CN202008888U - Laminated ceramic element - Google Patents
Laminated ceramic element Download PDFInfo
- Publication number
- CN202008888U CN202008888U CN2010206928478U CN201020692847U CN202008888U CN 202008888 U CN202008888 U CN 202008888U CN 2010206928478 U CN2010206928478 U CN 2010206928478U CN 201020692847 U CN201020692847 U CN 201020692847U CN 202008888 U CN202008888 U CN 202008888U
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- CN
- China
- Prior art keywords
- laminated type
- electrode layer
- layer
- type ceramic
- conductive electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000919 ceramic Substances 0.000 title claims abstract description 64
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 4
- 229910001260 Pt alloy Inorganic materials 0.000 claims description 4
- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 claims description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 230000001186 cumulative effect Effects 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000001996 bearing alloy Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 18
- 229910052759 nickel Inorganic materials 0.000 abstract description 9
- 239000007788 liquid Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000009713 electroplating Methods 0.000 abstract description 2
- 238000003912 environmental pollution Methods 0.000 abstract description 2
- 239000002699 waste material Substances 0.000 abstract 2
- 238000004904 shortening Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 8
- 239000006071 cream Substances 0.000 description 5
- 230000004907 flux Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010891 toxic waste Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model discloses a laminated ceramic element comprising a ceramic main body. The interior of the ceramic main body is provided with inner electrodes interlaced left and right. Two ends of the ceramic main body are respectively provided with a conductive electrode layer to form an electrical contact with the inner electrodes interlaced left and right respectively, and a paste-type soldering tin layer is covered on the surface of each conductive electrode layer. The laminated ceramic element has the characteristics of avoiding an electroplating process, reducing the environmental pollution caused by electroplate liquid and saving expense for treating waste nickel electroplate liquid and waste tin electroplate liquid; and the laminated ceramic element has the advantages of saving the manufacturing cost and shortening working hours.
Description
Technical field
The utility model relates to a kind of multilayer ceramic element, particularly a kind of laminated type ceramic component.
Background technology
General common laminated type wafer passive device comprises laminated type ceramic condenser (MLCC), laminated type ceramic inductance (MLCI), laminated type piezo-resistance (MLV) or laminated type thermistor electronic ceramic elements such as (Multilayer Ceramic Thermistor).Below, this paper is loosely referred to as " laminated type ceramic component " with these electronic ceramic elements.
As shown in Figure 1, the structure of existing laminated type ceramic component 10 comprises a ceramic main body 20, and its two ends respectively are provided with an external electrode 30, and staggered interior electrode 40 constituted respectively with the external electrode 30 at two ends and electrically contacts about its inside then was provided with.
At present prior art is to utilize solder technology, and the external electrode 30 of laminated type ceramic component 10 is welded to tie point on the circuit board.So the external electrode 30 of laminated type ceramic component 10 need possess good soldering resistance, corrosion-resistant and oxidation resistance.
For reaching this purpose; the external electrode 30 of laminated type ceramic component 10; in manufacture process; must be through electronickelling and electrotinning step; constitute layer structure jointly by the conducting end electrode 31 of innermost layer, the electroless nickel layer 32 and the outermost electrotinning layer 33 in intermediate layer, utilizing electroless nickel layer 32 to protect with silver as intermediate barrier layers is the conducting end electrode 31 of material.Because the solderability of nickel is bad, therefore plate one deck electrotinning layer 33 again, to improve solderability at electroless nickel layer 32 outer surfaces.
But the electroplating process of above-mentioned laminated type ceramic component 10 can produce toxic waste, can cause serious pollution to environment.
As shown in Figure 2, along with the technology progress of (Surface Mount Technology is called for short SMT) is followed on the surface, laminated type ceramic component 10 must be made surface stuck element (SMD).Utilize technology to attain ripe surface and follow technology (SMT), laminated type ceramic component 10 directly can be placed on the circuit board 90 that has speckled with glue or tin cream 95, and needn't be through the welding manner of prior art employing, utilize heating techniques such as hot blast or infrared ray that tin cream 95 is heated to fusing point and dissolve the back cooling, just be able to laminated type ceramic component 10 is fixed on the tie point of circuit board 90.
