CN202094103U - Rack division type wafer cleaning device - Google Patents
Rack division type wafer cleaning device Download PDFInfo
- Publication number
- CN202094103U CN202094103U CN2011202000915U CN201120200091U CN202094103U CN 202094103 U CN202094103 U CN 202094103U CN 2011202000915 U CN2011202000915 U CN 2011202000915U CN 201120200091 U CN201120200091 U CN 201120200091U CN 202094103 U CN202094103 U CN 202094103U
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- wafer
- wafer cleaning
- cleaning brush
- cleaning device
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Abstract
The utility model discloses a rack division type wafer cleaning device used for cleaning a wafer. The wafer cleaning device comprises: a pair of first wafer cleaning brushes which are arranged at surfaces of two sides of the wafer, and a pair of second wafer cleaning brushes which are also arranged at the surfaces of two sides of the wafer, wherein an axial lead of the first wafer cleaning brushes is close to a center part of the wafer, and a axial lead of the second wafer cleaning brushes is close to an edge part of the wafer. In the wafer cleaning device of the utility model, by adding the pair of second wafer cleaning brushes of which the axial lead is close to the edge part of the wafer, the edge part of the wafer can be cleaned emphatically, so as to realize the comprehensive and quick cleaning to the wafer. In addition, the first wafer cleaning brushes and the second wafer cleaning brushes can be driven by different motors, so that the first wafer cleaning brushes and the second wafer cleaning brushes can perform the cleaning works with different rotating speeds, thus the purpose that one set of the cleaning brushes are used for coarse washing, the other set of the cleaning brushes are used for fine washing can be achieved, and the cleaning efficiency can be raised.
Description
Technical field
The utility model relates to a kind of wafer cleaning device, relates in particular to a kind of minute posture wafer cleaning device.
Background technology
In the semiconductor production workshop, need usually to adopt a pair of wafer cleaning device that the both side surface of wafer is cleaned, to remove the particulate matter on the wafer both side surface.
See also Fig. 1 and Fig. 2, wherein, shown in Figure 1 is the structural representation of existing wafer cleaning device, and Fig. 2 is the end view of Fig. 1.Existing wafer cleaning device comprises a pair of wafer cleaning brush 102 that is arranged on the both side surface of described wafer 101, described wafer 101 is by three wafer roller 103 driven rotary, the axial line of described wafer cleaning brush 102 is positioned at the centre of described wafer 101, described wafer cleaning brush 102 is by motor and transmission mechanism (not shown) driven rotary thereof, makes the bristle of wafer cleaning brush 102 roll to described wafer 101 and scrubs.
But the wafer cleaning device of this structure because the axial line of described wafer cleaning brush 102 is positioned at the centre of described wafer 101, therefore, cleans relatively totallyer to the centre of wafer 101, but on the weak side to the edge cleansing power of wafer 101.Especially when wafer 101 was bigger, the inhomogeneities of wafer cleaning brush 102 cleaning performances was more obvious, and the edge of wafer 101 is howed a lot than the centre particulate matter of wafer 101.
Therefore, how to provide a kind of can be more fast, the branch posture wafer cleaning device of cleaning wafer is the technical problem that those skilled in the art need to be resolved hurrily all sidedly.
The utility model content
The purpose of this utility model is to provide a kind of minute posture wafer cleaning device, can be more fast, cleaning wafer all sidedly, improve the cleaning efficiency of wafer.
To achieve the above object, the utility model adopts following technical scheme:
A kind of minute posture wafer cleaning device, be used for cleaning wafer, comprise a pair of first wafer cleaning brush that is arranged on the wafer both side surface, also comprise a pair of second wafer cleaning brush, the described second wafer cleaning brush also is separately positioned on the both side surface of described wafer, and the axial line of the described first wafer cleaning brush is near the centre of described wafer, and the axial line of the described second wafer cleaning brush is near the edge of described wafer.
Preferably, in the branch posture wafer cleaning device of the above, also comprise first motor and first transmission mechanism, described first motor drives the described first wafer cleaning brush by first transmission mechanism and rotates.
Preferably, in the branch posture wafer cleaning device of the above, described first transmission mechanism is pulley transmission mechanism or chain wheel driving mechanism.
Preferably, in the branch posture wafer cleaning device of the above, also comprise second motor and second transmission mechanism, described second motor drives the described second wafer cleaning brush by second transmission mechanism and rotates.
