CN201878421U - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN201878421U CN201878421U CN2010205999724U CN201020599972U CN201878421U CN 201878421 U CN201878421 U CN 201878421U CN 2010205999724 U CN2010205999724 U CN 2010205999724U CN 201020599972 U CN201020599972 U CN 201020599972U CN 201878421 U CN201878421 U CN 201878421U
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- layer
- circuit board
- printed circuit
- pcb
- nickel dam
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Abstract
The utility model relates to a printed circuit board, comprising a substrate, a copper layer, a nickel layer, a palladium layer and an anti-oxidation layer. The copper layer is arranged on the surface of the substrate, the nickel layer is arranged on the surface of the copper layer, the palladium layer is arranged on the surface of the nickel layer, and the anti-oxidation layer is arranged on the surface of the palladium layer. Thereby, a gold layer of a traditional chemical nickel gold manufacturing procedure is not needed, the cost can be greatly reduced, and the same tin plating performance and functionality as those of the chemical nickel gold can be achieved.
Description
Technical field
The technology of the relevant a kind of printed circuit board (PCB) of the utility model refers to a kind ofly need not to use nickel-gold layer to reduce cost and to possess the printed circuit board (PCB) of solderability originally especially.
Background technology
The surface treatment process that is applied at present on the printed circuit board (PCB) all is based on the chemical nickel and gold processing procedure, because the chemical property of gold element is very stable and solderability is good, so be widely used in the processing procedure of printed circuit board (PCB).
Existing printed circuit board arrangement as shown in Figure 1, substrate 10 surface forms layer of copper layers 11 earlier, forms one deck nickel dam 12 again on copper layer 11, forms one deck gold layer 13 at last on nickel dam 12, promptly finishes the structure of existing printed circuit board (PCB).
But because price of gold is constantly soaring in recent years, make the cost of chemical nickel and gold processing procedure improve constantly, not only cause the processing procedure expense of surface treatment manufacturer obviously to promote, more can cause the cost of printed circuit board (PCB) also more and more higher, influence marketability.
Therefore, how to create a kind of printed circuit board (PCB), need not to use the chemical nickel and gold processing procedure, to be significantly reduced to this, and do not influence solderability originally, making the surface treatment process of printed circuit board (PCB) more meet economic benefit, and then can promote the market demand of printed circuit board (PCB), will be that the utility model desires actively to disclose part.
The utility model content
Main purpose of the present utility model can reduce the processing procedure cost and keep original solderability, to meet economic benefit for a kind of printed circuit board (PCB) is provided.
For reaching above-mentioned purpose, the utility model provides a kind of printed circuit board (PCB), comprises a substrate, a bronze medal layer, a nickel dam, a palladium layer and an anti oxidation layer.One bronze medal layer is arranged at substrate surface, and nickel dam is arranged at the copper laminar surface, and the palladium layer is arranged at the nickel dam surface, and anti oxidation layer is arranged at the palladium laminar surface.
In a preferred embodiment, nickel dam can be low-phosphorous nickel dam, middle phosphorus nickel dam or high phosphorus nickel dam, and the palladium layer is for displacement palladium layer, reduction palladium layer or partly replace semi-reduction palladium layer.Anti oxidation layer is the sealing of hole anti oxidation layer, and the sealing of hole anti oxidation layer is organic skin membrane or inorganic skin membrane or compound skin membrane of organic-inorganic or organic-inorganic (containing phosphide) Composite Skin rete.
Compared to prior art, printed circuit board (PCB) of the present utility model mainly utilizes the gold layer in the existing processing procedure of palladium layer replacement, by this, can not only significantly reduce the processing procedure cost, and do not influence solderability originally, make the surface treatment process of printed circuit board (PCB) more meet cost benefit by this structure, to promote the practicality of printed circuit board (PCB).
Description of drawings
Fig. 1 is the structural representation of existing printed circuit board (PCB);
Fig. 2 is the structural representation of the utility model printed circuit board (PCB) one preferred embodiment; And
Fig. 3 is the processing flow figure of the utility model printed circuit board (PCB) one preferred embodiment.
Description of reference numerals
The 10----substrate
11----copper layer
The 12----nickel dam
13----gold layer
The 2-----printed circuit board (PCB)
The 20----substrate
21----copper layer
The 22----nickel dam
23----palladium layer
The 24----anti oxidation layer
Embodiment
Below by particular specific embodiment execution mode of the present utility model is described, the person skilled in the art can understand other advantage of the present utility model and effect easily by the content that this specification disclosed.
The graphic explanation of following reference embodiment of the present utility model, it should be noted, below graphic for the signal of simplifying graphic, and basic conception of the present utility model only is described in a schematic way, but only the illustration structure relevant with the utility model but not component number, shape and size when implementing according to reality are drawn in graphic, kenel, quantity and the ratio of each element are not to exceed with diagram during its actual implements, and can need change according to actual design, close chat earlier bright.
At first, see also Fig. 2 and shown in Figure 3, be the structural representation and the processing flow figure of the utility model printed circuit board (PCB) one preferred embodiment.As shown in the figure, printed circuit board (PCB) 2 of the present utility model comprises a substrate 20, a bronze medal layer 21, a nickel dam 22, a palladium layer 23 and an anti oxidation layer 24.The surface of substrate 20 forms layer of copper layer 21, and copper layer 21 surface form one deck nickel dam 22 again, and then the surface of nickel dam 22 forms one deck palladium layer 23, at last for fear of 23 oxidation of palladium layer, so form one deck anti oxidation layer 24 again on the surface of palladium layer 23.
