CN201940376U - Full-automatic non-contact multifunctional testing and sorting system of solar wafer - Google Patents
Full-automatic non-contact multifunctional testing and sorting system of solar wafer Download PDFInfo
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- CN201940376U CN201940376U CN2010205994843U CN201020599484U CN201940376U CN 201940376 U CN201940376 U CN 201940376U CN 2010205994843 U CN2010205994843 U CN 2010205994843U CN 201020599484 U CN201020599484 U CN 201020599484U CN 201940376 U CN201940376 U CN 201940376U
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Abstract
The utility model discloses a full-automatic non-contact multifunctional testing and sorting system of a solar wafer. The testing and sorting system comprises a control centre, a main transmission module, a wafer positioning module, a wafer measuring module and a wafer transceiving module, wherein the main transmission module comprises a first stepping motor, a transmission belt pulley block and a main transmission belt which are sequentially connected, and the main transmission belt penetrates through a whole system; the wafer positioning module fulfills the central positioning function before the measurement of each wafer; the wafer measuring module is connected with the main transmission module and comprises three groups of probe sensors which are arranged at intervals; and the wafer transceiving module comprises a wafer transmitting mechanism and a wafer receiving mechanism; the main transmission module is used for sequentially conveying a wafer received from the wafer transmitting mechanism to pass through the wafer positioning module and the wafer measuring module, and the wafer is recycled by the wafer receiving mechanism; and the control centre realizes the data inter-transmission with each function module through an internal communication mechanism and also stores all received data in the system database. The full-automatic testing and sorting system has the advantages of non-contact, multifunctional measurement, flexibility, quickness, correctness and the like.
Description
Technical field
The utility model belongs to the field tests of solar energy grade semiconductor wafer, relate in particular to a kind of by sending wafer automatically, transmitting wafer, the measurement of thickness, total thickness deviation and crooked angularity of solar energy grade semiconductor wafer and the full-automatic non-contact type multifunctional measuring of solar wafer and the separation system of sorting are finished in fast heed contacted measure, sorting, flow process such as take up automatically.
Background technology
Multiple parameters such as the thickness of solar energy grade wafer, thickness deviation, crooked angularity, body resistivity and blemish all need through measuring screening to reach the standard of application, for example: solar energy-level silicon wafer manufacturing enterprise need the different links in whole process flow test respectively and monitor the parameters such as thickness, thickness deviation, body resistivity and blemish of product silicon chip especially, satisfies solar cell industry or client's specification requirement with the silicon chip product that guarantees finally to dispatch from the factory.And on the present domestic market, test these parameters separately although there are several equipment to distinguish, yet can integrate advantages such as reliability, multi-functional, flexibility, high production capacity and high performance-price ratio without any a kind of testing equipment, to satisfy the growing rival demand of photovoltaic industry.
Specifically, traditional test mode need be tested the different parameters of solar level wafer with multiple different tester respectively.Such as, the test of solar energy-level silicon wafer thickness generally needs the thickness measuring instrument to finish the test of thickness, finish the test of flexibility parameter then with the clearance gauge instrument, this traditional approach needs at least two steps to finish, the record of data with mate elapsed time too, the accuracy of data can't effectively be ensured, simultaneously, the breakage rate of silicon chip, fragment rate also can obviously improve, and these have all influenced production efficiency greatly.Ranking score at silicon chip is chosen, and also need cause the silicon chip breakage by manually wafer being classified, the effort of taking a lot of work, the low inferior problem of production efficiency.
The utility model content
Technical problem to be solved in the utility model provides full-automatic non-contact type multifunctional measuring of a kind of solar wafer and separation system, realizing that high efficiency measures the parameters of solar wafer automatically, and wafer is classified automatically according to parameters such as the thickness of measuring, total thickness deviation, crooked angularities.