Preferably, in the branch posture wafer cleaning device of the above, described second transmission mechanism is pulley transmission mechanism or chain wheel driving mechanism.
Preferably, in the branch posture wafer cleaning device of the above, the brush bucket of the described first wafer cleaning brush and the second wafer cleaning brush varies in size.
Preferably, in the branch posture wafer cleaning device of the above, the bristle of the described first wafer cleaning brush and the second wafer cleaning brush varies in size.
The utility model divides the beneficial effect of posture wafer cleaning device as follows:
In sum, the utility model is by setting up a pair of second wafer cleaning brush on the basis of original a pair of first wafer cleaning brush, and the axial line of the described first wafer cleaning brush is near the centre of described wafer, therefore the same with prior art, can be by the centre of the first wafer cleaning brush emphasis cleaning wafer, and the axial line of the described second wafer cleaning brush is near the edge of described wafer, therefore can clean the edge of described wafer by emphasis by the second wafer cleaning brush, clean thereby can realize carrying out comprehensively, apace wafer.
In addition, drive described first wafer cleaning brush and described second cleaning brush respectively, thereby can realize that the first wafer cleaning brush and second wafer clean adopts different rotating speeds to scrub work by different motors, reach one group slightly wash, the purpose of one group of fine purifiation.
And the thickness that adopts different size and bristle respectively when the first wafer cleaning brush and the second wafer cleaning brush is not simultaneously, can further strengthen slightly washing the effect with fine purifiation, thereby realizes fast, the purpose of cleaning wafer comprehensively.
Description of drawings
The posture wafer cleaning device was published picture by following embodiment and accompanying drawing in of the present utility model minute.
Fig. 1 is the structural representation of existing wafer cleaning device;
Fig. 2 is the end view of Fig. 1;
Fig. 3 divides the structural representation of the embodiment of posture wafer cleaning device for the utility model;
Fig. 4 is the end view of Fig. 3.
Embodiment
Below will be described in further detail of the present utility model minute posture wafer cleaning device.
Below with reference to accompanying drawings the utility model is described in more detail, has wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.In the following description, be not described in detail known function and structure, because they can make the utility model because unnecessary details and confusion.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details, for example, change into another embodiment by an embodiment according to relevant system or relevant commercial restriction to realize developer's specific objective.In addition, will be understood that this development may be complicated and time-consuming, but only be routine work to those skilled in the art.
For the purpose of this utility model, feature are become apparent, embodiment of the present utility model is further described below in conjunction with accompanying drawing.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
See also Fig. 3 and Fig. 4, wherein, Figure 3 shows that the structural representation of the embodiment of the utility model branch posture wafer cleaning device; Figure 4 shows that the end view of Fig. 3.
This minute posture wafer cleaning device, be used for cleaning wafer 201, comprise a pair of first wafer cleaning brush 202 that is arranged on wafer 201 both side surface, also comprise a pair of second wafer cleaning brush 204, the described second wafer cleaning brush 204 also is separately positioned on the both side surface of described wafer 201, and the axial line of the described first wafer cleaning brush 202 is near the centre of described wafer 201, and the axial line of the described second wafer cleaning brush 204 is near the edge of described wafer 201.
In the present embodiment, also comprise first motor, first transmission mechanism, second motor and second transmission mechanism.Because said motor and above-mentioned transmission mechanism are ordinary skill in the art means, so not shown.Described first motor drives the described first wafer cleaning brush 202 by first transmission mechanism and rotates.Described first transmission mechanism and second transmission mechanism can be that pulley transmission mechanism can be a chain wheel driving mechanism also, in the present embodiment, all adopt chain wheel driving mechanism, and transmission accuracy is than higher.
Drive described first wafer cleaning brush 202 and described second cleaning brush 204 respectively by different motor (i.e. first motor and second motor), therefore, the first wafer cleaning brush 202 cleans 204 with second wafer and can adopt different rotating speeds to scrub work.In the present embodiment, the described first wafer cleaning brush 202 is slightly washed work, and its rotary speed is than very fast, and the described second wafer cleaning brush 204 carries out fine purifiation work, and its rotary speed is slow.The first wafer cleaning brush 202 and second wafer clean 204 and adopt different rotating speeds to scrub work, can reach one group slightly wash, the purpose of one group of fine purifiation, thereby improve cleaning efficiency.
