CN202116648U - Micro-etching treatment system for recyclable copper and copper alloy surfaces - Google Patents
Micro-etching treatment system for recyclable copper and copper alloy surfaces Download PDFInfo
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- CN202116648U CN202116648U CN2011201345472U CN201120134547U CN202116648U CN 202116648 U CN202116648 U CN 202116648U CN 2011201345472 U CN2011201345472 U CN 2011201345472U CN 201120134547 U CN201120134547 U CN 201120134547U CN 202116648 U CN202116648 U CN 202116648U
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Abstract
The utility model discloses a micro-etching treatment system for recyclable copper and copper alloy surfaces, which comprises a micro-etching operating tank, a medicament electrolytic regeneration and metal copper recovery system and an automatic control system. The micro-etching operating tank is used for realizing micro-etching treatment on recyclable copper and copper alloy, the medicament electrolytic regeneration and metal copper recovery system is used for regenerating and restoring micro-etching capacity of medicaments after operation and realizing electrolytic regeneration and recovery treatment, the automatic control system connects the micro-etching operating tank with an electrolytic recovery and regeneration tank and realizes automatic stable control, the medicament electrolytic regeneration and metal copper recovery system is connected with the micro-etching operating tank of a circuit board production line by a pipeline, and treated medicaments return back to the micro-etching operating tank through the pipeline so as to continue treating workpieces. By the aid of a circuit board micro-etching regeneration recycling device of the micro-etching treatment system, production cost of micro-etching process can be reduced, the level of the micro-etching process for the copper and copper alloy surfaces is improved, and purposes of clean production and zero emission are achieved.
Description
Technical field
The utility model relates to a kind of circuit card microetch reprocessing cycle equipment, particularly relates to a kind of copper and copper alloy surface micro etching treatment system of using again capable of circulation.
Background technology
At present, China electronics industry gets into stage, the particularly semi-conductor/chip/PCB industry of a develop rapidly; Because in cost of labor; The industry basis, the advantage of supporting industry and other correlative factor rapidly shifts semi-conductor/chip/PCB industry toward the area, continent; In from now on five to ten years, this trend will be more obvious.
And the making flow process of whole semi-conductor/chip/PCB wiring board comprises that tens so-calledly to roads up to a hundred do wet technical process, produces pollutents such as a large amount of waste liquid waste gas in the flow process, if without appropriate processing, will produce very large negative impact to the environment of China.Especially in semi-conductor/chip/wiring board making processes; Repeatedly relate to the surface treatment of circuit copper and copper alloy; Traditional technology to different chemical corrosions, all can produce in various degree waste gas, waste residue or waste liquid from polish-brush, must be through further handling before discharging.
Such as in semi-conductor/chip/wiring board industry; Traditional chemical microcorrosion clean copper and copper alloy surface are to use sulfuric acid oxidizer Sodium Persulfate (or ammonium) or ydrogen peroxide 50; Its technical development mainly is on the basis of this liquid medicine system; Add different organic or inorganic additives, with development and the requirement of Technology progressive of satisfying industry.
Recent years, the wiring board industry in Europe and America is facing under the increasing environmental protection pressure, on the one hand to Asia China particularly, and Vietnam, industry transfer is carried out in places such as India, and bigger demand is arranged to environmental protection with aspect recycling in technical development simultaneously.At the surface treatment this respect of microetch copper and copper alloy, successively adopt dioxysulfate aqueous systems cupric sulphate crystal recovery technology, dioxysulfate water and sulfuric acid Sodium Persulfate system electrolytic recovery copper technology; For example domestic patent CN101608337B; CN201495290U, CN201598332U, these patented technologies are to reducing discharge of wastewater; Recycling of material, aspects such as cleaner production have all produced considerable economic and good social benefit.
But above-mentioned patented technology mainly concentrates on the equipment; Exactly on the basis that does not change whole liquid medicine system; Reclaim machine or electrolytic recovery copper handler through collocation copper sulfate; The mode of cupric ion in the microetch technology with cupric sulfate crystals or metallic copper extracted, recycle and liquid medicine can implementation part.Its weak point, the one, the part circulation is reclaimed, and efficient is not high, and comprehensive benefit is limited; It two can't satisfy exactly semi-conductor/chip/wiring board industry technology is developed desired copper and the senior surface treatment of copper alloy (so-called ultra roughening process), and is lower to technology upgrading support in the industry, to high-end customer shortage magnetism.
Summary of the invention
In order to address the above problem; The utility model provides a kind of copper of usefulness more capable of circulation and copper alloy surface to handle the microetch system that uses; Can reduce the level of production cost, raising copper and the copper alloy surface microetch technology of microetch technology, and reach the purpose that cleaner production realizes zero release.
The utility model provides a kind of copper and copper alloy surface micro etching treatment system of using again capable of circulation, comprising:
Microetch work nest, its set inside have workpiece to be processed and microetch medicament, are used for the copper and copper alloy of etch processes Recycling;
Medicament electrolytic regeneration and recovery metallic copper system are used for little erosion ability regeneration of work back medicament is recovered, and carry out electrolytic regeneration and recycle; And
Automatic control system with little erosion work nest and electrolytic recovery and regeneration tank connection and the stable control of realization robotization;
Medicament electrolytic regeneration and recovery metallic copper system link to each other with pipeline with wiring board production line microetch work nest, and treated medicament comes back to through pipeline and continues to handle workpiece in little erosion work nest.
The utility model is compared the beneficial effect of prior art and can be explained as follows:
Copper that the utility model relates to and copper alloy surface microetch treatment system; Wherein medicament recycles fully; Real realization zero release; Be real green production operation, this meets the industry policy of our country fully, and industry and entire society are produced good economic benefit, environmental benefit and demonstration effect.In electrolytic regeneration liquid medicine, the little erosion ability of recovery, reduced the cupric ion in little erosion medicament again and reclaimed the by product metallic copper, and then realized 100% Recycling of little erosion medicament; The complete zero release of high density copper-containing wastewater.
Description of drawings
Fig. 1 is the utility model synoptic diagram of using copper and copper alloy surface micro etching treatment system again capable of circulation.
Fig. 2 is the cupric electrolysis recovery of the utility model and the schematic appearance of medicament regeneration system rapidly.
Fig. 3 is the cupric electrolysis recovery of the utility model and the internal structure synoptic diagram of medicament regeneration system rapidly.
Fig. 4 is to use copper and the copper surface microstructure figure of copper alloy surface microetch system handles of the usefulness more capable of circulation of the utility model.
Fig. 5 is to use the copper surface microstructure figure of another embodiment of the utility model.
10: little erosion work nest 11: workpiece inductor block or copper ion concentration unit
20: electrolytic recovery and regeneration tank 21: positive electrode
22: negative electrode 23: conducting copper
24: suction opening 30:PLC unit
31: RF 40: pumping
51: water inlet pipe 52: reflux line
Embodiment
For make the utility model the technical scheme and the effect thereof that will provide clearer, below in conjunction with accompanying drawing and preferred embodiment, the utility model is further elaborated.
See also shown in Fig. 1-3; The entire equipment of the utility model links to each other through pipeline (including waterpipe 51 and reflux line 52) with wiring board production line microetch work nest 10; The microetch medicament is in little erosion work nest 10 behind the microetch copper; Copper content raises, and working fluid microetch ability reduces and lost efficacy; Through pumping 40 working fluid of these inefficacies is squeezed into that cupric electrolysis reclaims again and medicament regeneration system rapidly 20 in, reduce wherein copper ion concentration and recover its microetch ability, get into little erosion work nest 10 once more and carry out the microetch operation, in this way circulation.PLC unit 30 is connected with microetch work nest 10, electrolytic regeneration and recovery system 20 and the RF 31 of production line, guarantees the stability of total system work.
One side of electrolytic recovery of the utility model and regeneration tank 20 is provided with suction opening 24, and the positive electrode 21 of set inside adopts DSA (coated titanium electrode, Dimensionally Stable Anode), and the total area is 1.8 square metres; Use Copper Foil as negative electrode 22, ratio of cathodic to anodic area 1: 1; Current density 5ASD; Reclaimed about 400 kilograms of copper in every month.The upper end of positive electrode 21 and negative electrode 22 is connected with conducting copper 23.
The PLC unit 30 of the utility model adopts production line entering plate signal control electrolytic recovery and regeneration tank 20; When production line begins to produce, the entering plate inductor block in little erosion work nest 10 transfers signals to PLC unit 30, and PLC opens the power supply of pumping 40 and electrolytic recovery and regeneration tank 20, and the electric current of setting with formula begins electrolytic recovery work.
Embodiment 1
On a wiring board, carry out the copper face treatment process, adopt the microetch treatment process system of the utility model.Workpiece to be processed is placed little erosion work nest 10, promptly adopt in the copper and copper alloy microetch medicament of usefulness more capable of circulation and handle, the microetch medicament that is adopted is recently to calculate with weight percent to comprise following each component:
Sulfuric acid 5%
Ferric sulfate 15%
Negatively charged ion fluorocarbon surfactant (
1033D, Fluorinated Surfactant) 02%
Formic acid or acetate 0.2-2%
It can be 20-100ppm that KI, NaBr or NaCl add scope
Additive (sodium polydithio-dipropyl sulfonate, 3-sulfydryl propane sulfonic acid sodium, N; The N-DMDS is for carbonyl propane sulfonic acid sodium, isothiourea propanesulfonic acid inner salt, 3-(benzene a pair of horses going side by side thiazole-2-sulfydryl)-propane sulfonic acid sodium) in a kind of or the two above mixture, the interpolation scope can be 0.2-10ppm
Surplus is a deionized water.
The TR of above-mentioned microetch chemicals treatment can be used and soak or the sprinkling system operation under 1～2 kilogram of every cm2 pressure from 25 ℃ to 45 ℃, and the treatment time can be carried out different choice according to the actual requirement of little erosion degree of depth from 20 seconds to 5 minutes.
The wiring board copper face is in the processing of little erosion work nest 10, and the primitive reaction principle is:
2Fe
3++Cu→2Fe
2++Cu
2+
Ferric iron is converted into ferrous iron in the medicament, and ferric iron concentration reduces gradually, and ferrous iron concentration raises, and copper content rises gradually simultaneously; Medicament microetch ability reduces gradually.
Medicament after working in little erosion work nest 10 through water inlet pipe 51 with go into water-circulating pump 40 and be extracted into electrolytic recovery and regeneration tank 20, carry out the electrolytic regeneration recycling, as shown in Figure 1.Wherein, the principal reaction that takes place on positive electrode 21 and the negative electrode 22 can be explained as follows:
Anode (Anode): Fe
2+-e → Fe
3+(regeneration Regeneration)
Negative electrode (Cathode): Cu
2++ 2e → Cu (reclaiming copper Copper Recovery)
On the one hand, little erosion ability regeneration of medicament recovered after electrolytic recovery and regeneration tank 20 will be worked, and reduced ferrous ion concentration, promoted ferric ion concentration, and while reclaiming metals copper reduces copper ion concentration.Like this, treated medicament comes back to through reflux line 52 and continues to handle workpiece in little erosion work nest 10.
The PLC automatic control system 30 of the utility model connects little erosion work nest 10, pumping 40 and electrolytic recovery and regeneration tank 20, realizes the stable control of (partly) robotization; Through workpiece inductor block (or copper ion concentration unit) 11 induced signals that place little erosion work nest 10; Be transported to PLC unit 30; When signal satisfies the parameter request in the setting program; Automatically start pumping 40 and electrolytic recovery and regeneration tank 20 work, medicament is constantly circulation between little erosion work nest 10 and electrolytic recovery and regeneration tank 20, keeps stable.
Meticulousr PLC program can be adjusted the working current and the voltage of electrolytic recovery and regeneration tank 20 according to input signal, so can reach the more stable little erosion work of production process.As shown in Figure 4, use capable of circulation greatlyyer with the roughened copper surface degree after the microetch system handles of micro-etching agent and the utility model again, improved the bonding force of itself and dry film.
Embodiment 2
On a wiring board, carry out the copper face treatment process, adopt the microetch treatment process system of the utility model.Workpiece to be processed is placed little erosion work nest 10, handle in the copper and copper alloy microetch medicament of promptly said usefulness more capable of circulation, the microetch medicament that is adopted is recently to calculate and comprise following each component with weight percent:
Nitric acid 7%
Negatively charged ion fluorocarbon surfactant (
1033D, Fluorinated Surfactant) 0.1%
Formic acid or acetate, interpolation scope can be 0.2-2%
KI, NaBr or NaCl, the interpolation scope can be 20-100ppm
Additive (sodium polydithio-dipropyl sulfonate, 3-sulfydryl propane sulfonic acid sodium, N; The N-DMDS is for carbonyl propane sulfonic acid sodium, isothiourea propanesulfonic acid inner salt, 3-(benzene a pair of horses going side by side thiazole-2-sulfydryl)-propane sulfonic acid sodium) in a kind of or the two above mixture, the interpolation scope can be 0.2-10ppm
Surplus is a deionized water.