The technical scheme that its technical problem that solves the utility model adopts is:
Full-automatic non-contact type multifunctional testing of a kind of solar wafer and separation system wherein, comprising:
Control centre is furnished with system database;
Main delivery module comprises successively first stepper motor that connects, conveyer belt assembly pulley and through the main belt of whole system, drive wafer from a position to another position until finishing all surveying works;
The wafer orientation module is connected with described main delivery module, comprises the stop that four compressed air trigger, and lays respectively at the position, four limits of wafer, realizes every wafer is measured preceding centralized positioning function;
The wafer measurement module, be connected with described main delivery module, the probe sensor that comprises three groups of spaces, wherein, the first probe sensor group is positioned at center wafer position upper and lower surface, in order to measuring center wafer position upper and lower surface and the distance between the detecting head surface up and down, the second probe sensor group and the 3rd probe sensor group lay respectively at the upper and lower surface at both sides of wafers edge in order to measurement both sides of wafers edge upper and lower surface and the distance between the detecting head surface up and down; And,
The wafer transceiver module, comprise wafer feeding mechanism and wafer slice receiving mechanism of slice, described wafer feeding mechanism and described wafer slice receiving mechanism of slice include at least one group of apparatus for automatically lifting that carries film magazine, described wafer feeding mechanism is sent to wafer from described film magazine on the main belt of described system in order one by one, and described wafer slice receiving mechanism of slice is taken in the wafer of finishing measurement on the described main belt in the corresponding film magazine according to default classification and grade.
Full-automatic non-contact type multifunctional testing of above-mentioned solar wafer and separation system, wherein, described second probe sensor group and the 3rd sensor groups are fixed on the same synchronous leading screw of precision, are driven by second stepper motor, realize the automatic adjustment of Edge Distance when the different size wafer is measured.
Full-automatic non-contact type multifunctional testing of above-mentioned solar wafer and separation system, wherein, described first, second, third probe sensor group comprises two optical pickocffs and a displacement sensor respectively.
Full-automatic non-contact type multifunctional testing of above-mentioned solar wafer and separation system, wherein, the solar wafer box of carrying 125mm specification or 156mm specification on the apparatus for automatically lifting of described wafer feeding mechanism.
Full-automatic non-contact type multifunctional testing of above-mentioned solar wafer and separation system, wherein, described wafer slice receiving mechanism of slice all is equipped with 7 segmentation counters.
Full-automatic non-contact type multifunctional measuring of the utility model solar wafer and separation system are owing to adopt above technical scheme, make it compared with prior art, can pass through automatic transferring wafer, heed contacted measure thickness, total thickness deviation, crooked angularity finally is sorted into corresponding sheet indigo plant to the wafer category automatically, also can add other measurement function flexibly simultaneously.The utility model is by utilization automation and heed contacted measure mode, to the damage of wafer reduce greatly, certainty of measurement improves greatly.
Description of drawings
Fig. 1 is the structural representation of the utility model application equipment;
Fig. 2 is the wafer measurement module structural representation of the utility model application equipment;
Fig. 3 is the utility model application device thickness account form schematic diagram;
Fig. 4 is that the utility model application device thickness probe wire formula is gathered schematic diagram;
Fig. 5 is the utility model application device measuring module image data example flow chart;
Fig. 6 is the utility model application equipment running example flow chart;
Fig. 7 a is 180 microns wafer thickness measuring result curve of the utility model application equipment figure;
Fig. 7 b is 230 microns wafer thickness measuring result curve of the utility model application equipment figure;
Fig. 7 c is 358 microns wafer thickness measuring result curve of the utility model application equipment figure;
Fig. 8 is the linear comparison diagram of the utility model application device thickness.
The specific embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments, but not as qualification of the present utility model.
