CN202066398U - Loop heat pipe structure - Google Patents
Loop heat pipe structure Download PDFInfo
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- CN202066398U CN202066398U CN2011201329840U CN201120132984U CN202066398U CN 202066398 U CN202066398 U CN 202066398U CN 2011201329840 U CN2011201329840 U CN 2011201329840U CN 201120132984 U CN201120132984 U CN 201120132984U CN 202066398 U CN202066398 U CN 202066398U
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- heat pipe
- loop circuit
- pipe structure
- capillary layer
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Abstract
The utility model relates to a loop heat pipe structure, comprising a body and a first pipe body, wherein the body is provided with a first chamber, a first capillary layer and a bottom part, the first capillary layer is arranged in the first chamber, the first pipe body is provided with a first inlet end and a first outlet end to be communicated with the body, and the first inlet end is provided with a second chamber to be communicated with the first capillary layer; by adopting the structure, the integral height of the body can be reduced, overhigh vapor pressure in the body can be avoided, and the integral heat-dissipation efficiency of the loop heat pipe can be promoted.
Description
Technical field
A kind of loop circuit heat pipe structure, You Zhike significantly reduces the height of evaporimeter, and is limited to overcome usage space, effectively prevents the loop circuit heat pipe structure of heat leak problem simultaneously.
Background technology
Along with the progress of semiconductor science and technology, integrated circuit (IC) has been used in the wafer of electronic installations such as PC, notebook computer and network server in large quantities.Yet, because the processing speed and the function of integrated circuit significantly improve, make the corresponding used heat that produces of integrated circuit also significantly increase, if can not effectively this used heat be got rid of, cause electronic installation to lose efficacy easily.Therefore, various radiating modes are suggested, so that the used heat that can promptly integrated circuit be produced is got rid of, avoid taking place the situation that electronic installation lost efficacy.
Design has reservoir or additional chamber (resevior/compensation chamber) to store an amount of working fluid (fluid) with regard to traditional loop circuit heat pipe (Loop Heat Pipe LHP), making evaporimeter (evaporator) can obtain suitable fluid replenishes and can hold the Volume Changes that working fluid causes because of variable density, and further filter gas (gas) or bubble (bubble), make it unlikelyly hindered and damaged by it.
Although loop circuit heat pipe (Loop Heat Pipe LHP) has numerous advantages, but because traditional loop circuit heat pipe adopts the cylindrical structure evaporimeter, make the evaporimeter of loop circuit heat pipe need bigger space, simultaneously because its cylindrical outer surface is an arc surface, so can't directly contact with thermal source.In view of this develop another flat type loop heat pipe, should replenish chamber (compensation chamber) structure and be located at the top of the capillary structure of evaporimeter, but serious heat leak problem appears in the structure of this loop circuit heat pipe (Loop Heat Pipe LHP) easily, thereby order starts the difficulty that becomes, and will produce higher entire thermal resistance.
In addition, classic flat-plate formula loop circuit heat pipe case material is general to be identical material with this base plate, and the evaporimeter base plate is pursued high-termal conductivity, moreover, the particularity of this flat type loop heat pipe structure, so when the evaporimeter baseplate heated, it is very serious by the inner working fluid problem in the heat conduction heat make-up chamber (resevior/compensation chamber) of other walls except that base plate, sometimes this portion of hot even can be suitable by core (Wick) the heat leak phenomenon that structure produced with evaporimeter inside, when the hot property of above-mentioned two kinds of information summary effect flat type loop heat pipes of following time becomes very poor, can not bring into play the advantage of flat type loop heat pipe fully.
Moreover existing electronic device design is more and more compact, so the inner space is many with respect to diminishing, thus limited on the generation space, the excessive and blocked up problem that then becomes primary improvement of thickness of the whole size of heat abstractor.
Summary of the invention
Main purpose of the present utility model is to provide a kind of heat leak phenomenon that prevents to influence the loop circuit heat pipe structure of the heat dissipation of loop circuit heat pipe.
Secondary objective of the present utility model is to provide a kind of loop circuit heat pipe whole height that reduces to adapt to the loop circuit heat pipe structure of narrower usage space.
For reaching above-mentioned purpose, the utility model provides a kind of loop circuit heat pipe structure, and it comprises:
One body, have one first chamber, one first capillary layer, a bottom and at least one groove, this first capillary layer is located in aforementioned first chamber and is defined one first main chamber and one first secondary cavity, described first capillary layer is filled with working fluid, and described groove is located at one of them of aforementioned first capillary layer and this bottom;
One first body, have one first arrival end and one first port of export, this first arrival end has one second chamber and wears aforementioned body one side and be communicated with this first capillary layer, and this first port of export is arranged in aforementioned body opposite side and is communicated with aforementioned first secondary cavity.
Described loop circuit heat pipe structure, wherein, described body has more a lid and a base plate, described lid covers with this base plate is corresponding, aforementioned first capillary layer is located on the aforementioned base plate and with described base plate and is defined aforementioned first main chamber and this first secondary cavity jointly, and described groove is located at one of them of aforementioned base plate and this first capillary layer.
Described loop circuit heat pipe structure, wherein, described second chamber has one second capillary layer.
Described loop circuit heat pipe structure, wherein, this body has more a work body.
Described loop circuit heat pipe structure, wherein, described first capillary layer is one of them of agglomerated powder opisthosoma, grid body, carbon fiber and graphite.
Described loop circuit heat pipe structure, wherein, effective capillary radius of described second capillary layer is more than or equal to this first capillary layer.
Described loop circuit heat pipe structure, wherein, the thermal conductivity factor of described second capillary layer is lower than the thermal conductivity factor of this first capillary layer.
Described loop circuit heat pipe structure, wherein, the described first body string overlaps a plurality of radiating fins.
Described loop circuit heat pipe structure, wherein, have more one second body, have one second arrival end and one second port of export, this second arrival end has one the 3rd chamber and wears aforementioned body one side and be communicated with this first capillary layer, and this second port of export is arranged in this body opposite side and is communicated with aforementioned first secondary cavity.
Described loop circuit heat pipe structure, wherein, described the 3rd chamber has one the 3rd capillary layer.
Described loop circuit heat pipe structure, wherein, the permeability of described second capillary layer is more than or equal to this first capillary layer.
Described loop circuit heat pipe structure, wherein, the permeability of described the 3rd capillary layer is more than or equal to this first capillary layer.
Described loop circuit heat pipe structure, wherein, described first body connects establishes a condensing unit.
Described loop circuit heat pipe structure, wherein, described first body connects establishes a water cooling plant.
Described loop circuit heat pipe structure, wherein, described second body connects establishes a condensing unit.
Described loop circuit heat pipe structure, wherein, described second body connects establishes a water cooling plant.
Described loop circuit heat pipe structure, wherein, this first arrival end is flat.
Described loop circuit heat pipe structure, wherein, this second arrival end is flat.
Described loop circuit heat pipe structure wherein, has more one the 4th capillary layer, and described the 4th capillary layer is located at aforementioned first capillary layer, one side.
Described loop circuit heat pipe structure, wherein, described first secondary cavity has one first end and one second end, described first end is connected with this second end, and this first secondary cavity by this second end to this first end convergent gradually.
By second chamber is arranged at this body exterior, not only can effectively prevent from the working fluid in second chamber to be heated to the vapour-liquid biphase equilibrium that very high temperature produced high temperature from the heat leak of first capillary layer, and in second chamber, produce too high saturated vapor pressure, stop the liquid in this steam pressure body to be back in second chamber, more can significantly reduce the height of this body, and then effectively adapt to any occasions with limited space.
Description of drawings
Fig. 1 is the first embodiment three-dimensional exploded view of the utility model loop circuit heat pipe structure;
Fig. 2 is the first embodiment three-dimensional combination figure of the utility model loop circuit heat pipe structure;
Fig. 3 a is the first embodiment A-A profile of the utility model loop circuit heat pipe structure;
Fig. 3 b is another A-A profile of first embodiment of the utility model loop circuit heat pipe structure;
Fig. 3 c is the first Embodiment C-C profile of the utility model loop circuit heat pipe structure;
Fig. 4 a is the first Embodiment B-B profile of the utility model loop circuit heat pipe structure;
Fig. 4 b is another B-B profile of first embodiment of the utility model loop circuit heat pipe structure;
Fig. 5 a is the three-dimensional exploded view of second embodiment of the utility model loop circuit heat pipe structure;
Fig. 5 b is another three-dimensional exploded view of second embodiment of the utility model loop circuit heat pipe structure;
Fig. 6 is the three-dimensional combination figure of second embodiment of the utility model loop circuit heat pipe structure;
Fig. 7 is the three-dimensional combination figure of the 3rd embodiment of the utility model loop circuit heat pipe structure;
Fig. 8 is the three-dimensional combination figure of the 4th embodiment of the utility model loop circuit heat pipe structure;
Fig. 9 a is the D-D cutaway view of the 4th embodiment of the utility model loop circuit heat pipe structure;
Fig. 9 b is the D-D cutaway view of the 4th embodiment of the utility model loop circuit heat pipe structure;
Figure 10 is the three-dimensional exploded view of the 5th embodiment of the utility model loop circuit heat pipe structure;
Figure 11 is the three-dimensional combination figure of the 6th embodiment of the utility model loop circuit heat pipe structure;
Figure 12 is the three-dimensional combination figure of the 7th embodiment of the utility model loop circuit heat pipe structure;
Figure 13 is the assembled sectional view of the 8th embodiment of the utility model loop circuit heat pipe structure.
Description of reference numerals: 1-body; The 1a-lid; The 1b-base plate; 11-first chamber; 111-first main chamber; 112-first secondary cavity; 12-first capillary layer; The 13-bottom; The 14-groove; The 15-body of working; 16-the 4th capillary layer; 2-first body; 21-first arrival end; 211-second chamber; 2111-second capillary layer; 22-first port of export; The 3-working fluid; The 4-radiating fin; 5-second body; 51-second arrival end; 511-the 3rd chamber; 512-the 3rd capillary layer; 52-second port of export; The 6-condensing unit; The 7-water cooling plant.
The specific embodiment
Characteristic on above-mentioned purpose of the present utility model and structure thereof and the function will be illustrated according to the preferred embodiment of appended accompanying drawing.
See also Fig. 1, Fig. 2, Fig. 3 a, Fig. 3 b, Fig. 3 c, Fig. 4 a, Fig. 4 b, be the three-dimensional decomposition of first embodiment of the utility model loop circuit heat pipe structure and combination and A-A and B-B and C-C profile, as shown in the figure, described loop circuit heat pipe structure comprises: a body 1, one first body 2;
Described body 1 has one first chamber 11, one first capillary layer 12, a bottom 13 and at least one groove 14; Wherein first capillary layer 12 is located in aforementioned first chamber 11, and define one first main chamber 111 and one first secondary cavity 112, described first capillary layer 12 is filled with working fluid 3, described groove 14 can select to be located at aforementioned first capillary layer 12 (shown in Fig. 3 a) and this bottom 13 (shown in Fig. 3 b) one of them, described groove 14 is spaced and is arranged at this bottom 13 (shown in Fig. 3 c).
Described first body 2 has one first arrival end 21 and one first port of export 22, this first arrival end 21 has one second chamber 211 and wears aforementioned body 1 one sides, and be communicated with this first capillary layer 12, this first port of export 22 is arranged in aforementioned body 1 opposite side, and being communicated with aforementioned first secondary cavity 112 (shown in Fig. 4 a), described second chamber 211 also can be provided with one second capillary layer 2111 (shown in Fig. 4 b).
Described first capillary layer 12 may be selected to be agglomerated powder opisthosoma, grid body, carbon fiber and graphite one of them, present embodiment is with the agglomerated powder opisthosoma as an illustration but do not regard it as and exceed.
Described body 1 has more a work body 15, and these work body 15 1 ends are communicated with this first chamber 11.
See also Fig. 5 a, Fig. 5 b, Fig. 6, for the solid of second embodiment of the utility model loop circuit heat pipe structure is decomposed and constitutional diagram, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, so will repeat no more at this, yet present embodiment and the aforementioned first embodiment difference are described body 1 has more a lid 1a and a base plate 1b, described lid 1a and corresponding the covering of this base plate 1b, aforementioned first capillary layer 12 is located on the aforementioned base plate 1b, and define aforementioned first main chamber 111 and this first secondary cavity 112 jointly, and described groove 14 select to be located at base plate 1b (shown in Fig. 5 a) and first capillary layer 12 (shown in Fig. 5 b) one of them.
See also Fig. 7, three-dimensional combination figure for the 3rd embodiment of the utility model loop circuit heat pipe structure, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, so will repeat no more at this, yet present embodiment and the aforementioned first embodiment difference are a plurality of radiating fins 4 of described first body, 2 string covers.
See also Fig. 8, Fig. 9 a, Fig. 9 b, constitutional diagram and D-D cutaway view for the 4th embodiment of the utility model loop circuit heat pipe structure, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, so will repeat no more at this, yet present embodiment and the aforementioned first embodiment difference are present embodiment to be had more one second body 5 and has one second arrival end 51 and one second port of export 52, this second arrival end 51 has one the 3rd chamber 511, and wear aforementioned body 1 one sides and be communicated with this first capillary layer 12, this second port of export 52 is arranged in this body 1 opposite side, and being communicated with aforementioned first secondary cavity 112, described the 3rd chamber 511 also can be provided with one the 3rd capillary layer 512 (shown in Fig. 9 b).
See also Figure 10, three-dimensional exploded view for the 5th embodiment of the utility model loop circuit heat pipe structure, as shown in the figure, the present embodiment part-structure is identical with aforementioned second embodiment, so will repeat no more at this, yet present embodiment and the aforementioned second embodiment difference are that present embodiment has more one the 4th capillary layer 16, and described the 4th capillary layer 16 is located at aforementioned first capillary layer, 12 1 sides.
See also Figure 11, three-dimensional combination figure for the 6th embodiment of the utility model loop circuit heat pipe structure, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, so will repeat no more at this, and connect and establish a condensing unit 6 yet present embodiment and the aforementioned first embodiment difference are described first body 2 of present embodiment and second body 5.
See also Figure 12, three-dimensional combination figure for the 7th embodiment of the utility model loop circuit heat pipe structure, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, so will repeat no more at this, establish a water cooling plant 7 yet present embodiment and the aforementioned first embodiment difference described first and second body 2,5 that is present embodiment connects.
The permeability of combining described second and third capillary layer 2111,512 of aforementioned each embodiment can be more than or equal to this first capillary layer 12, and this first and second arrival end 21,52 is flat.
See also Figure 13, three-dimensional combination figure for the 8th embodiment of the utility model loop circuit heat pipe structure, as shown in the figure, the present embodiment part-structure is identical with aforementioned first embodiment, so will repeat no more at this, yet present embodiment and the aforementioned first embodiment difference are described first secondary cavity 112 of present embodiment has one first end 1121 and one second end 1122, described first end 1121 is connected with this second end 1122, and this first secondary cavity 112 by this second end 1122 to this first end 1121 convergent gradually.
Effective capillary radius of described second capillary layer 2111 is more than or equal to this first capillary layer 12, and the thermal conductivity factor of described second capillary layer 2111 is lower than the thermal conductivity factor of this first capillary layer 12.
Please consult Fig. 1 to Figure 13 again, as shown in the figure, when described loop circuit heat pipe structure is used, the capillary radius of aforementioned first capillary layer 12 (effectively capillary radius) is smaller than or equals the capillary radius (effectively capillary radius) of second capillary layer 2111, and second capillary layer 2111 of selecting for use thermal conductivity factor to be lower than this first capillary layer 12 can increase the thermal resistance between this body 1 and second chamber 211, and then the heat from body 1 inverse osmosis to second chamber 211 when reducing by 1 work of this body; Again because second chamber 211 is located at the heat leak situations that heat that body 1 outside effectively prevents first capillary layer 12 in first chamber 11 enters in second chamber 2111 takes place, thereby the working fluids 3 in second chamber 211 are heated to high temperature, make the vapour-liquid biphase equilibrium that forms excessive temperature in second chamber 2111, thereby produce too high saturated vapour pressure, stop the working fluid 3 in first body 2 to be got back among second chamber 2111.
Structural design in sum can produce preferable heat lock (heat lock) effect.
This structure not only can satisfy the capillary force that provides this loop circuit heat pipe structural entity required, can make the loop circuit heat pipe structure can running smoothly under the condition of the following or antigravity of standard again, and produces less local thermal resistance.
The utility model major advantage such as following:
1, body 1 inside has only first capillary layer 12 (core (Wick)) and groove 14, and second chamber 211 of loop circuit heat pipe (Loop Heat Pipe LHP) and the 3rd chamber 511 are set at the outside portion of loop circuit heat pipe (Loop Heat Pipe LHP) body 1, promptly outside two outside wall surface perpendicular to groove 14 directions of loop circuit heat pipe (Loop Heat Pipe LHP).
2, described second chamber 211 and the 3rd chamber 511 outside that can be arranged at the body 1 non-steam (vapor) outlet of loop circuit heat pipe (Loop Heat Pipe LHP) gets final product, and promptly all can in three sides of body 1 outside that is connected with first secondary cavity 112.
