CN201931207U - Picoseconds laser device for processing vessel support - Google Patents
Picoseconds laser device for processing vessel support Download PDFInfo
- Publication number
- CN201931207U CN201931207U CN 201120009539 CN201120009539U CN201931207U CN 201931207 U CN201931207 U CN 201931207U CN 201120009539 CN201120009539 CN 201120009539 CN 201120009539 U CN201120009539 U CN 201120009539U CN 201931207 U CN201931207 U CN 201931207U
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- laser
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- vessel support
- cutting
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- 238000012545 processing Methods 0.000 title abstract description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 10
- 238000003698 laser cutting Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract 4
- 238000012805 post-processing Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000003754 machining Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 210000004204 blood vessel Anatomy 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The utility model relates to a picoseconds laser device for processing a vessel support. The output end of the picoseconds laser device is provided with an optoisolator; the output end of the optoisolator is connected to a laser beam expander; a 45 degree reflecting mirror is arranged at the output end of the laser beam expander; the output end of the 45 degree reflecting mirror is connected to a focusing mirror; the output end of the focusing mirror is connected to a cutting nozzle; the cutting nozzle is arranged over against a two-dimensional motion control platform; the 45 degree reflecting mirror is also engaged with a charge coupled device (CCD) lens; the CCD lens is engaged with a CCD; the two-dimensional motion control platform comprises an X-axis transmission unit making a front and back feed motion and a Y-axis transmission unit making a 360 degree rotary motion; and the Y-axis transmission unit making the 360 degree rotary motion is arranged on the X-axis transmission unit making the front and back feed motion. A laser beam of a picoseconds laser is focused within 10 microns through a cutting head system; the front and back retreat and the rotation of a pipe are controlled through the two-dimensional motion control platform, and the vessel support is processed by utilizing the advantages of the picoseconds laser so as to reduce aftertreatment after laser cutting on the vessel support is finished and improve the performance of the vessel support.
Description
Technical field
The utility model relates to a kind of laser process equipment, relates in particular to a kind of picosecond laser device that is used to process intravascular stent.
Background technology
Traditional metallic blood vessel bracket utilizes YAG or optical-fiber laser that stainless steel pipe is carried out Carving Machining and forms, and finishes through aftertreatment technologys such as overpickling electrobrightenings then.But, along with of the raw material utilization of metal pipe materials such as L605NITI as intravascular stent, it is more and more difficult to find that in process aftertreatment technology becomes, and increasing to the influence of support, the aftertreatment technology of support is also more and more unstable, causes the quality instability of support, test is found, the support post processing is very big to raw-material intravascular stent influences such as L605NITI, deals with improperly, can cause major defects such as support fracture.How to reduce the influence of post processing to support, very urgent.
The appearance of drug stent is processed with very high requirement to the blind groove in blind hole, and traditional YAG and optical fiber are difficult to satisfy processing request because heat affecting is big.Therefore, utilize picosecond laser that support is carried out blind hole blind groove processing existence technical advantage clearly.By discovering, post processing is very big to the degree of dependence of laser cutting.If obtain good cutting effect by laser cutting, post processing will become does not so simply even need very much.
Summary of the invention
The purpose of this utility model is to overcome the deficiency that prior art exists, and a kind of picosecond laser device that is used to process intravascular stent is provided.
The purpose of this utility model is achieved through the following technical solutions:
Be used to process the picosecond laser device of intravascular stent, it is characterized in that: the output of picosecond laser is provided with optoisolator, the output of optoisolator is connected with beam expanding lens, the output of beam expanding lens is furnished with 45 degree speculums, the output of 45 degree speculums connects focus lamp, the output of focus lamp connects cutting head, and cutting head is right against two dimensional motion control platform; 45 degree speculums also are connected the CCD camera lens, and the CCD camera lens is connected CCD; The X-axis delivery unit of feed motion and the Y-axis delivery unit that 360 ° rotatablely move before and after described two dimensional motion control platform comprises, 360 ° of Y-axis delivery units that rotatablely move are installed on the X-axis delivery unit of front and back feed motion.
Further, the picosecond laser device of intravascular stent is processed in above-mentioned being used to, and the output of described focus lamp is provided with the protection eyeglass.
Substantive distinguishing features and obvious improvement that technical solutions of the utility model are outstanding are mainly reflected in:
Picosecond laser focuses in 10 microns light beam by the cutting head system, by the forward-reverse and the rotation of two-dimensional motion platform control tubing; Whole system of processing is operated and is driven by software control system, thereby reaches accurate cutting merit intravascular stent function; Utilize the advantage of picosecond laser that intravascular stent is processed, post processing after the minimizing intravascular stent laser cutting, the performance of raising intravascular stent also can satisfy the accurate processing of the blind groove of blind hole simultaneously, improve the working (machining) efficiency and the qualification rate of support, improve the resistance to overturning of support.Picosecond laser is applied to intravascular stent processing, optimize the laser processing technology parameter, reach best cutting effect, improve cut quality, reduce last handling process.
Description of drawings
Below in conjunction with accompanying drawing technical solutions of the utility model are described further:
Fig. 1: light channel structure principle schematic of the present utility model.