Full-automatic non-contact type multifunctional testing of the utility model solar wafer and separation system overview are please referring to 110 views among Fig. 1, structure shown in 110 views is applicable to thickness, TTV, the isoparametric measurement of crooked angularity of solar wafer, and according to measurement result parameters such as the thickness of solar wafer, TTV, crooked angularity is carried out sorting.Solar wafer is expressed as wafer 10 with square, usually, wafer 10 be a slice very thin, near foursquare high-quality semiconductor material (for example: semi-conducting materials such as silicon, germanium), the upper and lower surface of wafer 10 is similar to parallel, and possess the intimate length of side that equates, meet related industry standards.In some cases, the arc length on four angles can be different because of different application demands.According to shown in Figure 1,110 view systems generally comprise control centre 800, one or more wafer feeding mechanisms (feeding device) 200, wafer orientation module 201, wafer measurement module 202, main delivery module 300 and 2 or a plurality of wafer slice receiving mechanism of slice 305A-B, wafer feeding mechanism 200 and wafer slice receiving mechanism of slice 305A-B form the wafer transceiver module, control centre 800 comprises central control system 807 and system database 801,203 is spare module, all above-mentioned functions modules connect by the internal lan network, and implement control by central control system 807.Central control system 807 is carried out by a computer, in order to the operation application software platform.110 systems are based on distributed control framework, each functional module all has sub-control system separately in the system, carry out independent running, and in whole connecting system internal lans 216, all control instructions of each functional module and data message are by internal system LAN 216, and lift-launch TCP/IP communications protocol realizes transmission fast.Wafer feeding mechanism 200 cooperates wafer case 12, can be transferred to the wafer in the film magazine 12 10 on the main belt 208A-B in order one by one, the main belt 208A-B of system is transferred to another functional module with wafer from a functional module successively via main delivery module 300 controls.Wafer orientation module 201 comprises the stop 301a-d that four compressed air trigger, lay respectively at the position, four limits of wafer 10, with main belt 208A-B is horizontal and vertical reference, wafer 10 is carried out center operations, and the repeatability of wafer 10 through next measurement module 202 back measurement data can be effectively guaranteed in the centralized positioning of wafer 10 operation.Wafer measurement module 202 is equipped with three to form right probe sensor, in order to carry out the line formula of three diverse locations of wafer is measured, every group of distance of popping one's head between dynamic measurement sensor surface and the wafer upper and lower surface, these data that record are sent to central control system 807 subsequently.Central control system 807 can calculate parameters such as wafer thickness, TTV, crooked angularity after receiving surface distance measurement data from measurement module 202 according to this.Each parameter values that goes out according to aforementioned calculation, and by contrasting the various sorting scope foundations that in central control system 807, pre-set, realization is to the grade separation of wafer, and at last according to the grade separation result, main belt 300 moves to wafer among the corresponding wafer slice receiving mechanism of slice 305A-B.
As shown in Figure 2, wafer measurement module 202 comprises a straight line leading screw 102 that is driven by second stepper motor 101, above the second probe sensor group 103 and the 3rd probe sensor group 107 are equipped in, the first probe sensor group 109 is fixedly assembling mode, and probe sensor group 103,107 and 109 is located on the straight line perpendicular to the direction of motion.The first probe sensor group 109 is positioned at wafer 10 centers, and the second probe sensor group 103 is positioned at the position near wafer 10 top edges, and the 3rd probe sensor group 107 is positioned near wafer 10 another sides, the i.e. position of lower limb.Because probe group 103 and 107 together is assemblied on the linear drive system 102, so these the two groups synchronous backwards that can be implemented on the vertical direction of popping one's head in move.The second probe sensor group 103 comprises optical pickocff 103a, displacement-type probe sensor 103b and optical pickocff 103c, and they are assemblied in respectively on same the horizontal line.Similarly, the 3rd probe sensor group 107 comprises optical pickocff 107a, displacement-type probe sensor 107b and optical pickocff 107c; The first probe sensor group 109 comprises optical pickocff 109a, displacement-type probe sensor 109b and optical pickocff 109c.In measuring process, main belt 208A-B is with wafer 10 transmission and through measurement module 202, and system will collect all range data information that run through entire wafer.
As shown in Figure 4, when wafer 10 is moved with the R direction by main belt, probe sensor 103b, 107b, 109b carry out periodicity to different data point distance signals and gather on the direction of motion, general every group of probe will obtain more than the measurement data of 40 test points every data with the scanning of computing line formula.The precision of displacement-type probe sensor and the degree of accuracy have determined the thickness of measured solar wafer and the precision and the degree of accuracy of crooked angularity data.
In Fig. 1, main delivery module 300 comprises first stepper motor 310, conveyer belt assembly pulley 311, and main belt 208A-B, and main delivery module 300 transferring wafers 10 run through whole system.Main belt 208A-B supports the solar wafer of different size, for example: specifications such as 125mm x 125mm, 156mm x 156mm, can move in modes such as friction speed, different acceleration, different deceleration and different distance.Solar wafer 10 is storEd usually in certain memory unit, and for example portable film magazine 12 is known as industry, and the wafer of some is positioned in the film trap that film magazine 12 is parallel to each other blocks ofly.Wafer dispensing device 200 descends automatically, and up to sensing wafer 10, subsequently, wafer 10 is transferred on the main belt 208A-B, and by main belt 208A-B transmission, passes through follow-up each functional module one by one.Wafer slice receiving mechanism of slice 305A-B respectively comprises a wafer storage device (indigo plant takes up) 306A-B, in the wafer receiving course, the wafer 10 that is positioned on the main belt 208A-B is lifted by the lifting arm, and the O type belt on the lifting arm is transported to wafer 10 among the blue 306A-B that takes up.
