CN201994284U - Cooling device and power module - Google Patents
Cooling device and power module Download PDFInfo
- Publication number
- CN201994284U CN201994284U CN2011200449794U CN201120044979U CN201994284U CN 201994284 U CN201994284 U CN 201994284U CN 2011200449794 U CN2011200449794 U CN 2011200449794U CN 201120044979 U CN201120044979 U CN 201120044979U CN 201994284 U CN201994284 U CN 201994284U
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- Prior art keywords
- flow
- heat abstractor
- partition wall
- bottom plate
- cooling
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- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Abstract
The utility model discloses a cooling device, which comprises a cooling bottom plate and a flow splitting device which is arranged below the cooling bottom plate for changing the flow direction of cooling liquid, wherein the flow splitting device comprises a top layer and a bottom layer; a plurality of inlets, a plurality of outlets and partition walls are distributed on the top layer; a flow passage of the cooling liquid is defined by the partition walls; the bottom layer comprises a cooling liquid flow-in region, a cooling liquid flow-out region and a barrier plate; the inlets are formed at the cooling liquid flow-in region; the outlets are formed at the cooling liquid flow-out region; the barrier plate is used for separating the flow-in region from the flow-out region; the flow passage is provided with a turn for changing the flow direction of the liquid; the partition wall at the turn of the flow passage is cambered. The utility model also discloses a power module. The partition wall at the turn of the flow passage is cambered, and bumping positions at the junctions of the cooling liquid and the partition walls are staggered away from one another along the flow direction of the cooling liquid, so that eddy flow can be suppressed and increase in pressure loss due to bumping at the junctions of the cooling liquid and the partition walls can be reduced to achieve better cooling performance.
Description
Technical field
The utility model belongs to semiconductor module cooling application field, is specifically related to a kind of heat abstractor and power model.
Background technology
Semiconductor device will produce heat at its device work, and these heats can make the working condition of semiconductor device worsen usually.For power semiconductor device, it must obtain cooling during operation, and with the acceptable performance of maintenance device, and high power semi-conductor often adopts liquid cools.
High-power applications fields such as the industrial drives device of hybrid vehicle, wind power generation, solar power generation and standard propose higher requirement to the long-term reliability of power model, high power density, excellent heat dispersion and electric firm performance etc.
As figure one is a kind of conventional power module with water-cooling heat radiating device, power device 10 carry out heat that switch work produced successively by first weld layer 20, cover copper ceramic substrate 50(DBC, Direct Bonded Copper), second weld layer 30, copper soleplate or AlSiC base plate 60, heat-conducting silicone grease layer 40, be delivered to radiator 70 at last, carry out heat exchange with the recirculated cooling water of radiator 70.
And figure two be a kind of employing electrode as pressure apparatus, DBC substrate 50 is fixed on the radiator.Though the heat transfer path of module has reduced, but still need to carry out heat exchange by heat-conducting silicone grease 40 and radiator.Adopt the power semiconductor modular of heat-conducting silicone grease,, greatly influenced the heat exchanger effectiveness of power semiconductor modular and radiator because the thermal conductivity of heat-conducting silicone grease is very little.
As figure three are a kind of power models with radiator, and DBC is connected with radiating bottom plate 73 by weld layer 90 among the figure, contains column fin 74 in the radiator 70; The power model of this structure forms the turbulence columns of pin wing (Pin-fin) structure at the back side of radiating bottom plate 73, this turbulence columns is a column fin 74, can carry out sufficient heat exchange and improve cooling effectiveness with recirculated cooling water, but the type of cooling of this structure be unidirectional cooling.
