CN202008995U - 立柱阵列式水冷散热器 - Google Patents
立柱阵列式水冷散热器 Download PDFInfo
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- CN202008995U CN202008995U CN 201020615515 CN201020615515U CN202008995U CN 202008995 U CN202008995 U CN 202008995U CN 201020615515 CN201020615515 CN 201020615515 CN 201020615515 U CN201020615515 U CN 201020615515U CN 202008995 U CN202008995 U CN 202008995U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Application Number | Priority Date | Filing Date | Title |
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CN 201020615515 CN202008995U (zh) | 2010-11-19 | 2010-11-19 | 立柱阵列式水冷散热器 |
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CN 201020615515 CN202008995U (zh) | 2010-11-19 | 2010-11-19 | 立柱阵列式水冷散热器 |
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CN202008995U true CN202008995U (zh) | 2011-10-12 |
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CN 201020615515 Expired - Lifetime CN202008995U (zh) | 2010-11-19 | 2010-11-19 | 立柱阵列式水冷散热器 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102854954A (zh) * | 2012-08-27 | 2013-01-02 | 无锡市福曼科技有限公司 | 显卡的水冷装置 |
CN104669509A (zh) * | 2015-02-10 | 2015-06-03 | 华南理工大学 | 一种基于流场阵列排布的扰流柱及其制备方法与模具 |
CN105097731A (zh) * | 2015-08-05 | 2015-11-25 | 沈阳理工大学 | 一种柱状叶序排布结构的微型散热器 |
CN106061199A (zh) * | 2016-06-13 | 2016-10-26 | 东南大学 | 一种流动沸腾微小型换热器 |
-
2010
- 2010-11-19 CN CN 201020615515 patent/CN202008995U/zh not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102854954A (zh) * | 2012-08-27 | 2013-01-02 | 无锡市福曼科技有限公司 | 显卡的水冷装置 |
CN104669509A (zh) * | 2015-02-10 | 2015-06-03 | 华南理工大学 | 一种基于流场阵列排布的扰流柱及其制备方法与模具 |
CN105097731A (zh) * | 2015-08-05 | 2015-11-25 | 沈阳理工大学 | 一种柱状叶序排布结构的微型散热器 |
CN105097731B (zh) * | 2015-08-05 | 2018-01-02 | 沈阳理工大学 | 一种柱状叶序排布结构的微型散热器 |
CN106061199A (zh) * | 2016-06-13 | 2016-10-26 | 东南大学 | 一种流动沸腾微小型换热器 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI EAGTOP ELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WUHAN RENUO METAL TECHNOLOGY CO.,LTD. Effective date: 20120517 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 430082 WUHAN, HUBEI PROVINCE TO: 201604 SONGJIANG, SHANGHAI |
|
TR01 | Transfer of patent right |
Effective date of registration: 20120517 Address after: Songjiang District shihudong Town Industrial Park, Shanghai City, 201604 humin Road No. 158 Patentee after: Shanghai Eagtop Electronic Technology Co., Ltd. Address before: 430082 No. 43 metallurgical Avenue, Qingshan District, Hubei, Wuhan Patentee before: Wuhan Renuo Metal Technology Co., Ltd. |
|
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: Songjiang District shihudong Town Industrial Park, Shanghai City, 201604 humin Road No. 158 Patentee after: Shanghai Eagle Peak Polytron Technologies Inc Address before: Songjiang District shihudong Town Industrial Park, Shanghai City, 201604 humin Road No. 158 Patentee before: Shanghai Eagtop Electronic Technology Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20111012 |
|
CX01 | Expiry of patent term |