As Fig. 6 and shown in Figure 1, when system runs well beginning, in the 601st step, relevant setup menu 803 is loaded in the central control system 807, setup menu 803 comprises some concrete configurations, for example: need the information such as parameter, size, the sorting setting of wafer and the platform numbering that takes up of measurement, as shown in 804 tabulations.After setup menu 803 was by affirmation, system went forward side by side entry into service into flow process 602.In the 603rd step, the film magazine 12 that the operator fills 25 wafer usually with a box is placed on the wafer feeding mechanism 200, can place the solar wafer box of 125mm and two kinds of specifications of 156mm on the wafer feeding mechanism 200.In 604 steps, when wafer feeding mechanism 200 is sensed film magazine 12, promptly begin to move down automatically, when the wafer 10 of sensor sensing in film magazine 12, promptly stop to move downward.This wafer 10 is drawn out of film magazine 12 immediately and is positioned on the main belt 208A-B.After finishing above-mentioned slice action, wafer feeding mechanism 200 promptly sends action to control centre 800 and finishes instruction, central control system 807 keeps following the tracks of the wafer 10 that is positioned on the main belt 208A-B subsequently, and to main conveying control system 300 transmission instructions this wafer is sent to next position simultaneously.In the 605th step, main belt 208A-B moves a step-length with wafer 10, finish wafer 10 moved the action of a step-length after, main conveying control system 300 sends to move to master control system 807 finishes instruction.When receive conveying control system finish move after, master control system 807 sends broadcasting instructions to all functions module immediately, makes corresponding functional modules that wafer is carried out separately operation.In the 606th step, wafer orientation module 201 is by driving four stop 301a-d, wafer 10 is carried out the one-time positioning operation, this positioning action can make wafer 10 be located in horizontal and vertical center with respect to main belt 208A-B, and the wafer orientation operation is significant for the uniformity of follow-up measurement module measurement parameter.After wafer orientation module 201 is finished positioning action, can send the location to control system 807 and finish instruction.After receiving that instruction is finished in location that wafer orientation module 201 sends, control system 807 promptly indicates main conveying control system 300 with the wafer 10 next station that moves right.In the 607th step, wafer 10 is transmitted and by wafer measurement module 202.In the 608th step, the range data of probe is by system acquisition.
Temporarily jump to shown in Figure 5ly, in the 502nd step, whether system will detect spatial cache enough, if spatial cache is full, any data can not gathered by system, and directly jump to 512, wait for that master control system 807 requires the transmission data commands.If spatial cache less than, then continue to carry out 503, to check optical pickocff 103a, c also determines whether wafer puts in place.If confirm that wafer 10 puts in place, then continue to carry out 504, in this step, the voltage signal of wafer surface and probe sensor surface distance will be gathered by system.In the 505th step, the voltage signal that collects is stored in the buffer.In the 506th step, system will check optical pickocff 109a, and c also determines whether wafer puts in place.Go on foot if wafer 10 is judged to put in place then proceed to 507, the voltage signal of wafer surface and probe sensor surface distance will be gathered by system.In the 508th step, the voltage signal that collects is stored in the buffer.During to the 509th step, system will check optical pickocff 107a, and c also determines whether wafer puts in place.Go on foot if wafer 10 is judged to put in place then proceed to 510, the voltage signal of wafer surface and probe sensor surface distance will be gathered by system.In the 511st step, the voltage signal that collects is stored in the buffer.To the 512nd step, system detects master control system 807 and whether requires to send data.If do not detect the signal that master control system 807 requires to send data, then program jumped back to for 502 steps.If detect the signal that master control system 807 requires to send data, then continue to carry out 513 steps, and utilize the TCP/IP communications protocol, send data by internal system LAN 216.After data are finished transmission, continued to carry out 514 steps, to empty existing buffer memory and to get back to for the 502nd step.
