field.But traditional printed circuit board (PCB); Its surface that led light source is installed is the surface of insulating layer that is covered with circuit; Circuit has several kinds on gold-plated circuit, copper layer line road, spray solder road etc., and the light of led light source is emitted to printed circuit board surface, and the light that only is emitted to the circuit surface can be reflected; And the reflectivity of gold, copper, tin is respectively 65%, 50%, 35%, and the light of a large portion does not obtain usable reflection and utilization.
For energy savings, improve the light utilization efficiency of led light source, be necessary to provide a kind of novel printed circuit board that can the light usable reflection of led light source emission be utilized.
The utility model content
To the deficiency of above existing printed circuit board (PCB), the purpose of the utility model provides the blind cup of a kind of high reflection mirror face groove printed circuit board (PCB).
The purpose of the utility model realizes through adopting following technical scheme:
The blind cup of a kind of high reflection mirror face groove printed circuit board (PCB); It is characterized in that; Comprise that one is provided with the conventional printed circuit board (PCB) and the metal level that is arranged at this routine printed circuit board (PCB) one bottom surface of a plurality of through holes; This metal level comprise a metal back layer and be overlying on this metal back layer towards conventional printed circuit board (PCB) one the surface the speculum surface layer; Another bottom surface of said conventional printed circuit board (PCB) is provided with copper layer line road, and a plurality of through holes of this routine printed circuit board (PCB) and this speculum surface layer constitute a plurality of blind cup grooves that are used to install the LED luminous element.
As the utility model optimized technical scheme, said copper layer line road comprises the LED luminous element pin installation circuit of the relative both sides that are arranged at each blind cup groove.
As the utility model optimized technical scheme, said conventional printed circuit board (PCB) is individual layer, bilayer or multilayer printed circuit board.
As the utility model optimized technical scheme, said conventional printed circuit board (PCB) is individual layer, bilayer or multi-layer flexible printed circuit board (PCB).
As the utility model optimized technical scheme, bonding between said conventional printed circuit board (PCB) and the metal level through prepreg.
As the utility model optimized technical scheme, said conventional through-holes of printed circuit boards shape can be shapes such as circle, rectangle, trapezoidal, ellipse.
As the utility model optimized technical scheme, said metal level aluminium lamination, nickel dam, chromium layer or silver layer.
As the utility model optimized technical scheme, said speculum surface layer is a silver layer.
As the utility model optimized technical scheme, said metal layer thickness is 0.3-1.5mm.
With respect to prior art; The utility model combines the printed circuit board (PCB) of prior art with the speculum surface layer with high reflectance, in each blind cup groove, the LED luminous element is set, the speculum surface layer reflection of the light ignorant of the economics cup trench bottom of LED luminous element emission; Improved the luminous efficiency of whole printed circuit board (PCB) greatly; The LED of lower-wattage can be adopted, the higher brightness requirement can be satisfied, energy savings; The heat dissipation problem of also having avoided high-power LED to bring has improved the stability and the reliability of whole printed circuit board (PCB).
Description of drawings
Below in conjunction with accompanying drawing and specific embodiment the utility model is described further:
Fig. 1 is first kind of execution mode generalized section of the utility model.
Embodiment
Embodiment one:
As shown in Figure 1; The blind cup of this high reflection mirror face groove printed circuit board (PCB) comprises a conventional printed circuit board (PCB) and a metal level 10 of range upon range of setting; This routine printed circuit board (PCB) is a metal base printed circuit board; This metal base printed circuit board comprises the metal substrate 30 and a high heat conductive insulating substrate 40 of a range upon range of setting; These insulated substrate 40 another bottom surfaces are provided with copper layer line road 50, and this metal level 10 comprises a metal back layer 11 and be overlying on the speculum surface layer 12 of these metal back layer 11 1 bottom surfaces that another underrun insulation adhesive layer 20 of metal substrate 30 is bonding with this speculum surface layer 12.Be provided with a plurality of through holes in the conventional printed circuit board (PCB); Each through hole and speculum surface layer 12 constitute a blind cup groove 60; Said copper layer line road 50 comprises the LED luminous element pin circuit of the relative both sides that are arranged at each blind cup groove 60 respectively, in each blind cup groove 60 a LED luminous element (scheming always not shown) is installed.
This speculum surface layer 12 is for having the silver lustre layer of high reflectance, and the reflectivity of said speculum surface layer 12 is 85%-98%.
Embodiment two:
The structural similarity of structure and embodiment one; Difference is: folding the conventional printed circuit board (PCB) that is provided with layer by layer with metallic mirror surface is individual layer insulation base printed circuit board; This individual layer insulation base printed circuit board comprises an insulated substrate and is arranged at the copper layer line road on insulated substrate one surface, and its another surface is bonding through insulation adhesive layer and this metal level.
Embodiment three:
The structural similarity of structure and embodiment one; Difference is: with the conventional printed circuit board (PCB) of the range upon range of setting of metal level be the double-layer printing circuit board or the multilayer board of hole metallization; Two-sided or the multilayer board of this hole metallization comprises staggered a plurality of copper wire layer and the one or more insulating barrier that overlaps together, and adopts plated-through hole to realize interconnection between the different copper wire layer.Conventional printed circuit board (PCB) one underrun insulation adhesive layer and metal level are bonding, and another bottom surface is provided with the copper layer line road that led light source can be installed.