As figure four are power models that another kind has radiator, and 70 is radiator among the figure, and 73 for having the radiating bottom plate of pin fin structure; When having three groups of DBC cooling waters on the radiating bottom plate radiating bottom plate being cooled off, current are from 71 inflows that enter the mouth, flow out from exporting 72, cooling water earlier with first group of DBC51 on the heat that gets off of power device transmission carry out heat exchange after, go up the heat that power device 10 transmits with second group of DBC52 again and carry out heat exchange, the heat that the power device transmission is got off on last and the 3rd group of DBC53 carries out heat exchange; Cause like this having produced the temperature difference at the back side of radiating bottom plate, at the T1 of figure four, T2, there is T3 at the T3 place〉T2〉T1, this will influence the heat dispersion of module.
Summary of the invention
The utility model is the not good problem of semi-conductor power module heat dispersion in the solution prior art, thereby a kind of heat abstractor and power model with better heat dispersion is provided.
For solving the problems of the technologies described above, the utility model provides following technical scheme:
A kind of heat abstractor, comprise radiating bottom plate and be arranged at the part flow arrangement that is used to change coolant flow direction below the radiating bottom plate, described part flow arrangement comprises top layer and bottom, be distributed with a plurality of inlets, a plurality of outlet and partition wall on the described top layer, described partition wall has limited the flow channel of cooling fluid; Described bottom comprises that the cooling fluid that is used to place a plurality of inlets flows into the district, the cooling fluid that is used to place a plurality of outlets flows out the district and is used to separate the barrier plate that flows into the district and flow out the district; Described flow channel has the turning point that changes liquid flow direction; The partition wall that is positioned at described flow channel turning point is curved.
Further, also comprise and be arranged at the splitter that is used for flow-disturbing in the described flow channel and increases the heat radiation.
Preferably, the partition wall side that is positioned at corresponding splitter position in the described part flow arrangement is provided with projection.
Preferably, be positioned at the partition wall undulate shape of corresponding splitter position in the described part flow arrangement.
Preferably, the end of described partition wall and splitter is smooth structure.
Preferably, described flow channel is S-type.
Preferably, described radiating bottom plate is a kind of in copper soleplate, AlSiC base plate, the aluminum soleplate.
The utility model also provides another kind of power model, comprises above-mentioned heat abstractor, radiating shell and is arranged at power semiconductor on the radiating bottom plate; Described radiating shell comprises groove, the liquid inlet that is communicated with inlet and the liquid outlet that is communicated with outlet, and described heat abstractor is positioned in the described groove.
Further, radiating shell and radiating bottom plate intersection are provided with sealing ring.
Compared with prior art, the utlity model has following beneficial effect: heat abstractor that the utility model provides and power model, described flow channel turning point curved, stagger each other along the flow direction of cooling fluid in the collision position of cooling fluid and partition wall infall, this makes the point that can produce the pressure loss disperse on the flow direction of cooling fluid, can be suppressed in the cooling water flow passage and produce eddy current, and can reduce the increase of the pressure loss that the collision because of cooling fluid and partition wall infall causes, make heat dispersion better.
Description of drawings
Fig. 1 is a kind of conventional power module with water-cooling heat radiating device in the prior art.
Fig. 2 is the radiator of available technology adopting electrode as pressure apparatus.
Fig. 3 is a kind of power model with radiator in the prior art.
Fig. 4 is an another kind of power model with radiator in the prior art.
Fig. 5 is the top level structure schematic diagram of part flow arrangement among the utility model first embodiment.
Fig. 6 is the fabric schematic diagram of part flow arrangement among the utility model first embodiment.
Fig. 7 is the schematic top plan view of the utility model embodiment radiating shell.
Fig. 8 is the top level structure schematic diagram of part flow arrangement among the utility model second embodiment.
Fig. 9 is the top level structure schematic diagram of part flow arrangement among the utility model the 3rd embodiment.
Figure 10 is the top level structure schematic diagram of part flow arrangement among the utility model the 4th embodiment.
Figure 11 is the top level structure schematic diagram of part flow arrangement among the utility model the 5th embodiment.
Figure 12 is a splitter structural representation among the utility model the 5th embodiment.