Get back to Fig. 6, in the 609th step, thickness parameter will calculate (with reference to Fig. 3) according to following formula: thickness=D – (A+B), wherein two probe spacings after the D representative calibration, detecting head surface is to the distance of upper wafer surface in the A representative, and detecting head surface is to the distance of wafer lower surface under the B representative.By calculating, can obtain the data of total thickness deviation (TTV) to all test point one-tenth-value thickness 1/10s.Crooked angularity data are via formula: computing is carried out in (B – A)/2, and it has reacted the intensity of variation of tested wafer pattern.The above-mentioned thickness, TTV and the crooked angularity data that obtain by above-mentioned computing are stored in the system database 801 promptly according to the definite position of wafer 10.After thickness, TTV, crooked angularity data operation are finished, system will require to determine wafer-level according to the sorting that pre-sets.Generally, the Systems Operator can pre-set the requirement of thickness, TTV and the crooked angularity of different range, and is divided into a grade with every group of wafer that satisfies all area requirements.In Fig. 6, the area requirement of first and second grades of only having demonstrated, and in the practical operation, the operator can specify the multiple grade setting of multiple scope, has satisfied different sorting demands.The operator can determine whether to require all wafers thickness, TTV, crooked angularity data to meet the demands fully in conjunction with the sorting parameter of grade one and grade two, and perhaps wafer thickness, TTV, crooked angularity sorting require only partly to satisfy to get final product.Under latter instance, if thickness, TTV and crooked angularity measurement result do not satisfy any area requirement, then the operator can determine how next step sorting work is carried out, for example: remeasure this wafer or abandon this wafer.In any case, the sorting flow process all can continue to carry out, and in 610a step, system will determine whether actual measurement thickness, TTV, the crooked angularity of wafer satisfy in the grade one area requirement to thickness, TTV, crooked angularity fully.If satisfied fully, in the step, the wafer that wafer will satisfy grade one requirement is classified as the first kind at 611a.After the classification of wafer was determined well, master control system 807 sent the instruction of mobile wafer to main conveying control system 300, and when the wafer in-position that satisfies condition, sends the reception wafer instructions to the module 305A that takes up.After wafer 10 was finished the reception action, the System Operation flow process can return for 604 steps, and next wafer is sent on the main belt 208A-B.
In sum, the system of 110 framework types can satisfy the solar wafer industry demand fully, for industry provides low price, high production capacity, full-automatic efficient measurement and the sorting solution of measuring wafer thickness, TTV and crooked angularity.Can prove that according to the actual measured results among Fig. 7 a, Fig. 7 b, Fig. 7 c, Fig. 8 110 construction systems can satisfy above-mentioned requirements fully under the measurement index of not sacrificing precision, accuracy or repeatability.In the curve map shown in Fig. 7 a, Fig. 7 b, Fig. 7 c, embodied and utilized 110 construction systems, it at thickness respectively the wafer of three kinds of different-thickness of 180 microns, 230 microns and 358 microns, respectively carry out the resulting result of duplicate measurements of 10 subcenter thickness, just as shown in FIG., each of every kind of thickness time measurement result deviation is all less than 0.25 micron.Fig. 8 has embodied thickness range from 180 microns to 358 microns linearity performance.Although the thickness span of several wafers is very big, the linear dependence between measurement result and the reference value can accomplish that still the degree of correlation is 1, and side-play amount only is 0.248 micron.
Can determine that according to the experience of kinds of processes research the sorting mode of above elaboration can be applied to many different fields.For example: solar wafer manufacturing enterprise can utilize above-mentioned minute lectotype, makes multiple batches of wafer merge into the arrangement of dispatching from the factory of the conforming lots of wafers of parameter height such as thickness, TTV and crooked angularity.
Though the utility model discloses as above with preferred embodiment; right its is not in order to limit the utility model; any those skilled in the art; in not breaking away from spirit and scope of the present utility model; when doing a little modification and perfect, therefore protection domain of the present utility model is worked as with being as the criterion that claims was defined.
