CN202071234U - Guide wheel device for processing silicon wafer - Google Patents
Guide wheel device for processing silicon wafer Download PDFInfo
- Publication number
- CN202071234U CN202071234U CN2011201536639U CN201120153663U CN202071234U CN 202071234 U CN202071234 U CN 202071234U CN 2011201536639 U CN2011201536639 U CN 2011201536639U CN 201120153663 U CN201120153663 U CN 201120153663U CN 202071234 U CN202071234 U CN 202071234U
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- China
- Prior art keywords
- guide wheel
- guide wheels
- wheel device
- steel wire
- guide
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Abstract
The utility model relates to a guide wheel device for processing a silicon wafer. The guide wheel device comprises four guide wheels and a plurality of cutting steel wires which are wound on the four guide wheels, wherein the four guide wheels are arranged in two rows in the vertical direction; and a cooling mortar nozzle for reducing the temperature of the cutting steel wires is arranged between the two guide wheels in the upper row and is positioned above the cutting steel wires. Through the guide wheel device for processing the silicon wafer, the temperature of the cutting steel wires can be effectively reduced, and furthermore, the wear of the guide wheels is reduced, and the quality of the guide wheels is controlled.
Description
[technical field]
The utility model relates to a kind of silicon chip processing and uses guide wheel device, belongs to the cutting equipment technical field in the solar silicon wafers production.
[background technology]
Now the solar silicon wafers process technology all adopts multi-thread unsteady cutting technique, will cut steel wire and be wrapped in and form the cutting gauze on the guide wheel and carry out silicon rod cutting.The quality of guide wheel directly influences the quality of gauze, the quality of gauze directly affects the section yield, so the research guide wheel in use avoids damage that very significantly benefit is arranged, adopt the harmless cutting technique of guide wheel can improve the yield rate about 2% of section, guide wheel can prolong one times service time, the steel wire use amount reduces 5%, and production capacity can improve 5%.
Existing enterprise changes guide wheel and controls the guide wheel access times according to guide wheel clipping time, guide wheel cutting silicon chip quality or empirical value when the cutting silicon chip, these methods all will influences the service time of section yield and shortening guide wheel.Adopt laser steel wire solder technology and steel wire cooling technology to avoid the guide wheel damage, can guarantee the silicon chip crudy like this and can also prolong guide wheel service life.
At present scroll saw is when cutting polysilicon or monocrystalline silicon, needs the steel wire that more renews after the cutting steel wire uses up at every turn, adopts new steel wire and old steel wire to beat usually and connects, and the end of a thread that will beat after connecing ran gauze then; Cutting steel wire simultaneously produces high temperature and also will cause the guide wheel excessive wear in cutting process.
Discover by long-term observation, cross the quality of all guide wheel in this industry of the end of a thread at the technique influence that adopts, i.e. the guided wheel slot extruding that is subjected to the end of a thread produces deformation and causes that the gauze quality descends, and then produces the thickness sheet, seriously will cause broken string.Be controlled at the steel wire temperature in the cutting process simultaneously, avoid the too high guide wheel that causes of steel wire temperature to wear and tear.
Therefore, for avoiding above-mentioned technical problem, necessary provide a kind of structure more reasonably silicon chip processing use guide wheel device, to overcome described defective of the prior art.
[utility model content]
For addressing the above problem, the purpose of this utility model is to provide a kind of silicon chip processing guide wheel device that can effectively reduce cutting steel wire temperature and then reduce the guide wheel wearing and tearing.
For achieving the above object, the technical scheme that the utility model is taked is: a kind of silicon chip processing guide wheel device, it comprises four guide wheels and is wrapped in some cutting steel wires on four guide wheels, described four guide wheels are the two rows setting, be provided with one and be used to reduce the cooling mortar mouth that cuts wire temperature between the described row's of going up two guide wheels, described cooling mortar mouth is positioned at the top of cutting steel wire.
Silicon chip processing of the present utility model also can be set to guide wheel device: described guide wheel is provided with and the identical guided wheel slot of described cutting steel wire bar number.
Compared with prior art, the utlity model has following beneficial effect: silicon chip processing of the present utility model is cooled off the mortar mouth with guide wheel device by being provided with one, so that the temperature of cutting steel wire in the control cutting process, thereby it is too high and cause guide wheel wearing and tearing to avoid cutting wire temperature, can effectively control the quality of guide wheel.
[description of drawings]
Fig. 1 is the structural representation of silicon chip processing of the present utility model with guide wheel device.
[specific embodiment]
See also shown in Figure 1ly, the utility model is an a kind of silicon chip processing guide wheel device, and it comprises four guide wheels 1 and is wrapped in some cutting steel wires 2 on four guide wheels 1.Described four guide wheels 1 are the two rows setting, are provided with and the identical guided wheel slot 11 of 2 numbers of described cutting steel wire with each guide wheel 1, and each cuts steel wire 2 and is embedded in the guided wheel slot 11.Between the described row's of going up two guide wheels 1, be provided with one and be used to reduce the cooling mortar mouth 3 that cuts steel wire 2 temperature, described cooling mortar mouth 3 is positioned at the top of cutting steel wire 2, when cutting steel wire 2 temperature were too high, this cooling mortar mouth 3 started the temperature that is used to reduce cutting steel wire 2 surfaces.
Silicon chip of the present utility model processing is provided with a cooling mortar mouth 3 with the guide wheel device mat, so that the temperature of cutting steel wire 2 in the control cutting process, thereby it is too high and cause that guide wheel 1 weares and teares to avoid cutting wire temperature 2, can effectively control the quality of guide wheel 1.
The above specific embodiment only is the preferred embodiment of this creation, not in order to limiting this creation, all in this creation spirit and principle within made any modification, be equal to replacement, improvement etc., all should be included within the protection domain of this creation.
Claims (1)
1. a silicon chip is processed and is used guide wheel device, it comprises four guide wheels and is wrapped in some cutting steel wires on four guide wheels, described four guide wheels are the two rows setting, it is characterized in that: between the described row's of going up two guide wheels, be provided with one and be used to reduce the cooling mortar mouth that cuts wire temperature, described cooling mortar mouth is positioned at the top of cutting steel wire, and described guide wheel is provided with and the identical guided wheel slot of described cutting steel wire bar number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201536639U CN202071234U (en) | 2011-05-16 | 2011-05-16 | Guide wheel device for processing silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201536639U CN202071234U (en) | 2011-05-16 | 2011-05-16 | Guide wheel device for processing silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202071234U true CN202071234U (en) | 2011-12-14 |
Family
ID=45109343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201536639U Expired - Fee Related CN202071234U (en) | 2011-05-16 | 2011-05-16 | Guide wheel device for processing silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202071234U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106985052A (en) * | 2017-04-18 | 2017-07-28 | 天津大学 | A kind of multi-rib grinding processing unit (plant) |
-
2011
- 2011-05-16 CN CN2011201536639U patent/CN202071234U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106985052A (en) * | 2017-04-18 | 2017-07-28 | 天津大学 | A kind of multi-rib grinding processing unit (plant) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111214 Termination date: 20150516 |
|
| EXPY | Termination of patent right or utility model |