CN201967249U - Large-current PCB (printed circuit board) - Google Patents
Large-current PCB (printed circuit board) Download PDFInfo
- Publication number
- CN201967249U CN201967249U CN201020700226XU CN201020700226U CN201967249U CN 201967249 U CN201967249 U CN 201967249U CN 201020700226X U CN201020700226X U CN 201020700226XU CN 201020700226 U CN201020700226 U CN 201020700226U CN 201967249 U CN201967249 U CN 201967249U
- Authority
- CN
- China
- Prior art keywords
- current pcb
- pcb board
- pcb
- electric current
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a large-current PCB (printed circuit board), which comprises a core board. The core board is provided with through holes. The large-current PCB is characterized in that the through holes are filled with conductive metal poles. The large-current PCB has the beneficial effect that metal slurry is full filled in the through holes of the board to form the thick conductive metal poles, so that after a user inserts an insert into the large-current PCB, when a large current passes through the through holes, the PCB cannot be burnt out.
Description
Technical field
The utility model relates to pcb board, specifically is a kind of pcb board that big electric current passes through that bears.
Background technology
Via hole also claims plated-through hole, in double sided board and multi-layer sheet, for being communicated with the printed conductor between each layer, need the intersection of the lead of connection to bore a common aperture at each layer, it is via hole, on technology, the method with chemical deposition on the hole wall face of cylinder of via hole plates layer of metal, in order to the Copper Foil of each layer needs connection in the middle of being communicated with.When big electric current by the time, the thawing of being heated easily of the metal level on the hole wall, thus influence the connection of each layer.
The utility model content
The purpose of this utility model is, overcomes the deficiencies in the prior art, proposes a kind of pcb board that still can operate as normal under big electric current.
The technical solution adopted in the utility model is as follows: a kind of big electric current pcb board, comprise central layer, and central layer is provided with via hole, is filled with the conducting metal post in the described via hole.
Preferably, described conducting metal post is a conduction copper column.
Preferably, the central layer surface is covered with prepreg, and the prepreg surface is covered with copper foil layer.
The beneficial effects of the utility model are, by fill with the metal slurry in the via hole of plate, form thick conducting metal post, guarantee the user behind plug-in unit greatly electric current in the via hole through not blowing.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment pcb board.
Embodiment
The pcb board structure comprises copper foil layer 2, prepreg 3, central layer 1, prepreg 3 and Copper Foil 2 from top to bottom successively referring to Fig. 1.On central layer 1, offer some via holes.When producing pcb board, in via hole, fill with the copper slurry, form copper post 4.Like this, the client is behind plug-in unit, and big electric current through out-of-date, just can not melt disconnected copper post in the via hole, keeps the connection of each layer smooth and easy.
Claims (3)
1. one kind big electric current pcb board comprises central layer, and central layer is provided with via hole, it is characterized in that, is filled with the conducting metal post in the described via hole.
2. big electric current pcb board as claimed in claim 1 is characterized in that described conducting metal post is a conduction copper column.
3. big electric current pcb board as claimed in claim 1 is characterized in that the central layer surface is covered with prepreg, and the prepreg surface is covered with copper foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020700226XU CN201967249U (en) | 2010-12-31 | 2010-12-31 | Large-current PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020700226XU CN201967249U (en) | 2010-12-31 | 2010-12-31 | Large-current PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201967249U true CN201967249U (en) | 2011-09-07 |
Family
ID=44529801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020700226XU Expired - Fee Related CN201967249U (en) | 2010-12-31 | 2010-12-31 | Large-current PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201967249U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013107199A1 (en) * | 2012-01-19 | 2013-07-25 | 华为技术有限公司 | Golden finger and plate edge interconnection device |
| CN104754867A (en) * | 2013-12-30 | 2015-07-01 | 深南电路有限公司 | Thick copper circuit board and processing method thereof and interlayer interconnection structure achievement method |
| CN105934069A (en) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | Circuit board jointed board |
-
2010
- 2010-12-31 CN CN201020700226XU patent/CN201967249U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013107199A1 (en) * | 2012-01-19 | 2013-07-25 | 华为技术有限公司 | Golden finger and plate edge interconnection device |
| US9699901B2 (en) | 2012-01-19 | 2017-07-04 | Huawei Technologies Co., Ltd. | Golden finger and board edge interconnecting device |
| CN104754867A (en) * | 2013-12-30 | 2015-07-01 | 深南电路有限公司 | Thick copper circuit board and processing method thereof and interlayer interconnection structure achievement method |
| CN104754867B (en) * | 2013-12-30 | 2017-12-29 | 深南电路有限公司 | The implementation method of heavy copper circuit board and its processing method and interlayer interconnection structure |
| CN105934069A (en) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | Circuit board jointed board |
| CN105934069B (en) * | 2016-05-31 | 2019-04-05 | Oppo广东移动通信有限公司 | A kind of multiple-printed-panel for circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110907 Termination date: 20151231 |
|
| EXPY | Termination of patent right or utility model |