Claims (5)
1. full-automatic non-contact type multifunctional testing of solar wafer and separation system is characterized in that, comprising:
Control centre is furnished with system database;
Main delivery module comprises successively first stepper motor that connects, conveyer belt assembly pulley and through the main belt of whole system, drive wafer from a position to another position until finishing all surveying works;
The wafer orientation module is connected with described main delivery module, comprises the stop that four compressed air trigger, and lays respectively at the position, four limits of wafer, realizes every wafer is measured preceding centralized positioning function;
The wafer measurement module, be connected with described main delivery module, the probe sensor that comprises three groups of spaces, wherein, the first probe sensor group is positioned at center wafer position upper and lower surface, in order to measuring center wafer position upper and lower surface and the distance between the detecting head surface up and down, the second probe sensor group and the 3rd probe sensor group lay respectively at the upper and lower surface at both sides of wafers edge in order to measurement both sides of wafers edge upper and lower surface and the distance between the detecting head surface up and down; And,
The wafer transceiver module, comprise wafer feeding mechanism and wafer slice receiving mechanism of slice, described wafer feeding mechanism and described wafer slice receiving mechanism of slice include at least one group of apparatus for automatically lifting that carries film magazine, described wafer feeding mechanism is sent to wafer from described film magazine on the main belt of described system in order one by one, and described wafer slice receiving mechanism of slice is taken in the wafer of finishing measurement on the described main belt in the corresponding film magazine according to default classification and grade.
2. full-automatic non-contact type multifunctional testing of solar wafer according to claim 1 and separation system, it is characterized in that, described second probe sensor group and the 3rd sensor groups are fixed on the same synchronous leading screw of precision, drive by second stepper motor, realize the automatic adjustment of Edge Distance when the different size wafer is measured.
3. full-automatic non-contact type multifunctional testing of solar wafer according to claim 1 and 2 and separation system is characterized in that, described first, second, third probe sensor group comprises two optical pickocffs and a displacement sensor respectively.
4. full-automatic non-contact type multifunctional testing of solar wafer according to claim 1 and separation system is characterized in that, the solar wafer box of carrying 125mm specification or 156mm specification on the apparatus for automatically lifting of described wafer feeding mechanism.
5. according to claim 1 or full-automatic non-contact type multifunctional testing of 4 described solar wafer and separation system, it is characterized in that described wafer slice receiving mechanism of slice all is equipped with 7 segmentation counters.
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| CN2010205994843U CN201940376U (en) | 2010-11-10 | 2010-11-10 | Full-automatic non-contact multifunctional testing and sorting system of solar wafer |
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| CN2010205994843U CN201940376U (en) | 2010-11-10 | 2010-11-10 | Full-automatic non-contact multifunctional testing and sorting system of solar wafer |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104613879A (en) * | 2015-01-19 | 2015-05-13 | 无锡名谷科技有限公司 | Silicon wafer thickness measuring device and measuring method |
| CN104838023A (en) * | 2012-12-10 | 2015-08-12 | 昭和电工株式会社 | MAethod for producing silicon-containing aluminum alloy ingot |
| CN105499152A (en) * | 2016-01-12 | 2016-04-20 | 适新科技（苏州）有限公司 | High-speed automatic detection instrument and method for separation piece thickness |
| CN109107908A (en) * | 2018-07-19 | 2019-01-01 | 西安电子科技大学 | System for sheet material sorting |
| CN110293073A (en) * | 2018-03-21 | 2019-10-01 | 英稳达科技股份有限公司 | The intelligent classification system and method for solar battery sheet |
| CN113155193A (en) * | 2021-04-19 | 2021-07-23 | 上海磐盟电子材料有限公司 | Intelligent wafer detection and classification method, device and system based on cloud computing |
-
2010
- 2010-11-10 CN CN2010205994843U patent/CN201940376U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104838023A (en) * | 2012-12-10 | 2015-08-12 | 昭和电工株式会社 | MAethod for producing silicon-containing aluminum alloy ingot |
| CN104613879A (en) * | 2015-01-19 | 2015-05-13 | 无锡名谷科技有限公司 | Silicon wafer thickness measuring device and measuring method |
| CN105499152A (en) * | 2016-01-12 | 2016-04-20 | 适新科技（苏州）有限公司 | High-speed automatic detection instrument and method for separation piece thickness |
| CN110293073A (en) * | 2018-03-21 | 2019-10-01 | 英稳达科技股份有限公司 | The intelligent classification system and method for solar battery sheet |
| CN109107908A (en) * | 2018-07-19 | 2019-01-01 | 西安电子科技大学 | System for sheet material sorting |
| CN113155193A (en) * | 2021-04-19 | 2021-07-23 | 上海磐盟电子材料有限公司 | Intelligent wafer detection and classification method, device and system based on cloud computing |
| CN113155193B (en) * | 2021-04-19 | 2022-12-13 | 上海磐盟电子材料有限公司 | Intelligent wafer detection and classification method, device and system based on cloud computing |
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Granted publication date: 20110824 Termination date: 20151110 |