CN202120894U - Double heat exchange device - Google Patents

Double heat exchange device Download PDF

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Publication number
CN202120894U
CN202120894U CN2011202606215U CN201120260621U CN202120894U CN 202120894 U CN202120894 U CN 202120894U CN 2011202606215 U CN2011202606215 U CN 2011202606215U CN 201120260621 U CN201120260621 U CN 201120260621U CN 202120894 U CN202120894 U CN 202120894U
Authority
CN
China
Prior art keywords
heat
radiating
heat transfer
radiating block
exchange device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011202606215U
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Chinese (zh)
Inventor
陈林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THERMAL GROUP TECHNOLOGY (HUIZHOU) Co Ltd
Original Assignee
THERMAL GROUP TECHNOLOGY (HUIZHOU) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THERMAL GROUP TECHNOLOGY (HUIZHOU) Co Ltd filed Critical THERMAL GROUP TECHNOLOGY (HUIZHOU) Co Ltd
Priority to CN2011202606215U priority Critical patent/CN202120894U/en
Application granted granted Critical
Publication of CN202120894U publication Critical patent/CN202120894U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

A double heat exchange device comprises a heat transfer base. A radiating block is fixed on one face of the heat transfer base, a convex plate in direct contact with a heating source is disposed on the other face of the heat transfer base, a heat transfer tube is connected between the radiating block and the heat transfer base, the radiating block which is a liquid cooled radiating block comprises a heat transfer block and a seal cover, and the heat transfer block and the seal cover hermetically form a closed container. Radiating via the radiating plate and radiating via liquid heat transfer are adopted for the double heat exchange device, so that radiating efficiency is greatly improved, the defect of noise of the existing fan cooling is overcome, and accordingly service lives of electronic devices are greatly improved.

Description

A kind of dual heat-exchange device
Technical field
The utility model relates to a kind of heat abstractor improvement technology of electronic device.
Background technology
The radiating mode of existing common electronics device generally adopts the mutual collocation of heat-conducting block, fin and fan to dispel the heat; But this radiator structure is difficult to reach the heat radiation requirement for some high heat-generating electronic parts; And the noise of fan is also bigger, makes its use occasion receive restriction.
The utility model content
The technical problem that the utility model will solve provides a kind of dual heat-exchange device of good heat dissipation effect.
In order to solve the problems of the technologies described above, the utility model adopts following mode to realize:
A kind of dual heat-exchange device; Comprise heat-conducting base; The boss that simultaneously be fixed with radiating block at heat-conducting base, another side is provided with directly to be contacted with pyrotoxin; Between radiating block and heat-conducting base, be connected with heat pipe, described radiating block is the liquid cools radiating block, and radiating block comprises heat carrier and seals the seal cover that forms closed container with heat carrier.
As the improvement to such scheme, heat carrier is provided with in order to placing the conduit and a storage tank of heat pipe, and a side of seal cover is provided with the cooling fluid inlet and to cooling liquid outlet, cooling fluid inlet and be communicated with storage tank to cooling liquid outlet.
As the further improvement to such scheme, heat-conducting base is provided with the fin of distribute heat.
Compared with prior art, the utlity model has following advantage:
The utility model has adopted fin and two kinds of radiating modes of liquid thermal conductivity heat radiation to dispel the heat, and greatly improve radiating efficiency, and eliminated the noise defective of existing fan heat radiation, and then the useful life of having improved electronic device greatly.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is wherein structural representation of the utility model heat-conducting base;
Fig. 3 is the structural representation of the utility model heat-conducting base another side;
Fig. 4 is heat-conducting base structural representation wherein of the utility model radiating block;
Fig. 5 is the heat-conducting base another side structural representation of the utility model radiating block;
Fig. 6 is seal cover structural representation wherein of the utility model radiating block;
Fig. 7 is the seal cover another side structural representation of the utility model radiating block;
Fig. 8 is the utility model user mode structural representation.
Embodiment
Below will combine accompanying drawing and specific embodiment that the utility model is carried out more detailed description for the ease of it will be appreciated by those skilled in the art that:
Shown in Fig. 1-6, the dual heat-exchange device that present embodiment discloses comprises heat-conducting base 1, is installed on the heat pipe 3 of radiating block 2, heat absorbing end 312 and radiating end 311 difference connection cooling block 2 and heat-conducting base 1 on the heat-conducting base 1.Heat-conducting base 1 is provided with boss 11, and the surface of this boss 1 contacts a pyrotoxin 42, also is provided with one in order to place radiating block 2 and fixing with it hole 12.Described radiating block 2 is the liquid cools radiating block, comprises heat carrier 22 and seals the seal cover 23 that forms closed containers with heat carrier 22.Heat carrier 22 is provided with one in order to place the conduit 221 and a storage tank 222 of heat pipe 31.One side of described seal cover 23 is provided with 232 outlets of cooling fluid inlet 231 and one cooling fluid, and on the communication seals lid storage tank 233, described seal cover storage tank 233 is provided with one in order to force the boss 2331 of current deflecting.
When the integrated circuit board that the electronic device pyrotoxin is housed 4 is in running order; The pyrotoxin 41 of integrated circuit board 4 produces great amount of heat with pyrotoxin 42; Pyrotoxin 41 and pyrotoxin 42 are through contacting boss 11 and heat carrier 12; Heat is passed to the radiating block 2 on heat-conducting base 1 and the heat-conducting base 1 respectively, and through the fin 13 on the heat-conducting base 1 and heat pipe that is connected with heating panel 2 31 and heat pipe 32 heat radiations.Heat pipe 31 passes to part energy through radiating end 311 one side of integrated circuit board 4; And the part of the heat that radiating block 2 absorbs gets into storage tank 233 with seal cover 23 from cooling fluid inlet 231 through being positioned at heat carrier 22; And leave with the heat that radiating block 2 is absorbed, thereby reach purpose of design by being used for cooling fluid being flowed out from cooling liquid outlet 232 with existing of the projection 2331 of forcing current deflecting.
The foregoing description is merely the preferred embodiments of the utility model, need to prove, has other conspicuous variations down based on this design, and these variations are all within the claim protection range of the utility model.