Embodiment
Clearer for technical problem, technical scheme and beneficial effect that the utility model is solved, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
A kind of heat abstractor, comprise radiating bottom plate and be arranged at the part flow arrangement that is used to change coolant flow direction below the radiating bottom plate, described part flow arrangement comprises top layer and bottom, as Fig. 5 is the top level structure schematic diagram of part flow arrangement among the utility model first embodiment, and dotted line is depicted as the water (flow) direction signal among the figure; Be distributed with a plurality of inlets 101, a plurality of outlet 102 and partition wall 103 on the described top layer, described partition wall 103 has limited the flow channel 120 of cooling fluid, and wherein, described flow channel has the turning point that changes liquid flow direction; The partition wall 103 that is positioned at described flow channel turning point is curved.Because the flow channel turning point is curved, stagger each other along the flow direction of cooling fluid in the collision position of cooling fluid and partition wall infall, this makes the point that can produce the pressure loss disperse on the flow direction of cooling fluid, can be suppressed in the cooling water flow passage and produce eddy current, and can reduce the increase of the pressure loss that the collision because of cooling fluid and partition wall infall causes, make heat dispersion better.This heat abstractor adopts the design of direct water-cooling radiating bottom plate, cancelled between the installation interface of radiating bottom plate and radiating shell and used heat-conducting silicone grease, and by using part flow arrangement independently to change the flow direction of cooling fluid, the entire heat dissipation base plate can be cooled off simultaneously with the assurance cooling fluid, the temperature difference can be do not produced at the base plate back side.Fig. 6 is the fabric schematic diagram of part flow arrangement among the utility model first embodiment; Described bottom comprises that the cooling fluid that is used to place a plurality of inlets 101 flows into district 105, the cooling fluid that is used to place a plurality of outlets 102 flows out district 106 and is used to separate the barrier plate 104 that flows into the district and flow out the district.
In the present embodiment, the end of described partition wall 103 is set to smooth structure, is preferably circular-arc, also can be ellipticity, the position that produces the pressure loss is disperseed on the direction of cooling water flow, thereby can reduce the pressure loss of cooling water flow, realize cooling water flow smoothly.Passage in the present embodiment is S-type, has increased utilization ratio.And the radiating bottom plate in the present embodiment is a kind of in copper soleplate, AlSiC base plate, the aluminum soleplate.
Fig. 7 is the schematic top plan view of the utility model embodiment radiating shell; Radiating shell comprise groove 203, with inlet 101 liquid inlets that are communicated with 201 and with export 102 liquid outlets that are communicated with 202; Described heat abstractor is positioned in the described groove 203; After freezing liquid flows into from liquid inlet 201 like this, enter cooling fluid and flow into district 105, bottom through part flow arrangement directly enters inlet 101 then, through inlet 101, cooling fluid flows into the top layer of part flow arrangement, flows in flow channel 120, until entering outlet 102, and flow out district 106 through exporting 102 cooling fluids that flow in the bottom of part flow arrangement, and flow out district 106 through cooling fluid and flow out from liquid outlet 202 again, finish cooling.
Fig. 8 is the top level structure schematic diagram of part flow arrangement among the utility model second embodiment; The difference of embodiment is among present embodiment and Fig. 6, and inlet 101 is arranged at the corner of partition wall 103, and outlet 102 is arranged at the end of partition wall 103, and the dotted line among the figure is a water (flow) direction.
Fig. 9 is the top level structure schematic diagram of part flow arrangement among the utility model the 3rd embodiment; Compare with Fig. 6 discipline, increased splitter 110 among this figure, for fear of owing to increasing the effect that passage length causes between inlet and corresponding outlet the inhomogeneous cooling is spared, increase width of channel, thereby in S type passage, be provided for flow-disturbing and increase the splitter that dispels the heat, described splitter is arranged in the described passage, staggers on the flow direction of cooling fluid in the end of splitter and the end of partition wall.
Figure 10 is the top level structure schematic diagram of part flow arrangement among the utility model the 4th embodiment; The partition wall side that is positioned at corresponding splitter position described in the present embodiment in the part flow arrangement is provided with level and smooth projection.Figure 11 is the top level structure schematic diagram of part flow arrangement among the utility model the 5th embodiment; Be positioned at the partition wall undulate shape of corresponding splitter position in the described part flow arrangement.Wavy shaped configuration or level and smooth raised structures are provided so that it can stop cooling water flow on a part of section of cooling water path, in the section that is furnished with wavy shaped configuration or level and smooth projection of cooling water path, cooling water has uneven VELOCITY DISTRIBUTION, can improve the cooling effectiveness of semiconductor power device.
The shape of this splitter can be the column construction of linear pattern or dislocation, the splitter structure is the column construction of dislocation as shown in figure 12, when along the plane cutting splitter vertical with the cooling water flow direction, splitter can also have such as herringbone, rectangle or leg-of-mutton section shape, but be not limited to this structure.
A kind of power model comprises above-mentioned heat abstractor, radiating shell, and is arranged at the power semiconductor on the radiating bottom plate.Heat abstractor, comprise radiating bottom plate and be arranged at the part flow arrangement that is used to change coolant flow direction below the radiating bottom plate, described part flow arrangement comprises top layer and bottom, as Fig. 5 is the top level structure schematic diagram of part flow arrangement among the utility model first embodiment, and dotted line is depicted as the water (flow) direction signal among the figure; Be distributed with a plurality of inlets 101, a plurality of outlet 102 and partition wall 103 on the described top layer, described partition wall 103 has limited the flow channel 120 of cooling fluid, and wherein, described flow channel has the turning point that changes liquid flow direction; The partition wall that is positioned at described flow channel turning point is curved.Described radiating shell comprises groove, the liquid inlet that is communicated with inlet and the liquid outlet that is communicated with outlet, and described heat abstractor is positioned in the described groove.Because the flow channel turning point is curved, stagger each other along the flow direction of cooling fluid in the collision position of cooling fluid and partition wall infall, this makes the point that can produce the pressure loss disperse on the flow direction of cooling fluid, can be suppressed in the cooling water flow passage and produce eddy current, and can reduce the increase of the pressure loss that the collision because of cooling fluid and partition wall infall causes, make heat dispersion better.This heat abstractor adopts the design of direct water-cooling radiating bottom plate, cancelled between the installation interface of radiating bottom plate and radiating shell and used heat-conducting silicone grease, and by using part flow arrangement independently to change the flow direction of cooling fluid, the entire heat dissipation base plate can be cooled off simultaneously with the assurance cooling fluid, the temperature difference can be do not produced at the base plate back side.
In order to guarantee sealing, radiating shell and radiating bottom plate intersection are provided with sealing ring 204, as shown in Figure 7; According to the thickness of radiating bottom plate, form and make the surface of radiating bottom plate and the surperficial equal supporting zone of radiating shell simultaneously.Supporting zone has and the corresponding screw hole in radiating bottom plate installation site.Be provided with sealing ring at radiating shell and radiating bottom plate intersection, by radiating bottom plate is fastened to supporting zone, thereby sealing ring implemented static pressure.Supporting zone can be coated with waterproof gasket cement and carry out the second heavy sealing.Here radiating bottom plate can be copper soleplate, AlSiC base plate, aluminum soleplate.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (10)
1. heat abstractor comprises radiating bottom plate and is arranged at the part flow arrangement that is used to change coolant flow direction below the radiating bottom plate; It is characterized in that described part flow arrangement comprises top layer and bottom, be distributed with a plurality of inlets, a plurality of outlet and partition wall on the described top layer, described partition wall has limited the flow channel of cooling fluid; Described bottom comprises that the cooling fluid that is used to place a plurality of inlets flows into the district, the cooling fluid that is used to place a plurality of outlets flows out the district and is used to separate the barrier plate that flows into the district and flow out the district; Described flow channel has the turning point that changes liquid flow direction; The partition wall that is positioned at described flow channel turning point is curved.
2. heat abstractor according to claim 1 is characterized in that, also comprises being arranged at the splitter that is used for flow-disturbing in the described flow channel and increases heat radiation.
3. heat abstractor according to claim 2 is characterized in that, the partition wall side that is positioned at corresponding splitter position in the described part flow arrangement is provided with projection.
4. heat abstractor according to claim 2 is characterized in that, is positioned at the partition wall undulate shape of corresponding splitter position in the described part flow arrangement.
5. according to each described heat abstractor of claim 1 to 4, it is characterized in that the end of described partition wall is a smooth structure.
6. according to each described heat abstractor of claim 2 to 4, it is characterized in that the end of described splitter is a smooth structure.
7. according to each described heat abstractor of claim 1 to 4, it is characterized in that described flow channel is S-type.
8. according to each described heat abstractor of claim 1 to 4, it is characterized in that described radiating bottom plate is a kind of in copper soleplate, AlSiC base plate, the aluminum soleplate.
9. power model is characterized in that: comprise each described heat abstractor, radiating shell in the claim 1 to 8 and be arranged at power semiconductor on the radiating bottom plate; Described radiating shell comprises groove, the liquid inlet that is communicated with inlet and the liquid outlet that is communicated with outlet, and described heat abstractor is positioned in the described groove.
10. power model according to claim 9 is characterized in that, described radiating shell and radiating bottom plate intersection are provided with sealing ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200449794U CN201994284U (en) | 2011-02-23 | 2011-02-23 | Cooling device and power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200449794U CN201994284U (en) | 2011-02-23 | 2011-02-23 | Cooling device and power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201994284U true CN201994284U (en) | 2011-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200449794U Expired - Lifetime CN201994284U (en) | 2011-02-23 | 2011-02-23 | Cooling device and power module |
Country Status (1)
| Country | Link |
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| CN (1) | CN201994284U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9578789B2 (en) | 2013-05-24 | 2017-02-21 | Infineon Technologies Ag | Power semiconductor module with liquid cooling |
| CN107426943A (en) * | 2016-05-24 | 2017-12-01 | 福特全球技术公司 | Vehicle electrical power modular assembly and concetrated pipe |
| CN108133920A (en) * | 2018-02-09 | 2018-06-08 | 苏州绿控新能源科技有限公司 | A kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars |
| CN108511403A (en) * | 2018-03-12 | 2018-09-07 | 昆明理工大学 | A kind of sliceable micro-fluidic radiator |
-
2011
- 2011-02-23 CN CN2011200449794U patent/CN201994284U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9578789B2 (en) | 2013-05-24 | 2017-02-21 | Infineon Technologies Ag | Power semiconductor module with liquid cooling |
| CN104183561B (en) * | 2013-05-24 | 2017-04-26 | 英飞凌科技股份有限公司 | Power Semiconductor Module with Liquid Cooling |
| CN107426943A (en) * | 2016-05-24 | 2017-12-01 | 福特全球技术公司 | Vehicle electrical power modular assembly and concetrated pipe |
| CN107426943B (en) * | 2016-05-24 | 2020-08-28 | 福特全球技术公司 | Vehicle power module assembly and manifold |
| CN108133920A (en) * | 2018-02-09 | 2018-06-08 | 苏州绿控新能源科技有限公司 | A kind of cooling water channel structure for being applicable in Pin-Fin power semiconductor modulars |
| CN108133920B (en) * | 2018-02-09 | 2023-10-24 | 苏州绿控新能源科技有限公司 | Cooling water channel structure suitable for Pin-Fin power semiconductor module |
| CN108511403A (en) * | 2018-03-12 | 2018-09-07 | 昆明理工大学 | A kind of sliceable micro-fluidic radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191204 Address after: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee after: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address before: BYD 518118 Shenzhen Road, Guangdong province Pingshan New District No. 3009 Patentee before: BYD Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP03 | Change of name, title or address |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kwai Chung street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110928 |
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| CX01 | Expiry of patent term |