Preferable, varying in size of the described first wafer cleaning brush 202 and the second wafer cleaning brush 204 that is to say brush bucket diameter difference separately, to satisfy different cleaning requirements.
Preferable, the bristle size of the described first wafer cleaning brush 202 and the second wafer cleaning brush 204 also can be different.When the first wafer cleaning brush 202 adopts the bristle of different thicknesses respectively with the second wafer cleaning brush 204, can further distinguish and slightly wash and fine purifiation, the bristle of slightly washing the first wafer cleaning brush 202 of work can compare slightly, and the bristle of the second wafer cleaning brush 204 that carries out fine purifiation work is thinner, thereby realize the purpose of quick, comprehensive cleaning wafer, further improve cleaning efficiency.
In sum, the utility model is by setting up a pair of second wafer cleaning brush on the basis of original a pair of first wafer cleaning brush, and the axial line of the described first wafer cleaning brush is near the centre of described wafer, therefore the same with prior art, can be by the centre of the first wafer cleaning brush emphasis cleaning wafer, and the axial line of the described second wafer cleaning brush is near the edge of described wafer, therefore can clean the edge of described wafer by emphasis by the second wafer cleaning brush, clean thereby can realize carrying out comprehensively, apace wafer.
In addition, drive described first wafer cleaning brush and described second cleaning brush respectively, thereby can realize that the first wafer cleaning brush and second wafer clean adopts different rotating speeds to scrub work by different motors, reach one group slightly wash, the purpose of one group of fine purifiation.
And the thickness that adopts different size and bristle respectively when the first wafer cleaning brush and the second wafer cleaning brush is not simultaneously, can further strengthen slightly washing the effect with fine purifiation, thereby realizes fast, the purpose of cleaning wafer comprehensively.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (7)
1. branch posture wafer cleaning device, be used for cleaning wafer, comprise a pair of first wafer cleaning brush that is arranged on the wafer both side surface, it is characterized in that, also comprise a pair of second wafer cleaning brush, the described second wafer cleaning brush also is separately positioned on the both side surface of described wafer, and the centre of the close described wafer of the axial line of the described first wafer cleaning brush, and the axial line of the described second wafer cleaning brush is near the edge of described wafer.
2. according to claim 1 minute posture wafer cleaning device is characterized in that, also comprises first motor and first transmission mechanism, and described first motor drives the described first wafer cleaning brush by first transmission mechanism and rotates.
3. according to claim 2 minute posture wafer cleaning device is characterized in that described first transmission mechanism is pulley transmission mechanism or chain wheel driving mechanism.
4. according to claim 2 minute posture wafer cleaning device is characterized in that, also comprises second motor and second transmission mechanism, and described second motor drives the described second wafer cleaning brush by second transmission mechanism and rotates.
5. according to claim 4 minute posture wafer cleaning device is characterized in that described second transmission mechanism is pulley transmission mechanism or chain wheel driving mechanism.
6. according to claim 1 minute posture wafer cleaning device is characterized in that, the brush bucket of the described first wafer cleaning brush and the second wafer cleaning brush varies in size.
7. according to claim 1 minute posture wafer cleaning device is characterized in that, the bristle of the described first wafer cleaning brush and the second wafer cleaning brush varies in size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202000915U CN202094103U (en) | 2011-06-14 | 2011-06-14 | Rack division type wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202000915U CN202094103U (en) | 2011-06-14 | 2011-06-14 | Rack division type wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202094103U true CN202094103U (en) | 2011-12-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202000915U Expired - Fee Related CN202094103U (en) | 2011-06-14 | 2011-06-14 | Rack division type wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202094103U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102658273A (en) * | 2012-05-09 | 2012-09-12 | 上海宏力半导体制造有限公司 | Cleaning device |
| CN104952695A (en) * | 2014-03-24 | 2015-09-30 | 盛美半导体设备（上海）有限公司 | Wafer cleaning method and wafer cleaning equipment |
-
2011
- 2011-06-14 CN CN2011202000915U patent/CN202094103U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102658273A (en) * | 2012-05-09 | 2012-09-12 | 上海宏力半导体制造有限公司 | Cleaning device |
| CN104952695A (en) * | 2014-03-24 | 2015-09-30 | 盛美半导体设备（上海）有限公司 | Wafer cleaning method and wafer cleaning equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130419 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130419 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203, Zhangjiang Road, Shanghai, Shanghai, No. 18, Pudong New Area Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111228 Termination date: 20180614 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |