CN202040888U - Semiconductor ground-heating water heating device - Google Patents
Semiconductor ground-heating water heating device Download PDFInfo
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- CN202040888U CN202040888U CN2011201163756U CN201120116375U CN202040888U CN 202040888 U CN202040888 U CN 202040888U CN 2011201163756 U CN2011201163756 U CN 2011201163756U CN 201120116375 U CN201120116375 U CN 201120116375U CN 202040888 U CN202040888 U CN 202040888U
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- floor heating
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Abstract
The utility model relates to a semiconductor ground-heating water heating device, which comprises a water storage tank and a water pump, a semiconductor heater, a pneumatic ball valve, a water inlet pipe, a water consumption distributing pipe and a water return pipe, wherein the water pump, the semiconductor heater, the pneumatic ball valve, the water inlet pipe, the water consumption distributing pipe and the water return pipe are connected in sequence; a water inlet of the water pump is connected with a water outlet of the water storage tank; and an outlet of the water return pipe is connected with a water return port of the water storage tank. The semiconductor ground-heating water heating device is characterized in that the water storage tank comprises a tank body with an upward opening and a water injection port cover arranged on the tank body in a dismountable way. Compared with the prior art, the semiconductor ground-heating water heating device adopts the open type water storage tank and the water return pipe with an opened outlet, the use of a water collector and a water filling tank is avoided, and simultaneously the non-ventilation phenomenon in a loop of a water distributor and the water collector in the existing ground-heating water heating device and the fussy procedure of needing to carry out gas exhaust when in season change are effectively solved.
Description
Technical field
The utility model relates to a kind of semiconductor floor heating hot water apparatus.
Background technology
Existing in the market floor heating hot water apparatus generally includes water knockout drum, water collector, water pump and electricity (coal) boiler and forms, give room ground heating floor heat supply to realize it, and its water pump water inlet end also need dispose water supply tank and carries out moisturizing, its water knockout drum and water collector end need the designing and arranging air valve, its water route circulation time needs artificial exhaust, because water knockout drum and water collector loop air bleeding valve capacity are limited, the air in the water route is difficult to emptying, thus often occur feeling suffocated with heat can not the normal supply phenomenon.And all to carry out artificial exhaust during every reusing, very trouble.
And when electricity (coal) boiler, water pump, water supply tank and pipe fitting were installed on the water passage circulation system of water knockout drum and water collector, its construction was loaded down with trivial details, cost is high, if no professional construction can't be finished its engineering.
Simultaneously, because of existing floor heating hot water apparatus, adopting electricity (coal) boiler is thermal source, exist power consumption big, seriously polluted, be afraid of dry combustion method, defectives such as volume is big, the life-span is short, use cost is high, poor stability, so be difficult to extensively be promoted, also do not meet the requirement of national energy-saving and emission-reduction policy.
Summary of the invention
Technical problem to be solved in the utility model is that the present situation at prior art provides a kind of semiconductor floor heating hot water apparatus that need not use water collector and water supply tank, get final product exhaust in the current in the closed circuit, thereby avoided in the existing floor heating hot water apparatus in the water knockout drum and water collector loop feel suffocated phenomenon and change season after when restarting floor heating device the vent sequence that must carry out, reduce employed parts simultaneously, reduce cost.
Another technical problem to be solved in the utility model is the semiconductor floor heating hot water apparatus that the present situation at prior art provides a kind of user of convenience to install voluntarily.
Another problem to be solved in the utility model provides a kind of semiconductor floor heating hot water apparatus that need not water knockout drum.
The utility model solves the problems of the technologies described above the technical scheme that is adopted: this semiconductor floor heating hot water apparatus, comprise shell and storage tank in the enclosure, the water pump that is connected successively, semiconductor heat booster, pneumatic ball valve, water inlet pipe, water shunt and return pipe are set, wherein, the water inlet of described water pump connects the delivery port of described storage tank, and the outlet of described return pipe connects the water return outlet of described storage tank; It is characterized in that described storage tank comprises uncovered casing that makes progress and the dismountable flap that makes things convenient for water filling that is arranged on this casing.
Described tender filling hole cover and described casing are for being tightly connected, and described tender filling hole cover is provided with steam vent.
The bottom surface of the inherent described casing of described storage tank is provided with and the isolated cavity of water storage on every side, is provided with temperature sensor in this cavity, and described temperature sensor connects the attemperating unit of the described semiconductor heat booster work of control.
Described water inlet pipe and described with passing through the multiple-pass joint socket connection between the water loop.
Correspondingly respectively on the sidewall of described shell and described casing be provided with the observation window that water level in the storage tank is observed in transparent being used to.
Described semiconductor heat booster is bearing on the support, and this support and described storage tank, described water pump are positioned on the shell bottom plate.
The end cap of described water pump is provided with to be installed footing and screw is installed, and footing will be installed be positioned on the described shell bottom plate described water pump is connected with described shell bottom plate thereby screw passes corresponding installation screw; Design is useful on fixing installation footing and screw is installed in the water side capping of described semiconductor heat booster, footing will be installed be positioned on the described shell bottom plate described semiconductor heat booster is connected with described shell bottom plate thereby screw passes corresponding installation screw.
The top of water return outlet is equipped with and prevents that current from going out the buffer cap of storage tank in the described storage tank, and these buffer cap both sides are provided with the outlet that the stream that supplies water flows out
In above-mentioned each scheme, the outlet of described return pipe connects described storage tank by pneumatic interface.
The water side of described semiconductor heat booster is provided with pneumatic ball valve, described water inlet pipe and this pneumatic ball valve socket connection.
Compared with prior art, the utility model adopts the open-type storage tank, cancelled necessary water collector of floor heating water circulation system and water supply tank in original technology, efficiently solved and change the complicated procedures that must carry out exhaust again in feel suffocated phenomenon and season in original floor heating hot water apparatus water knockout drum and the water collector loop; By on water return outlet, being provided with pneumatic joint, make return pipe directly to peg graft, installation is simple, convenient, reliable, makes things convenient for the user to install voluntarily; The utility model has adopted multiple-pass joint to replace water knockout drum simultaneously, and is simple in structure, conveniently freely changes; Adopt semiconductor heat booster as thermal source floor heating water to be heated, characteristic such as utilize that it is temp autocontrolled, power self-regulated, the flames of anger when using, dry combustion method do not damage has been simplified floor heating hot water apparatus structure and safe and reliable, energy-conserving and environment-protective, cost is low.
Description of drawings
Fig. 1 is the floor map of the utility model embodiment decomposition texture;
Fig. 2 is the floor map of buffer cap among the utility model embodiment;
Fig. 3 is the cutaway view along A-A line among Fig. 2;
Fig. 4 is the vertical view of the utility model embodiment medium-height trestle;
Fig. 5 is the front view of the utility model embodiment medium-height trestle;
Fig. 6 is the floor map of water pump end cover structure among the utility model embodiment.
The specific embodiment
Embodiment describes in further detail the utility model below in conjunction with accompanying drawing.
As shown in Figure 1, this semiconductor floor heating hot water apparatus comprises:
Storage tank is used for storing the heating water, comprises casing 15 and tender filling hole cover 14.The periphery of casing 15 and tender filling hole cover 14 is tightly connected, and tender filling hole cover 14 is provided with steam vent 16.The bottom surface of casing 15 is provided with delivery port and water return outlet.Water return outlet is provided with pneumatic interface 11, makes things convenient for the user to connect voluntarily; Also be provided with buffer cap 51 on the inherent water return outlet of casing, the both sides of buffer cap are provided with the outlet 52 that the stream that supplies water flows out.The sidewall of casing 15 is provided with the transparent windows 12 that is used for water level in the inspection box, be provided with also on the bottom surface of casing that embedded blind hole constitutes with the isolated cavity 13 of water storage on every side, be provided with the temperature sensor (not shown) in this cavity, this temperature sensor connects the attemperating unit 6 of the following heater work of control.The top of storage tank is provided with tender filling hole cover 14.
Shell bottom plate 7 is arranged on the below of storage tank, is connected with the base plate of casing, is used for fixing parts such as casing, water pump, semiconductor heat booster.
Semiconductor heat booster 3, it is that PTC semiconductor liquid heater among the ZL201120012877.4 is as thermal source that present embodiment is selected the patent No. for use, realization is to the heating of floor heating recirculated water, and utilize that it is temp autocontrolled, characteristic such as power self-regulated, the flames of anger when using, dry combustion method do not damage, make that its floor heating hot water apparatus is simple in structure, safe and reliable, energy-conserving and environment-protective, to purchase use cost low.This semiconductor heat booster is bearing on the support 8, and this support 8 is provided with the die cavity 81 that is used to locate semiconductor heat booster 3, and fixedly the baseplane is parallel with support for this die cavity, and the installing hole on the baseplane is vertical with its fixed pan.Support 8 is provided with screw 82, is fixed on the shell bottom plate 7 by screw.
One end of this semiconductor heat booster connects the outlet of water pump 2, and the other end connects pneumatic ball valve 4.
Pneumatic ball valve 4 is positioned at the below of support 8, and its water inlet connects the delivery port of semiconductor heat booster, and its delivery port is provided with pneumatic interface, and water inlet pipe 10 can directly be plugged on this pneumatic interface, makes things convenient for the user to connect voluntarily.This water inlet pipe is single loop, can be connected along separate routes with each water by multiple-pass joint (not shown)s such as threeway, four-ways for the floor heating device that a plurality of waters shunt (not shown)s are arranged; Equally, each water can and flow by multiple-pass joint along separate routes and between the return pipe.
Return pipe 5 is carried back storage tank 1 with each water current along separate routes of collecting; The water side of return pipe is directly inserted solid on pneumatic interface 11 in the present embodiment.
Parts such as the storage tank in the present embodiment, semiconductor heat booster, pneumatic ball valve are arranged in the shell 9, and the sidewall of shell 9 is provided with and the corresponding display window 91 of above-mentioned observation window, are used for observing easily the liquid level in the storage tank.
The operation principle of present embodiment is as follows:
After the storage tank water filling meets the requirements, control system starts water pump and heater operation, after water enters water pump from the delivery port bottom the storage tank, at first pass through semiconductor heat booster, at this moment, semiconductor heat booster heats the water that passes through, and hot water is through each water shunt of pneumatic ball valve inflow place heating coil, with the surrounding environment heat exchange then.Current after the heat exchange enter return pipe behind four-way and stream, enter in the storage tank from the outlet of return pipe.Because the outlet of return pipe is open-type or claims open outlet in the present embodiment, so current have been got rid of the air in the closed circuit when entering storage tank.Avoided vent sequence.
The water that enters in the storage tank enters water pump from the storage tank bottom again, and reciprocation cycle according to this is constantly to provide hot water to each loop of floor heating.
Claims (10)
1. semiconductor floor heating hot water apparatus, comprise shell and storage tank in the enclosure, the water pump that is connected successively, semiconductor heat booster, pneumatic ball valve, water inlet pipe, water shunt and return pipe are set, wherein, the water inlet of described water pump connects the delivery port of described storage tank, and the outlet of described return pipe connects the water return outlet of described storage tank; It is characterized in that described storage tank comprises uncovered casing that makes progress and the dismountable flap that makes things convenient for water filling that is arranged on this casing; The top of water return outlet is equipped with and prevents that current from going out the buffer cap of storage tank in the described storage tank, and these buffer cap both sides are provided with the outlet that the stream that supplies water flows out.
2. semiconductor floor heating hot water apparatus according to claim 1 it is characterized in that described tender filling hole cover and described casing for being tightly connected, and described tender filling hole cover is provided with steam vent.
3. semiconductor floor heating hot water apparatus according to claim 1, the bottom surface that it is characterized in that the inherent described casing of described storage tank is provided with and the isolated cavity of water storage on every side, be provided with temperature sensor in this cavity, described temperature sensor connects the attemperating unit of the described semiconductor heat booster work of control.
4. semiconductor floor heating hot water apparatus according to claim 1 is characterized in that described water inlet pipe and described with passing through the multiple-pass joint socket connection between the water loop.
5. semiconductor floor heating hot water apparatus according to claim 1 is characterized in that correspondingly respectively on the sidewall of described shell and described casing being provided with the observation window that water level in the storage tank is observed in transparent being used to.
6. semiconductor floor heating hot water apparatus according to claim 1 is characterized in that described semiconductor heat booster is bearing on the support, and this support and described storage tank, described water pump are positioned on the shell bottom plate.
7. semiconductor floor heating hot water apparatus according to claim 1 is characterized in that in the described storage tank that the top of water return outlet is equipped with to prevent that current from going out the buffer cap of storage tank that these buffer cap both sides are provided with the outlet that the stream that supplies water flows out
8. semiconductor floor heating hot water apparatus according to claim 6, the end cap that it is characterized in that described water pump is provided with to be installed footing and screw is installed, and footing will be installed be positioned on the described shell bottom plate described water pump is connected with described shell bottom plate thereby screw passes corresponding installation screw; Described support is provided with to be installed footing and screw is installed, and footing will be installed be positioned on the described shell bottom plate described support is connected with described shell bottom plate thereby screw passes corresponding installation screw.
9. according to any described semiconductor floor heating of the claim hot water apparatus of claim 1 to 8, it is characterized in that the outlet of described return pipe connects described storage tank by pneumatic interface.
10. semiconductor floor heating hot water apparatus according to claim 9 is characterized in that the water side of described semiconductor heat booster is provided with pneumatic ball valve, described water inlet pipe and this pneumatic ball valve socket connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201163756U CN202040888U (en) | 2011-04-14 | 2011-04-14 | Semiconductor ground-heating water heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201163756U CN202040888U (en) | 2011-04-14 | 2011-04-14 | Semiconductor ground-heating water heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202040888U true CN202040888U (en) | 2011-11-16 |
Family
ID=44968329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201163756U Expired - Lifetime CN202040888U (en) | 2011-04-14 | 2011-04-14 | Semiconductor ground-heating water heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202040888U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102599089A (en) * | 2012-03-23 | 2012-07-25 | 上海海洋大学 | Deck-type discharge device |
| CN103939977A (en) * | 2014-05-13 | 2014-07-23 | 东南大学 | Heating device of double-drum phase change heating radiator and clothes drying room |
-
2011
- 2011-04-14 CN CN2011201163756U patent/CN202040888U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102599089A (en) * | 2012-03-23 | 2012-07-25 | 上海海洋大学 | Deck-type discharge device |
| CN103939977A (en) * | 2014-05-13 | 2014-07-23 | 东南大学 | Heating device of double-drum phase change heating radiator and clothes drying room |
| CN103939977B (en) * | 2014-05-13 | 2016-03-30 | 东南大学 | A kind of heating installation of twin-roll phase transformation radiator and drying room |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111116 |
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| CX01 | Expiry of patent term |