The implication of each Reference numeral sees the following form among the figure:
The specific embodiment
As shown in Figure 1, be used to process the picosecond laser device of intravascular stent, the output of picosecond laser 1 is provided with optoisolator 2, the output of optoisolator 2 is connected with beam expanding lens 3, the output that the output of beam expanding lens 3 is furnished with 45 degree speculums, 4,45 degree speculums 4 connects focus lamp 7, and the output of focus lamp 7 connects 0.5mm cutting head 9,0.5mm cutting head 9 is right against two dimensional motion control platform 10, the output of focus lamp 7 is provided with protection eyeglass 8; 45 degree speculums 4 also are connected CCD camera lens 5, and CCD camera lens 5 is connected CCD6; The X-axis delivery unit of feed motion and the Y-axis delivery unit that 360 ° rotatablely move before and after two dimensional motion control platform 10 comprises, 360 ° of Y-axis delivery units that rotatablely move are installed on the X-axis delivery unit of front and back feed motion.
Picosecond laser 1 is an infrared laser, and wavelength is 1064nm, frequency 100K～1MKHZ, mean power 30W.The cutting head system comprises CCD coaxial image display system, optoisolator, beam-expanding collimation 45 degree reflecting optics, focusing lens, eyeglass is installed on the adjustable device, realizes adjustable focal length, and light beam is vertically adjustable, and light beam is focused on below 10 microns, realize accurate cutting.Cutting head can carry out beam-expanding collimation to light beam, and focus is regulated, and makes laser vertical focus on the rapidoprint surface, and beam diameter is below 10 microns.Dispose simultaneously coaxial CCD video system, monitor cutting process in real time and regulate focus at the cutting head top.Two-dimensional motion control platform is fixed on the marble base, adopts high-accuracy linear electric motors to drive, feeding before and after the X-axis delivery unit, and the rotation of Y-axis delivery unit, diaxon moves simultaneously and realizes the control of support cutting process.The platform precision reaches positive and negative 2 microns, and repetitive positioning accuracy is positive and negative 1 micron.The tubing chucking device is arranged on the platform, and, satisfy the automatic feed cutting, reach continuous cutting and produce function in batches, enhance productivity by pneumatic element control.A fixedly tubing sleeve is installed under cutting head, is improved cutting accuracy.
During concrete the application, picosecond laser focuses in 10 microns light beam by the cutting head system, and forward-reverse and rotation by two-dimensional motion platform control tubing comprise the auto-feed function.Whole system of processing is operated and is driven by software control system, thereby reaches accurate cutting merit intravascular stent function.Utilize the advantage of picosecond laser that intravascular stent is processed, the post processing after the minimizing intravascular stent laser cutting, the performance of raising intravascular stent.Also can satisfy simultaneously the accurate processing of the blind groove of blind hole.Improve the working (machining) efficiency and the qualification rate of support, improve the resistance to overturning of support.
What need understand is: the above only is a preferred implementation of the present utility model; for those skilled in the art; under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (2)
1. be used to process the picosecond laser device of intravascular stent, it is characterized in that: the output of picosecond laser (1) is provided with optoisolator (2), the output of optoisolator (2) is connected with beam expanding lens (3), the output of beam expanding lens (3) is furnished with 45 degree speculums (4), the output of 45 degree speculums (4) connects focus lamp (7), the output of focus lamp (7) connects cutting head (9), and cutting head (9) is right against two dimensional motion control platform (10); 45 degree speculums (4) also are connected CCD camera lens (5), and CCD camera lens (5) is connected CCD (6); The X-axis delivery unit of feed motion and the Y-axis delivery unit that 360 ° rotatablely move before and after described two dimensional motion control platform (10) comprises, 360 ° of Y-axis delivery units that rotatablely move are installed on the X-axis delivery unit of front and back feed motion.
2. the picosecond laser device that is used to process intravascular stent according to claim 1 is characterized in that: the output of described focus lamp (7) is provided with the protection eyeglass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120009539 CN201931207U (en) | 2011-01-13 | 2011-01-13 | Picoseconds laser device for processing vessel support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120009539 CN201931207U (en) | 2011-01-13 | 2011-01-13 | Picoseconds laser device for processing vessel support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201931207U true CN201931207U (en) | 2011-08-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120009539 Expired - Lifetime CN201931207U (en) | 2011-01-13 | 2011-01-13 | Picoseconds laser device for processing vessel support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201931207U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102248303A (en) * | 2011-01-13 | 2011-11-23 | 苏州德龙激光有限公司 | Picosecond laser device for processing blood vessel stent |
| CN111001950A (en) * | 2019-12-26 | 2020-04-14 | 上海百心安生物技术有限公司 | Processing method and processing device of vascular stent structure |
-
2011
- 2011-01-13 CN CN 201120009539 patent/CN201931207U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102248303A (en) * | 2011-01-13 | 2011-11-23 | 苏州德龙激光有限公司 | Picosecond laser device for processing blood vessel stent |
| CN111001950A (en) * | 2019-12-26 | 2020-04-14 | 上海百心安生物技术有限公司 | Processing method and processing device of vascular stent structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee before: Suzhou Delphi Laser Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20110817 |
|
| CX01 | Expiry of patent term |