3, the shape of first arrival end 21 of first body 2 and second body 5 and second arrival end 51 can be big pipe, flattening pipe, square cavity and other cross sections and shape space.
4, first arrival end 21 and second arrival end, 51 inner employings are satisfied first capillary layer (core (Wick)) structure Design requirement.
5, second chamber 211 and the 3rd chamber 511 size design should be able to be held the caused fluctuation of working medium Volume Changes that causes owing to variations in temperature.
6, because the utility model is the outside that second chamber 211 and the 3rd chamber 511 is placed on body 1, and carry out contacting of small cross sectional with the lateral wall of body 1, so leaking into the heat of second chamber 211 and the 3rd chamber 511 inside by body 1 will be less, promptly from when loop circuit heat pipe (Loop Heat Pipe LHP) starts, the saturated vapour pressure difference of the body 1 and second chamber 211 and the 3rd chamber 511 inside can satisfy the startup demand of loop circuit heat pipe (Loop Heat Pipe LHP).
7, can effectively reduce loop circuit heat pipe (Loop Heat Pipe LHP) body 1 appearance and size, promptly or be the height that reduces body 1, or reduce to be parallel to body 1 size of thermal source surface direction.
8, as long as the volume size design of second chamber 211 and the 3rd chamber 511 is proper, the utility model can be controlled at small range with the entire thermal resistance of this loop circuit heat pipe (Loop Heat Pipe LHP).
9, again because second chamber 211 is located at this body 1 outside, so can significantly reduce the height of this body, have significantly for slimming and improve, and then the elasticity of the whole use of order with increase.
Claims (20)
1. a loop circuit heat pipe structure is characterized in that, comprises:
One body, have one first chamber, one first capillary layer, a bottom and at least one groove, this first capillary layer is located in aforementioned first chamber and is defined one first main chamber and one first secondary cavity, described first capillary layer is filled with working fluid, and described groove is located at one of them of aforementioned first capillary layer and this bottom;
One first body, have one first arrival end and one first port of export, this first arrival end has one second chamber and wears aforementioned body one side and be communicated with this first capillary layer, and this first port of export is arranged in aforementioned body opposite side and is communicated with aforementioned first secondary cavity.
2. loop circuit heat pipe structure as claimed in claim 1, it is characterized in that, described body has more a lid and a base plate, described lid covers with this base plate is corresponding, aforementioned first capillary layer is located on the aforementioned base plate and with described base plate and is defined aforementioned first main chamber and this first secondary cavity jointly, and described groove is located at one of them of aforementioned base plate and this first capillary layer.
3. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, described second chamber has one second capillary layer.
4. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, this body has more a work body.
5. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, described first capillary layer is one of them of agglomerated powder opisthosoma, grid body, carbon fiber and graphite.
6. loop circuit heat pipe structure as claimed in claim 3 is characterized in that, effective capillary radius of described second capillary layer is more than or equal to this first capillary layer.
7. loop circuit heat pipe structure as claimed in claim 3 is characterized in that the thermal conductivity factor of described second capillary layer is lower than the thermal conductivity factor of this first capillary layer.
8. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, the described first body string overlaps a plurality of radiating fins.
9. loop circuit heat pipe structure as claimed in claim 1, it is characterized in that, have more one second body, have one second arrival end and one second port of export, this second arrival end has one the 3rd chamber and wears aforementioned body one side and be communicated with this first capillary layer, and this second port of export is arranged in this body opposite side and is communicated with aforementioned first secondary cavity.
10. loop circuit heat pipe structure as claimed in claim 9 is characterized in that, described the 3rd chamber has one the 3rd capillary layer.
11. loop circuit heat pipe structure as claimed in claim 3 is characterized in that, the permeability of described second capillary layer is more than or equal to this first capillary layer.
12. loop circuit heat pipe structure as claimed in claim 10 is characterized in that, the permeability of described the 3rd capillary layer is more than or equal to this first capillary layer.
13. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, described first body connects establishes a condensing unit.
14. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, described first body connects establishes a water cooling plant.
15. loop circuit heat pipe structure as claimed in claim 9 is characterized in that, described second body connects establishes a condensing unit.
16. loop circuit heat pipe structure as claimed in claim 9 is characterized in that, described second body connects establishes a water cooling plant.
17. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, this first arrival end is flat.
18. loop circuit heat pipe structure as claimed in claim 9 is characterized in that, this second arrival end is flat.
19. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, has more one the 4th capillary layer, described the 4th capillary layer is located at aforementioned first capillary layer, one side.
20. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, described first secondary cavity has one first end and one second end, and described first end is connected with this second end, and this first secondary cavity by this second end to this first end convergent gradually.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201329840U CN202066398U (en) | 2011-04-29 | 2011-04-29 | Loop heat pipe structure |
| TW100209286U TWM413109U (en) | 2011-04-29 | 2011-05-24 | Improved structure of loop-configured heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201329840U CN202066398U (en) | 2011-04-29 | 2011-04-29 | Loop heat pipe structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202066398U true CN202066398U (en) | 2011-12-07 |
Family
ID=45060259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201329840U Expired - Fee Related CN202066398U (en) | 2011-04-29 | 2011-04-29 | Loop heat pipe structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202066398U (en) |
| TW (1) | TWM413109U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109631635A (en) * | 2018-03-09 | 2019-04-16 | 青岛金玉大商贸有限公司 | A kind of loop circuit heat pipe storage heater of heat storage capacity variation |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI640740B (en) * | 2017-12-29 | 2018-11-11 | 奇鋐科技股份有限公司 | Vapor-liquid flow heat transfer module |
| TWI657226B (en) * | 2017-12-29 | 2019-04-21 | 奇鋐科技股份有限公司 | Two-phase fluid heat transfer structure |
| JP6688863B2 (en) * | 2018-09-14 | 2020-04-28 | 古河電気工業株式会社 | Cooling device and cooling system using the cooling device |
-
2011
- 2011-04-29 CN CN2011201329840U patent/CN202066398U/en not_active Expired - Fee Related
- 2011-05-24 TW TW100209286U patent/TWM413109U/en not_active IP Right Cessation
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109631635A (en) * | 2018-03-09 | 2019-04-16 | 青岛金玉大商贸有限公司 | A kind of loop circuit heat pipe storage heater of heat storage capacity variation |
| CN109631635B (en) * | 2018-03-09 | 2020-04-10 | 青岛佰腾科技有限公司 | Loop heat pipe heat accumulator with variable heat accumulation capacity |
| CN111397412A (en) * | 2018-03-09 | 2020-07-10 | 青岛佰腾科技有限公司 | Loop heat pipe heat accumulator with different upper and lower heat accumulation capacities |
| CN111397413A (en) * | 2018-03-09 | 2020-07-10 | 青岛佰腾科技有限公司 | Loop heat pipe heat accumulator |
| CN111397414A (en) * | 2018-03-09 | 2020-07-10 | 青岛佰腾科技有限公司 | Loop heat pipe heat accumulator |
| CN111397414B (en) * | 2018-03-09 | 2021-01-29 | 青岛佰腾科技有限公司 | Loop heat pipe heat accumulator |
| CN111397412B (en) * | 2018-03-09 | 2021-01-29 | 青岛佰腾科技有限公司 | Loop heat pipe heat accumulator with different upper and lower heat accumulation capacities |
| CN111397413B (en) * | 2018-03-09 | 2021-02-26 | 青岛乾福圣耀商贸有限公司 | Loop heat pipe heat accumulator |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM413109U (en) | 2011-10-01 |
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| GR01 | Patent grant | ||
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Owner name: BEIJING QIHONG TECHNOLOGY R+D CENTER CO., LTD. Free format text: FORMER OWNER: ASIA VITAL COMPONENTS (SHENZHEN) CO., LTD. Effective date: 20120329 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 518000 SHENZHEN, GUANGDONG PROVINCE TO: 100085 HAIDIAN, BEIJING |
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| TR01 | Transfer of patent right |
Effective date of registration: 20120329 Address after: 100085, Beijing, Haidian District on the five street, No. five high building 3 on the eastern side of the two thousand Patentee after: Beijing Qihong Technology Research & Development Center Co., Ltd. Address before: 518000, Shenzhen, Guangdong province Baoan District manhole street, Xin Min community Western Industrial Park Patentee before: Qihong Electronics (Shenzhen) Co., Ltd. |
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| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 100100, Beijing, Wangjing, Chaoyang District new industrial zone 3 block, Wangjing science and technology development building, four floor, A3A01 Patentee after: Beijing Qihong Technology Research & Development Center Co., Ltd. Address before: 100085, Beijing, Haidian District on the five street, No. five high building 3 on the eastern side of the two thousand Patentee before: Beijing Qihong Technology Research & Development Center Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20160429 |