In above-mentioned each execution mode, said metal back layer can be metal materials such as nickel, chromium, silver, aluminium, and said speculum surface layer 12 is a silver layer, and it can be overlying on the metal back layer through plating mode.Whole metal layer thickness scope is 0.3-1.5mm.
The utility model is not limited to above-mentioned execution mode; Printed circuit board (PCB) with following structure all belongs to the utility model protection range: the metal level that a surface is covered with the high reflecting metal specular layer is pasted in the bottom surface that is provided with the conventional printed circuit board (PCB) of a plurality of through holes; A plurality of through holes and speculum surface layer form a plurality of blind cup grooves; In each blind cup groove one or several light-emitting diodes are installed, the pin of light-emitting diode is connected on the copper wire of blind cup groove both sides.Conventional printed circuit board (PCB) is to can be rigidity, flexible individual layer, bilayer or multilayer board, or the flexible print wiring board of the printed circuit board of individual layer, bilayer or multilayer and individual layer, bilayer or multilayer combine just/flexible print wiring board.
Insulation adhesive layer between conventional printed circuit board (PCB) and the metal level is a prepreg.
Conventional through-holes of printed circuit boards shape can be shapes such as circle, rectangle, trapezoidal, ellipse.
Claims (8)
1. the blind cup of high reflection mirror face groove printed circuit board (PCB); It is characterized in that; Comprise that one is provided with the conventional printed circuit board (PCB) and the metal level that is arranged at this routine printed circuit board (PCB) one bottom surface of a plurality of through holes; This metal level comprise a metal back layer and be overlying on this metal back layer towards conventional printed circuit board (PCB) one the surface the speculum surface layer; Another bottom surface of said conventional printed circuit board (PCB) is provided with copper layer line road, and a plurality of through holes of this routine printed circuit board (PCB) and this speculum surface layer constitute a plurality of blind cup grooves that are used to install the LED luminous element.
2. the blind cup of high reflection mirror face according to claim 1 groove printed circuit board (PCB) is characterized in that said copper layer line road comprises the LED luminous element pin circuit of the relative both sides that are arranged at each blind cup groove.
3. the blind cup of high reflection mirror face according to claim 1 groove printed circuit board (PCB) is characterized in that said conventional printed circuit board (PCB) is individual layer, bilayer or multilayer printed circuit board.
4. the blind cup of high reflection mirror face according to claim 1 groove printed circuit board (PCB) is characterized in that said conventional printed circuit board (PCB) is individual layer, bilayer or multi-layer flexible printed circuit board (PCB).
5. the blind cup of high reflection mirror face according to claim 1 groove printed circuit board (PCB) is characterized in that said speculum surface layer is a silver layer.
6. the blind cup of high reflection mirror face according to claim 1 groove printed circuit board (PCB) is characterized in that said metal back layer is aluminium lamination, nickel dam, chromium layer or silver layer.
7. the blind cup of high reflection mirror face according to claim 1 groove printed circuit board (PCB) is characterized in that, said conventional through-holes of printed circuit boards is shaped as shapes such as circle, rectangle, trapezoidal, ellipse
The blind cup of high reflection mirror face according to claim 1 groove printed circuit board (PCB) is characterized in that said conventional printed circuit board (PCB) and metal level are bonding through prepreg.
8. the blind cup of high reflection mirror face according to claim 1 groove printed circuit board (PCB) is characterized in that said metal layer thickness is 0.3-1.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201906161U CN202121859U (en) | 2011-06-08 | 2011-06-08 | High reflecting mirror surface blind cup groove printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201906161U CN202121859U (en) | 2011-06-08 | 2011-06-08 | High reflecting mirror surface blind cup groove printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202121859U true CN202121859U (en) | 2012-01-18 |
Family
ID=45462893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201906161U Expired - Fee Related CN202121859U (en) | 2011-06-08 | 2011-06-08 | High reflecting mirror surface blind cup groove printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202121859U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102227156A (en) * | 2011-06-08 | 2011-10-26 | 乐健线路板（珠海）有限公司 | High reflection mirror MCPCB (printed circuit board) and preparation method thereof |
| CN108112166A (en) * | 2017-12-07 | 2018-06-01 | 何莉莉 | A kind of printed circuit board (PCB) for electronic console LED illuminator |
-
2011
- 2011-06-08 CN CN2011201906161U patent/CN202121859U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102227156A (en) * | 2011-06-08 | 2011-10-26 | 乐健线路板（珠海）有限公司 | High reflection mirror MCPCB (printed circuit board) and preparation method thereof |
| CN102227156B (en) * | 2011-06-08 | 2014-10-08 | 乐健科技（珠海）有限公司 | High reflection mirror MCPCB (printed circuit board) and preparation method thereof |
| CN108112166A (en) * | 2017-12-07 | 2018-06-01 | 何莉莉 | A kind of printed circuit board (PCB) for electronic console LED illuminator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: RAYBEN TECHNOLOGY (ZHUHAI) CO., LTD. Free format text: FORMER NAME: LEJIAN CIRCUIT BOARD (ZHUHAI) CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Doumen Xinqing Technology Industrial Park West District Po Road 519180 Guangdong city of Zhuhai province No. 8 Patentee after: Lejian Technology (Zhuhai) Co., Ltd. Address before: Doumen Xinqing Technology Industrial Park West District Po Road 519180 Guangdong city of Zhuhai province No. 8 Patentee before: Happy circuit board (Zhuhai) Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120118 Termination date: 20190608 |