CN202103964U - Floating-prevention and inclination-prevention jig for circuit board wave-soldering process - Google Patents
Floating-prevention and inclination-prevention jig for circuit board wave-soldering process Download PDFInfo
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- CN202103964U CN202103964U CN2011201795633U CN201120179563U CN202103964U CN 202103964 U CN202103964 U CN 202103964U CN 2011201795633 U CN2011201795633 U CN 2011201795633U CN 201120179563 U CN201120179563 U CN 201120179563U CN 202103964 U CN202103964 U CN 202103964U
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- wave
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- press strip
- fixed mount
- inclination
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Abstract
The utility model relates to a floating-prevention and inclination-prevention jig for circuit board wave-soldering process, which comprises a wave-soldering carry jig body used for carrying a PCB. The jig is characterized in that a pressing device used for pressing DIP parts is arranged on the wave-soldering carry jig body; the pressing device comprises a fixed bracket arranged on the wave-soldering carry jig body, a hold-down strip arranged on the fixed bracket, and a plurality of press piece mechanisms arranged on the hold-down strip; and the two end parts of the hold-down strip are fixed on the fixed bracket through clamping mechanisms. All the DIP parts are pressed by the press piece mechanisms when passing a furnace, so as to prevent vibration tin blocks from falling off to cause the inclination of other parts and the floating of the DIP parts when the conventional wave-soldering carry jig body is conveyed on a wave-soldering track. The utility model has the advantage that manual labor is saved, production efficiency is improved, the DIP parts are stably pressed, and the manufacturing cost of an enterprise is lowered.
Description
Technical field
The utility model relates to a kind of tool, what be specifically related to is anti-floating high, the anti-inclination tool of a kind of circuit board wave-soldering processing procedure.
Background technology
In the wave-soldering processing procedure, to the floating high problem of pcb board DIP part, the casting die mode that is adopted in the market is uses the block tin casting die; As shown in Figure 1; Wave-soldering carries places pcb board 2 on the tool 1, on pcb board 2, push down DIP part 4 through block tin 3, because there is high risk in this kind casting die mode:
1. block tin 3 is crossed stove on DIP part 4, has no fixed form, leans on own wt and frictional force to fix fully.And wave-soldering carries tool 1 and on the wave-soldering track, in the transmission course vibrations arranged, and block tin 3 is easy to drop, and not only causes DIP part 4 floating high, and block tin 3 drops and also can cause the crooked of other part.
2. if the DIP part 4 that need press is more, 3 needs of block tin are with a lot, and waste tin is wasted man-hour, increases production cost and labour intensity.
The utility model content
To the deficiency that exists on the prior art, the utility model purpose is to be to solve the floating high problem of DIP part; And a kind of saving manpower and man-hour are provided, raise the efficiency, the DIP part pushes the anti-floating high anti-inclination tool of stable circuit board wave-soldering processing procedure.
To achieve these goals, the utility model is to realize through following technical scheme:
The anti-floating high anti-inclination tool of circuit board wave-soldering processing procedure; It comprises that the wave-soldering that is used to place pcb board carries the tool body; It is characterized in that, carry at said wave-soldering and be provided with the press device that is used to push the DIP part on the tool body that said press device comprises that being arranged on wave-soldering carries fixed mount on the tool body, is arranged on the fixed mount ceiling molding and is arranged on a plurality of casting die mechanism on the press strip; The both ends of said press strip are fixed on the fixed mount through a snap fastener, are convenient to the dismounting of press strip.
The anti-floating high anti-inclination tool of above-mentioned circuit board wave-soldering processing procedure; Wherein, Said casting die mechanism comprises the moving screw that is arranged on the press strip and is fixed on the pressure bar on the moving screw that said pressure bar is arranged on the press strip through moving screw, between said pressure bar and press strip, is provided with spring; Said spring is arranged on the moving screw, makes pressure bar realize free elastic telescopic.
The anti-floating high anti-inclination tool of above-mentioned circuit board wave-soldering processing procedure, wherein, above-mentioned snap fastener comprises the draw-in groove that is arranged on the movable chuck on the fixed mount and is arranged on the fixed mount upper end; The first end of this active card is installed on the fixed mount through pivot pin; Its other end is provided with the dop spare adaptive with draw-in groove, the end of said press strip place with draw-in groove in, and be fixed in the draw-in groove through the dop spare of movable chuck; Reach the fixedly purpose of press strip, be convenient to the dismounting of press strip simultaneously.
The utility model carries the casting die mechanism that the tool body increases press device and press device through wave-soldering; According to DIP part height design pressure bar; On the position of centre of gravity of each DIP part, be designed to the pressure bar center, pressure bar is fixed with moving screw, adds spring with increase pressure; It is stable that the DIP part is pushed, and solved existing wave-soldering and carried tool and on the wave-soldering track, have vibrations block tin 3 to drop in the transmission course and cause the floating high problem of the crooked of other part and DIP part; It has saves manpower and man-hour, enhances productivity, the DIP part pushes stable advantage, saved the consumption of tin, reduced the production cost of enterprise.
Description of drawings
Specify the utility model below in conjunction with accompanying drawing and embodiment;
Fig. 1 had wave-soldering now to carry the structural representation that tool is pushed the DIP part;
Fig. 2 for the utility model push the DIP part time structural representation;
Fig. 3 is a partial enlarged drawing of the utility model.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and be easy to understand understanding with effect, below in conjunction with embodiment, further set forth the utility model.
Referring to Fig. 2; The anti-floating high anti-inclination tool of the utility model circuit board wave-soldering processing procedure; It comprises that wave-soldering carries tool body 10; In wave-soldering carries tool body 10, place pcb board 40, this wave-soldering carries tool body 10 press device that is used to push the DIP part is installed, and this press device comprises that being fixed on wave-soldering carries fixed mount 11 on the tool body 10, is arranged on fixed mount 11 ceiling moldings 12 and is arranged on a plurality of casting die mechanism 20 on the press strip 12; The casting die mechanism 20 of present embodiment is provided with 6, and the quantity of casting die mechanism 20 is set according to the number of the DIP part of pcb board 40.
Referring to Fig. 3, for ease of the dismounting of press strip 12, the both ends of above-mentioned press strip 12 are fixed on the fixed mount 11 through a snap fastener 30.This snap fastener 30 comprises movable chuck 31 that is arranged on the fixed mount 11 and the draw-in groove 32 that is arranged on fixed mount 11 upper ends; These movable chuck 31 1 ends are installed on the fixed mount 11 through pivot pin; Its other end is provided with the dop spare adaptive with draw-in groove 32, the end of press strip 12 place with draw-in groove 32 in, dop spare and draw-in groove 32 through movable chuck 31 fasten it are fixed in the draw-in groove 32; Reached the fixedly purpose of press strip 12, simultaneously press strip 12 for convenience detach.
In the present embodiment, casting die mechanism 20 comprises the moving screw 21 that is arranged on the press strip 12 and is fixed on the pressure bar 23 on the moving screw 21.These pressure bar 23 usefulness moving screws 21 are fixing, and are arranged on the press strip 12 through moving screw 21; Between pressure bar 23 and press strip 12, be provided with spring 22, said spring 22 is sleeved on the moving screw 21, makes pressure bar 23 realize free elastic telescopic, to increase the pressure of pressure bar 23
During use, according to DIP part height different designs pressure bar 23 height, it is identical that spring 22 elasticity are changed, identical to guarantee the pressure that each DIP part receives.Be designed to pressure bar 23 centers on the position of centre of gravity of each DIP part, push stable to guarantee the DIP part.
When on the DIP part, crossing stove; Press each DIP part through casting die mechanism 20, thereby prevented that existing wave-soldering carries tool body 10 and on the wave-soldering track, has vibrations block tin 3 to drop in the transmission course and cause the floating high problem of the crooked of other part and DIP part; It has the saving manpower, enhances productivity, the DIP part pushes stable advantage, reduced the production cost of enterprise.
More than show and described basic principle of the utility model and the advantage of principal character and the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; The principle of describing in the foregoing description and the specification that the utility model just is described; Under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these variations and improvement all fall in the utility model scope that requires protection.The utility model protection defined by the appended claims and their equivalents defined
.
Claims (3)
1. the anti-floating height of circuit board wave-soldering processing procedure is prevented the inclination tool; It comprises that the wave-soldering that is used to place pcb board carries the tool body; It is characterized in that; Carry at said wave-soldering and to be provided with the press device that is used to push the DIP part on the tool body, said press device comprises that being arranged on wave-soldering carries fixed mount on the tool body, is arranged on the fixed mount ceiling molding and is arranged on a plurality of casting die mechanism on the press strip, and the both ends of said press strip are fixed on the fixed mount through a snap fastener.
2. the anti-floating high anti-inclination tool of circuit board wave-soldering processing procedure according to claim 1; It is characterized in that; Said casting die mechanism comprises the moving screw that is arranged on the press strip and is fixed on the pressure bar on the moving screw; Said pressure bar is arranged on the press strip through moving screw, between said pressure bar and press strip, is provided with spring, and said spring is arranged on the moving screw.
3. the anti-floating high anti-inclination tool of circuit board wave-soldering processing procedure according to claim 1 and 2; It is characterized in that; Said snap fastener comprises the draw-in groove that is arranged on the movable chuck on the fixed mount and is arranged on the fixed mount upper end, and the first end of this active card is installed on the fixed mount through pivot pin, and its other end is provided with the dop spare adaptive with draw-in groove; The end of said press strip place with draw-in groove in, and be fixed in the draw-in groove through the dop spare of movable chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201795633U CN202103964U (en) | 2011-05-31 | 2011-05-31 | Floating-prevention and inclination-prevention jig for circuit board wave-soldering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201795633U CN202103964U (en) | 2011-05-31 | 2011-05-31 | Floating-prevention and inclination-prevention jig for circuit board wave-soldering process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202103964U true CN202103964U (en) | 2012-01-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201795633U Expired - Fee Related CN202103964U (en) | 2011-05-31 | 2011-05-31 | Floating-prevention and inclination-prevention jig for circuit board wave-soldering process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202103964U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102223769A (en) * | 2011-05-31 | 2011-10-19 | 昆山元崧电子科技有限公司 | Anti-floating and anti-tilt tool in circuit board wave soldering process |
| CN104588814A (en) * | 2014-11-18 | 2015-05-06 | 北京三重华星电子科技有限公司 | Method for standard manufacturing of wave-soldering fixture |
| CN106879191A (en) * | 2017-02-24 | 2017-06-20 | 江西吉安奥海科技有限公司 | USB antidotes and correction tool |
| CN110640256A (en) * | 2019-11-05 | 2020-01-03 | 北京北广科技股份有限公司 | Automatic adjust welding frock |
| US11696427B2 (en) | 2019-11-15 | 2023-07-04 | International Business Machines Corporation | Configurable printed-circuit-board-assembly component pressing fixture |
-
2011
- 2011-05-31 CN CN2011201795633U patent/CN202103964U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102223769A (en) * | 2011-05-31 | 2011-10-19 | 昆山元崧电子科技有限公司 | Anti-floating and anti-tilt tool in circuit board wave soldering process |
| CN102223769B (en) * | 2011-05-31 | 2013-01-16 | 昆山元崧电子科技有限公司 | Anti-floating and anti-tilt tool in circuit board wave soldering process |
| CN104588814A (en) * | 2014-11-18 | 2015-05-06 | 北京三重华星电子科技有限公司 | Method for standard manufacturing of wave-soldering fixture |
| CN104588814B (en) * | 2014-11-18 | 2016-08-31 | 北京三重华星电子科技有限公司 | A kind of wave-soldering fixture makes the method for specification |
| CN106879191A (en) * | 2017-02-24 | 2017-06-20 | 江西吉安奥海科技有限公司 | USB antidotes and correction tool |
| CN106879191B (en) * | 2017-02-24 | 2018-07-10 | 江西吉安奥海科技有限公司 | USB antidotes and correction jig |
| CN110640256A (en) * | 2019-11-05 | 2020-01-03 | 北京北广科技股份有限公司 | Automatic adjust welding frock |
| US11696427B2 (en) | 2019-11-15 | 2023-07-04 | International Business Machines Corporation | Configurable printed-circuit-board-assembly component pressing fixture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120104 Termination date: 20150531 |
|
| EXPY | Termination of patent right or utility model |