The TR of above-mentioned microetch chemicals treatment can be used and soak or the sprinkling system operation under 1～2 kilogram of every cm2 pressure from 25 ℃ to 45 ℃, and the treatment time can be carried out different choice according to the actual requirement of little erosion degree of depth from 20 seconds to 5 minutes.
The wiring board copper face is in the processing of little erosion work nest, and the primitive reaction principle is:
2Fe
3++Cu→2Fe
2++Cu
2+
Ferric iron is converted into ferrous iron in the medicament, and ferric iron concentration reduces gradually, and ferrous iron concentration raises, and copper content rises gradually simultaneously; Medicament microetch ability reduces gradually.
Wherein, the medicament after working in little erosion work nest 10 is extracted into electrolytic recovery and regeneration tank 20, carries out the electrolytic regeneration recycling, and as shown in Figure 2, the principal reaction that takes place on positive electrode 21 and the negative electrode 22 can be explained as follows:
Anode (Anode): Fe
2+-e → Fe
3+(regeneration Regeneration)
Negative electrode (Cathode): Cu
2++ 2e → Cu (reclaiming copper Copper Recovery)
On the one hand, little erosion ability regeneration of medicament recovered after electrolytic recovery and regeneration tank 20 will be worked, and reduced ferrous ion concentration, promoted ferric ion concentration, and while reclaiming metals copper reduces copper ion concentration.Like this, treated medicament comes back to through pipeline and continues to handle workpiece in little erosion work nest 10.
The PLC automatic control system 30 of the utility model connects little erosion work nest 10, pumping 40 and electrolytic recovery and regeneration tank 20, realizes the stable control of (partly) robotization; Through workpiece inductor block (or copper ion concentration unit) 11 induced signals that place little erosion work nest 10; Be transported to PLC unit 30; When signal satisfies the parameter request in the setting program; Automatically start pumping 40 and electrolytic recovery and regeneration tank 20 work, medicament is constantly circulation between little erosion work nest 10 and electrolytic recovery and regeneration tank 20, keeps stable.
Meticulousr PLC program can be adjusted the working current and the voltage of electrolytic recovery and regeneration tank 20 according to input signal, so can reach the more stable little erosion work of production process.As shown in Figure 5, use capable of circulation greatlyyer with the roughened copper surface degree after the microetch system handles of micro-etching agent and the utility model again, improved the bonding force of itself and dry film.
The effect experimental example
The utility model is applied to Shenzhen one medium-sized wiring board internal layer dry film pre-treatment, and system stability work surpasses one-year age, and particular case is following:
The production line that the client uses the utility model is a sea line, 300,000 square chi of output every month.2 meters of the little erosion work nest of this production line useful lengths, processing speed are 2.5 meters PMs, and the treatment time is 48 seconds, 38 ℃ of treatment temps, and spray pressure is every square centimeter of 1.5 kgf, 0.8 micron of little erosion degree of depth;
The recyclable regenerative copper and copper alloy microetch medicine component that little erosion work nest is adopted is:
Sulfuric acid 5%
Ferric sulfate 15%
Negatively charged ion fluorocarbon surfactant (
1033D, Fluorinated Surfactant) 0.2%
Surplus is a deionized water.
The client uses the copper and the copper alloy microetch treatment system of the utility model, and outside PLC control, artificial sample every day assay manually replenishes little additive, to guarantee stablizing of microetch treatment system and stablizing of production quality; The client uses the copper and the copper alloy microetch treatment system of the utility model, and chemical is because consumption is little, and cost is close with previously used dioxysulfate water microetch cost; The electric every working hours of about 8 degree of electrolytic regeneration and recovery system power consumption, the electricity charge in every month increase about 3500 yuan; Reclaim metallic copper purity and surpass 99.5%, about 20000 yuan of the every monthly average of client's copper income; Simultaneously, the dioxysulfate water microetch that yield of operation uses than before improves 3%, and is very useful to client's quality and processing procedure capability improving.
The above; It only is the preferred embodiment of the utility model; Be not that the utility model is done any pro forma restriction; So every the utility model technical scheme content that do not break away from, to any simple modification, equivalent variations and modification that above embodiment did, all still belong in the scope of the utility model technical scheme according to the technical spirit of the utility model.
Claims (7)
1. copper and copper alloy surface micro etching treatment system of using again capable of circulation is characterized in that it comprises:
Microetch work nest, its set inside have workpiece to be processed and microetch medicament, are used for the copper and copper alloy of etch processes Recycling;
Medicament electrolytic regeneration and recovery metallic copper system are used for little erosion ability regeneration of work back medicament is recovered, and carry out electrolytic regeneration and recycle; And
Automatic control system with little erosion work nest and electrolytic recovery and regeneration tank connection and the stable control of realization robotization;
Medicament electrolytic regeneration and recovery metallic copper system link to each other with pipeline with wiring board production line microetch work nest, and treated medicament comes back to through pipeline and continues to handle workpiece in little erosion work nest.
2. the copper and copper alloy surface micro etching treatment system of using again capable of circulation according to claim 1; It is characterized in that: be provided with workpiece inductor block or copper ion concentration unit induced signal in said little erosion work nest; Be transported to the PLC unit; When signal satisfies the parameter request in the setting program, start pumping and electrolytic recovery and regeneration tank work automatically, medicament is cyclic regeneration between little erosion work nest and electrolytic recovery and regeneration tank.
3. the copper and copper alloy surface micro etching treatment system of using again capable of circulation according to claim 1 is characterized in that: be provided with positive electrode and negative electrode in said electrolytic recovery and the regeneration tank.
4. the copper and copper alloy surface micro etching treatment system of using again capable of circulation according to claim 3 is characterized in that: said positive electrode adopts DSA; Said negative electrode adopts Copper Foil; The area of negative electrode and positive electrode was than 1: 1.
5. the copper and copper alloy surface micro etching treatment system of using again capable of circulation according to claim 1, it is characterized in that: said pipeline includes waterpipe and reflux line.
6. according to each described copper and copper alloy surface micro etching treatment system of using again capable of circulation among the claim 1-5; It is characterized in that: the working fluid that lost efficacy is squeezed in cupric electrolysis recovery and the medicament regeneration system rapidly through pumping; Reduce wherein copper ion concentration and recover its microetch ability; Get into little erosion work nest once more and carry out the microetch operation, in this way circulation.
7. the copper and copper alloy surface micro etching treatment system of using again capable of circulation according to claim 6, it is characterized in that: said PLC unit is connected to RF, adopts production line entering plate signal control electrolytic recovery and regeneration tank; When production line begins to produce, the entering plate inductor block transfers signals to PLC, and PLC opens pumping and electrolytic regeneration accumulator tank power supply, and begins electrolytic recovery work with the electric current of formula setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201345472U CN202116648U (en) | 2011-04-29 | 2011-04-29 | Micro-etching treatment system for recyclable copper and copper alloy surfaces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201345472U CN202116648U (en) | 2011-04-29 | 2011-04-29 | Micro-etching treatment system for recyclable copper and copper alloy surfaces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202116648U true CN202116648U (en) | 2012-01-18 |
Family
ID=45457729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201345472U Expired - Lifetime CN202116648U (en) | 2011-04-29 | 2011-04-29 | Micro-etching treatment system for recyclable copper and copper alloy surfaces |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202116648U (en) |
-
2011
- 2011-04-29 CN CN2011201345472U patent/CN202116648U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 510990, No. 8 Taiyuan Road (factory building), Conghua Economic Development Zone, Guangzhou, Guangdong. Patentee after: Guangdong Tiancheng Technology Co., Ltd. Address before: 510990 Guangdong Guangzhou Conghua Taiping Town Conghua Economic Development Zone No. 8 Taiyuan road first floor Patentee before: Guangzhou Skychem Limited |
|
| CP03 | Change of name, title or address | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 510990, No. 8 Taiyuan Road (factory building), Conghua Economic Development Zone, Guangzhou, Guangdong. Patentee after: Guangdong Tiancheng Technology Co.,Ltd. Address before: 510990, No. 8 Taiyuan Road (factory building), Conghua Economic Development Zone, Guangzhou, Guangdong. Patentee before: GUANGZHOU SKYCHEM TECHNOLOGIES Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120118 |
|
| CX01 | Expiry of patent term |