As shown in Figure 3, the surface treatment process of the utility model printed circuit board (PCB) 2 passes through cleaning, microetch, pickling, preimpregnation, activation, chemical nickel earlier as existing processing procedure, and difference is chemical palladium and anti oxidation layer.The difference of chemical nickel palladium processing procedure and chemical nickel and gold processing procedure maximum is that nickel palladium processing procedure does not need to use the very expensive gold of price, and the solderability and the reliability of effect such as can obtain, and nickel palladium processing procedure is at end copper layer elder generation sedimentation chemistry nickel dam.
Particularly, nickel dam 22 can be low-phosphorous nickel dam 22, middle phosphorus nickel dam 22 or high phosphorus nickel dam 22, and phosphorus content is less than 6% when being low-phosphorous nickel dam 22 when nickel dam 22, and when nickel dam 22 was middle phosphorus nickel dam 22, phosphorus content was 6% to 8%.When nickel dam 22 was high phosphorus nickel dam 22, phosphorus content was 8% to 11%.23 on palladium layer can be displacement palladium layer 23, reduction palladium layer 23 or partly replaces semi-reduction palladium layer 23.Anti oxidation layer 24 is a sealing of hole anti oxidation layer 24, and sealing of hole anti oxidation layer 24 can be organic skin membrane or inorganic skin membrane or compound skin membrane of organic-inorganic or organic-inorganic (containing phosphide) Composite Skin rete.
Compared to existing structure, the utility model printed circuit board (PCB) mainly replaces nickel gold processing procedure with nickel palladium processing procedure, make the structure of printed circuit board (PCB) replace existing gold layer with the palladium layer, so can significantly reduce manufacturing cost, and can obtain the solderability identical and functional again with the gold layer, more can meet cost benefit, to promote overall utility.
Though aforesaid description and graphicly disclosed preferred embodiment of the present utility model, but must recognize variously increase, many modifications and replace and may be used in the utility model preferred embodiment, and can not break away from the spirit and the scope of the utility model principle that is defined as the application's claim.The those skilled in the art that are familiar with the affiliated technical field of the utility model can know from experience, and the utility model can be used in the modification of many forms, structure, layout, ratio, material, element and assembly.Therefore, this paper should be regarded as in order to explanation the utility model in the embodiment that this disclosed, but not in order to restriction the utility model.Scope of the present utility model should be defined by the application's claim, and contains its legal equivalents, is not limited to previous description.
Claims (10)
1. printed circuit board (PCB) is characterized in that comprising:
One substrate;
One bronze medal layer is arranged at this substrate surface;
One nickel dam is arranged at this copper laminar surface;
One palladium layer is arranged at this nickel dam surface; And
One anti oxidation layer is arranged at this palladium laminar surface.
2. printed circuit board (PCB) as claimed in claim 1 is characterized in that this nickel dam is low-phosphorous nickel dam.
3. printed circuit board (PCB) as claimed in claim 1 is characterized in that this nickel dam is middle phosphorus nickel dam.
4. printed circuit board (PCB) as claimed in claim 1 is characterized in that this nickel dam is the high phosphorus nickel dam.
5. printed circuit board (PCB) as claimed in claim 1 is characterized in that this palladium layer is displacement palladium layer.
6. printed circuit board (PCB) as claimed in claim 1 is characterized in that this palladium layer is reduction palladium layer.
7. printed circuit board (PCB) as claimed in claim 1 is characterized in that this palladium layer is half displacement semi-reduction palladium layer.
8. printed circuit board (PCB) as claimed in claim 1 is characterized in that this anti oxidation layer is the sealing of hole anti oxidation layer.
9. printed circuit board (PCB) as claimed in claim 8 is characterized in that this sealing of hole anti oxidation layer is organic skin membrane.
10. printed circuit board (PCB) as claimed in claim 8 is characterized in that this sealing of hole anti oxidation layer is that inorganic skin membrane, the compound skin membrane of organic-inorganic or organic-inorganic contain phosphide Composite Skin rete.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205999724U CN201878421U (en) | 2010-11-09 | 2010-11-09 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205999724U CN201878421U (en) | 2010-11-09 | 2010-11-09 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201878421U true CN201878421U (en) | 2011-06-22 |
Family
ID=44166327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205999724U Expired - Lifetime CN201878421U (en) | 2010-11-09 | 2010-11-09 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201878421U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10049970B2 (en) | 2015-06-17 | 2018-08-14 | Samsung Electronics Co., Ltd. | Methods of manufacturing printed circuit board and semiconductor package |
| CN110062523A (en) * | 2019-04-04 | 2019-07-26 | 广州兴森快捷电路科技有限公司 | Golden finger and preparation method thereof, circuit board and preparation method thereof |
-
2010
- 2010-11-09 CN CN2010205999724U patent/CN201878421U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10049970B2 (en) | 2015-06-17 | 2018-08-14 | Samsung Electronics Co., Ltd. | Methods of manufacturing printed circuit board and semiconductor package |
| CN110062523A (en) * | 2019-04-04 | 2019-07-26 | 广州兴森快捷电路科技有限公司 | Golden finger and preparation method thereof, circuit board and preparation method thereof |
| WO2020199499A1 (en) * | 2019-04-04 | 2020-10-08 | 广州兴森快捷电路科技有限公司 | Gold finger and manufacturing method therefor and circuit board and manufacturing method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110622 |
|
| CX01 | Expiry of patent term |