Claims (3)

1. dual heat-exchange device; Comprise heat-conducting base (1); The boss (11) that simultaneously be fixed with radiating block (2) at heat-conducting base, another side is provided with directly to be contacted with pyrotoxin; Between radiating block and heat-conducting base, be connected with heat pipe (3), it is characterized in that: described radiating block is the liquid cools radiating block, and radiating block comprises heat carrier (22) and seals the seal cover (23) that forms closed container with heat carrier.
2. dual heat-exchange device according to claim 1; It is characterized in that: heat carrier is provided with in order to place the conduit (221) and a storage tank (222) of heat pipe; One side of seal cover is provided with cooling fluid inlet (231) and to cooling liquid outlet (232), cooling fluid inlet and be communicated with storage tank to cooling liquid outlet.
3. dual heat-exchange device according to claim 1 and 2 is characterized in that: heat-conducting base is provided with the fin (13) of distribute heat.
CN2011202606215U 2011-07-22 2011-07-22 Double heat exchange device Expired - Fee Related CN202120894U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011202606215U CN202120894U (en) 2011-07-22 2011-07-22 Double heat exchange device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011202606215U CN202120894U (en) 2011-07-22 2011-07-22 Double heat exchange device

Publications (1)

Publication Number Publication Date
CN202120894U true CN202120894U (en) 2012-01-18

Family

ID=45461935

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011202606215U Expired - Fee Related CN202120894U (en) 2011-07-22 2011-07-22 Double heat exchange device

Country Status (1)

Country Link
CN (1) CN202120894U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104615215A (en) * 2013-11-01 2015-05-13 惠州智科实业有限公司 Heat dissipation structure for computer processor
CN113677161A (en) * 2021-08-23 2021-11-19 北京无线电测量研究所 Electronic device structure and contain its electron plug-in components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104615215A (en) * 2013-11-01 2015-05-13 惠州智科实业有限公司 Heat dissipation structure for computer processor
CN104615215B (en) * 2013-11-01 2018-02-23 惠州智科实业有限公司 A kind of radiator structure applied to computer processor
CN113677161A (en) * 2021-08-23 2021-11-19 北京无线电测量研究所 Electronic device structure and contain its electron plug-in components

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120118

Termination date: 20190722

CF01 Termination of patent right due to non-payment of annual fee