In other words, the external electrode 30 of laminated type ceramic component 10 utilizes the surface to follow technology and is fixed on the circuit board 90, the external electrode 30 of laminated type ceramic component 10 need not re-use existing solder technology, so no longer need obtain soldering resistance and corrosion-resistant by electroless nickel layer 32 and electrotinning layer 33.
The utility model content
In view of this, main purpose of the present utility model is to provide a kind of does not need to carry out plating step man-hour adding, and can not cause the laminated type ceramic component of severe contamination to environment.
To achieve these goals, a kind of laminated type ceramic component that the utility model provides, comprise a ceramic main body, and the interior electrode that interlocks about the inside of this ceramic main body is provided with, wherein, the two ends of described ceramic body respectively are provided with a conductive electrode layer, described conductive electrode layer with about staggered in electrode constitute and electrically contact, and surface coverage one deck paste soldering-tin layer of described conductive electrode layer.
Laminated type ceramic component of the present utility model, its conductive electrode layer is the electrode layer of silver, copper, silver alloy or copper alloy material, wherein, preferably adopt the electrode layer of silver palladium alloy or silver-platinum alloy material, more easily make the paste soldering-tin layer be covered in the surface of described conductive electrode layer.
Laminated type ceramic component of the present utility model, comprise in its paste soldering-tin layer scaling powder and particle diameter 1～5 μ m tin metal fine powder, copper lemel, Sn-containing alloy fine powder or copper-bearing alloy fine powder wherein more than one; And the volume ratio of scaling powder accounts for 20～30%.
Laminated type ceramic component of the present utility model is adding man-hour without plating step, therefore need not handle useless nickel liquid and useless tin liquor, can not cause severe contamination to environment, has the advantage of saving manufacturing cost and reducing man-hour.
Description of drawings
Fig. 1 is the cross-sectional view of the laminated type ceramic component of prior art.
Fig. 2 is fixed to cross-sectional view on the circuit board for laminated type ceramic component shown in Figure 1 with the tin cream on the circuit board.
Fig. 3 is the cross-sectional view of laminated type ceramic component of the present utility model.
Fig. 4 is fixed to cross-sectional view on the circuit board for laminated type ceramic component shown in Figure 3 with the paste soldering-tin layer that itself has the band stickiness.
Reference numeral
10...... laminated type ceramic component 20...... ceramic main body
30...... external electrode 31...... conducting end electrode
32...... electroless nickel layer 33...... electrotinning layer
40...... interior electrode
50...... laminated type ceramic component 60...... ceramic main body
65...... interior electrode 70...... conductive electrode layer
72...... paste soldering-tin layer 75...... external electrode
90...... circuit board 95...... glue or tin cream
Embodiment
As shown in Figure 3, the structure of laminated type ceramic component 50 of the present utility model, comprise a ceramic main body 60, the interior electrode 65 that interlocks about the inside of this ceramic main body 60 is provided with, the two ends of this ceramic main body 60 respectively are provided with a conductive electrode layer 70, constitute electrically contact for electrode 65 in staggered about ceramic main body 60, and the surface coverage one paste soldering-tin layer 72 of this conductive electrode layer 70.
Described conductive electrode layer 70 is silver, copper, silver alloy or copper alloy electrode layer, wherein, is preferably: with silver palladium alloy or silver-platinum alloy is conductive electrode layer 70.The weight proportion of silver palladium alloy or silver-platinum alloy is a silver: palladium (or platinum)=95～99 weight %:1～5 weight %, its characteristics are the surface that paste soldering-tin layer 70 is covered in described conductive electrode layer 70 easily.
Described paste soldering-tin layer 72 by tin, the copper of scaling powder (Flux) and particle size range 1～5 μ m, comprise ashbury metal or comprise copper alloy lemel wherein more than one are modulated to paste.And, having stickiness in order to make paste soldering-tin layer 72, the scaling powder of described paste soldering-tin layer 72 (Flux) ratio accounts for cumulative volume 20～30% (volume ratio).
