CN201892912U - Heat-radiating device for main board of computer - Google Patents
Heat-radiating device for main board of computer Download PDFInfo
- Publication number
- CN201892912U CN201892912U CN2010206653812U CN201020665381U CN201892912U CN 201892912 U CN201892912 U CN 201892912U CN 2010206653812 U CN2010206653812 U CN 2010206653812U CN 201020665381 U CN201020665381 U CN 201020665381U CN 201892912 U CN201892912 U CN 201892912U
- Authority
- CN
- China
- Prior art keywords
- heat
- computer
- main board
- cover plate
- computer motherboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat-radiating device for a main board of a computer. In the heat-radiating device for the main board of the computer, two assemblies required to conduct heat are arranged on the main board; two lug bosses are arranged on a cover plate; flexible heat-conducting pads are additionally arranged between the two assemblies required to conduct heat and the two lug bosses of the cover plate respectively; and the two ends of the cover plate are fixed with the main board of the computer through screws. The assemblies required to conduct heat on the main board of the computer are attached to the flexible heat-conducting pads and then are tightly pressed with the cover plate; and by using the lug bosses on the cover plate to carry out the heat transmission and heat radiation, the problem that the main board of the computer conducts the heat is solved. The main board of the computer is mounted on a drawer board; and insulating gaskets are arranged at the connected parts of the screws so as to ensure favorable insulating performance.
Description
Technical field
The utility model relates to computing machine parts heat dissipation equipment field, more particularly, relates to a kind of computer motherboard heat abstractor.
Background technology
Because the service condition very severe of part computer product does not have axial flow blower can not produce thermal convection in the casing, the heat radiation of computer motherboard can only be leaned on heat conduction.Need increase radiator structure at the active computer mainboard.
The utility model content
Technical problem to be solved in the utility model is, overcomes the deficiencies in the prior art, and a kind of computer motherboard heat abstractor is provided.
The utility model computer motherboard heat abstractor, be achieved by following technical proposals, two assemblies that need heat conduction are set on the mainboard, it is characterized in that, two boss are set on the cover plate, increase flexible heat conductive pad respectively between described two assemblies that need heat conduction and two boss of cover plate, the cover plate two ends are fixed by screw and computer motherboard.
Computer motherboard described in the utility model is installed on the drawer plate by screw, adds insulation spacer in the screw junction.
Tightly fasten with cover plate after needing the assembly of heat conduction to stick flexible heat conductive pad on the utility model computer motherboard, carry out heat transmission through the cover plate boss and dispel the heat, solved the heat conduction problem of computer motherboard.Computer motherboard is installed on the drawer plate, adds insulation spacer in the screw junction, has guaranteed the good insulation performance performance.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is that the utility model is installed on synoptic diagram in the cabinet.
Embodiment
Below in conjunction with accompanying drawing the utility model is described further.
As shown in Figure 1, two assemblies 2 and 3 that need heat conduction are set on the mainboard 1, two boss are set on the cover plate 4, increase flexible heat conductive pad 5 and 6 respectively between described two assemblies that need heat conduction and two boss of cover plate, cover plate 4 two ends are fixed by screw 7 and computer motherboard.
Fig. 2 is that the utility model is installed on synoptic diagram in the cabinet.
The method of heat conductive pad is installed: the height dimension of two assemblies on the first metering computer mainboard, determine two corresponding boss height dimensions above the cover plate according to measurement size.
Computer motherboard is installed on the drawer plate, adds insulation spacer in the screw junction, has guaranteed the good insulation performance performance.
Embodiment recited above is described the utility model preferred implementation; be not that design of the present utility model and scope are limited; under the prerequisite that does not break away from the utility model design philosophy; common engineering technical personnel make the technical solution of the utility model in this area various distortion and improvement all should belong to protection domain of the present utility model.
Claims (2)
1. computer motherboard heat abstractor, two assemblies that need heat conduction are set on the mainboard, it is characterized in that, two boss are set on the cover plate, increase flexible heat conductive pad respectively between described two assemblies that need heat conduction and two boss of cover plate, the cover plate two ends are fixed by screw and computer motherboard.
2. computer motherboard heat abstractor according to claim 1 is characterized in that described computer motherboard is installed on the drawer plate by screw, adds insulation spacer in the screw junction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206653812U CN201892912U (en) | 2010-12-17 | 2010-12-17 | Heat-radiating device for main board of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206653812U CN201892912U (en) | 2010-12-17 | 2010-12-17 | Heat-radiating device for main board of computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201892912U true CN201892912U (en) | 2011-07-06 |
Family
ID=44222383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206653812U Expired - Fee Related CN201892912U (en) | 2010-12-17 | 2010-12-17 | Heat-radiating device for main board of computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201892912U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050363A (en) * | 2015-08-07 | 2015-11-11 | 深圳英飞拓科技股份有限公司 | Adaptive heat conduction device with pluggable structure |
| WO2016095508A1 (en) * | 2014-12-18 | 2016-06-23 | 中兴通讯股份有限公司 | Heat conduction pad, heat dissipator and heat dissipation component |
-
2010
- 2010-12-17 CN CN2010206653812U patent/CN201892912U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016095508A1 (en) * | 2014-12-18 | 2016-06-23 | 中兴通讯股份有限公司 | Heat conduction pad, heat dissipator and heat dissipation component |
| CN105050363A (en) * | 2015-08-07 | 2015-11-11 | 深圳英飞拓科技股份有限公司 | Adaptive heat conduction device with pluggable structure |
| CN105050363B (en) * | 2015-08-07 | 2018-08-03 | 深圳英飞拓科技股份有限公司 | The adaptive heat-transfer device of pluggable structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110706 Termination date: 20151217 |
|
| EXPY | Termination of patent right or utility model |