Described paste soldering-tin layer 72 can adopt the mode of attaching, mode of printing, spraying method or soak tin stove mode and cover the outer surface of described conductive electrode layer 70.
For example, get tin (Sn), silver (Ag) and copper (Cu) lemel of particle diameter 1～5 μ m, ratio in tin (Sn) 94.5 weight %, silver (Ag) 5.0 weight % and copper (Cu) 0.5 weight % is modulated into the solder(ing) paste that has stickiness with the scaling powder (Flux) that accounts for cumulative volume 20～30%, cover again on the outer surface of conductive electrode layer 70 of described laminated type ceramic component 50, the process coating promptly constitutes laminated type ceramic component 50 structural improvements of the present utility model after finishing and forming one deck paste soldering-tin layer 72.
As shown in Figure 4, laminated type ceramic component 50 of the present utility model has the paste soldering-tin layer 72 of band stickiness, so circuit board 90 does not need to be stained with glue or tin cream again; Laminated type ceramic component 50 of the present utility model is placed directly on the tie point of circuit board 90, utilize heating techniques such as hot blast or infrared ray that paste soldering-tin layer 72 is heated to after cooling made it to solidify again after fusing point dissolved, laminated type ceramic component 50 just is fixed on the tie point of circuit board 90.
And the paste soldering-tin layer 72 of laminated type ceramic component 50 of the present utility model forms the external electrodes 75 of laminated type ceramic components 50 jointly with conductive electrode layer 70 after solidifying.
Laminated type ceramic component 50 of the present utility model, its characteristics do not need to be plating step, thereby can reduce the environmental pollution that electroplate liquid causes, and need not spend the expense of useless nickel liquid of processing and useless tin liquor, have and save the advantage that manufacturing cost reached and reduced man-hour.
Claims (5)
1. laminated type ceramic component, comprise a ceramic main body, and the interior electrode that interlocks about the inside of this ceramic main body is provided with, it is characterized in that, the two ends of described ceramic body respectively are provided with a conductive electrode layer, described conductive electrode layer with described about staggered in electrode constitute electrical the contact respectively, and surface coverage one deck paste soldering-tin layer of described conductive electrode layer.
2. laminated type ceramic component as claimed in claim 1 is characterized in that, described conductive electrode layer is the electrode layer of silver, copper, silver alloy or copper alloy material.
3. laminated type ceramic component as claimed in claim 1 is characterized in that, described conductive electrode layer is the electrode layer of silver palladium alloy or silver-platinum alloy material.
4. as claim 2 or 3 described laminated type ceramic components, it is characterized in that, described paste soldering-tin layer comprise scaling powder and particle diameter 1～5 μ m tin metal fine powder, copper lemel, Sn-containing alloy fine powder or copper-bearing alloy fine powder wherein more than one.
5. laminated type ceramic component as claimed in claim 4 is characterized in that, the scaling powder ratio of described paste soldering-tin layer accounts for cumulative volume 20～30%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206928478U CN202008888U (en) | 2010-12-24 | 2010-12-24 | Laminated ceramic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206928478U CN202008888U (en) | 2010-12-24 | 2010-12-24 | Laminated ceramic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202008888U true CN202008888U (en) | 2011-10-12 |
Family
ID=44750548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206928478U Expired - Fee Related CN202008888U (en) | 2010-12-24 | 2010-12-24 | Laminated ceramic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202008888U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130209A (en) * | 2020-01-15 | 2021-07-16 | 三星电机株式会社 | Multilayer electronic component and board having the same mounted thereon |
-
2010
- 2010-12-24 CN CN2010206928478U patent/CN202008888U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130209A (en) * | 2020-01-15 | 2021-07-16 | 三星电机株式会社 | Multilayer electronic component and board having the same mounted thereon |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111012 Termination date: 20171224 |