CN201860547U - Pin leveling device for paster component - Google Patents
Pin leveling device for paster component Download PDFInfo
- Publication number
- CN201860547U CN201860547U CN2010205546067U CN201020554606U CN201860547U CN 201860547 U CN201860547 U CN 201860547U CN 2010205546067 U CN2010205546067 U CN 2010205546067U CN 201020554606 U CN201020554606 U CN 201020554606U CN 201860547 U CN201860547 U CN 201860547U
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- pan
- pin
- boss
- distance
- paster device
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Abstract
The utility model relates to a pin leveling device for a paster component. The pin leveling device comprises a cover plate and a bottom plate, wherein the cover plate and the bottom plate are both leveling plates; the bottom plate is provided with a concave pool; bosses are arranged at the two sides of the bottom of the concave pool; and the thickness of the boss is smaller than the depth of the concave pool, and the distance of two opposite bosses is less than the width of the concave pool, and the position relation of the concave pool and the bosses can be set according to the device encapsulation size. Compared with the prior art, the pin leveling quality of the paster component is greatly improved, the operation is convenient, and the production efficiency is improved; meanwhile, the pin leveling device has simple structure, is convenient to process, and has broad production and application prospect.
Description
Technical field
The utility model relates to a kind of apparatus for leveling, is specifically related to a kind of device that is used for the leveling of paster device pin.
Background technology
At present, the encapsulation of a lot of components and parts all is little outline packages (Small-Outline PackageSOP) and the flat encapsulation of square (Plastic Quad Flat Package QFP) on the market.SOP and QFP all belong to the paster device.As shown in Figures 1 and 2, components and parts have been used the SOP packaged type, promptly become SOP paster device, comprise body 1 and aerofoil profile pin 2, from in appearance, the relative both sides of the element after the encapsulation are provided with aerofoil profile pin 2, and described aerofoil profile pin 2 is made up of connecting portion 7 and toe section 8.And QFP paster device, from appearance, four sides of the element after the encapsulation all are provided with the aerofoil profile pin, promptly also are provided with the aerofoil profile pin in the remaining relative both sides of SOP paster device.
Yet in small lot batch manufacture, the pin of paster device (SOP or QFP) is very easy to distortion, has caused the coplanarity variation of pin, thereby has further caused the appearance of defectives such as rosin joint in the follow-up welding procedure.At present, normally carry out the work of manual pin leveling by tweezers, the poor quality of leveling and efficient are very low.
The utility model content
In order to overcome above-mentioned the deficiencies in the prior art, the utility model provides a kind of device that is used for the leveling of paster device pin that quality is good and efficient is high that flattens.
In order to achieve the above object, the technical solution adopted in the utility model is as follows: a kind of device that is used for the leveling of paster device pin, comprise cover plate and base plate, described cover plate and base plate are formation plate, it is characterized in that: described base plate is provided with pan, relative two sides are provided with boss in the described pan,, the thickness of described boss is less than the width of the distance between the degree of depth of pan and the two relative boss less than pan.
As optimized choice, the length of boss and the equal in length of pan, described boss is located at the pan bottom.
The utility model gives another technical scheme, a kind of device that is used for the leveling of paster device pin, comprise cover plate and base plate, described cover plate and base plate are formation plate, it is characterized in that: described base plate is provided with pan, be equipped with boss on four sides in the described pan, the thickness of described boss is less than the degree of depth of pan, and the distance between the boss facing each other is less than the distance between the side facing each other in the corresponding pan.
As optimized choice, described boss is located at the pan bottom.
The utility model has compared with prior art improved the quality of paster device pin leveling greatly, and is easy and simple to handle, improved production efficiency; And device is simple in structure, easily processing.
Description of drawings
Fig. 1 is the stereogram of SOP paster device
Fig. 2 is the left view of SOP paster device
Fig. 3 is the structural representation of the base plate of the utility model embodiment one
Fig. 4 is the assembling schematic diagram of the utility model embodiment one
Fig. 5 is the base arrangement schematic diagram of the utility model embodiment two
Embodiment
Embodiment one
Shown in Fig. 3 and 4, a kind of device that is used for the leveling of paster device pin comprises cover plate 6 and base plate 3, and described cover plate 6 and base plate 3 are formation plate.
Described base plate 3 is provided with pan 4, relative two sides are provided with boss 5 in the described pan 4, described boss 5 is located at the bottom of pan 4, the thickness of described boss 5 is less than the width of the distance between the degree of depth of pan 4 and the two relative boss 5 less than pan 4, and promptly two relative boss 5 make the centre position, bottom of pan 4 form groove one.
The equal in length of the length of described boss 5 and pan 4.
As Fig. 1, shown in 2 and 4, present embodiment is mainly used in the pin leveling of SOP paster device, therefore, the length of described pan 4 is set to equal the length of SOP paster device body 1, the width of pan 4 is set to equal the distance of length that distance between the end of toe section 8 of relative aerofoil profile pin 2 of SOP paster device deducts the toe section 8 of twice, and base plate 3 upper surfaces are set to equal the upper surface of connecting portion 7 of SOP paster device aerofoil profile pin 2 to the distance between the upper surface of the toe section 8 of the aerofoil profile pin 2 of SOP paster device to the distance between boss 5 upper surfaces.
The length and width of the groove that two relative boss 5 of above-mentioned pan 4 form is set to respectively equate with the length and width of SOP paster device body 1 that the degree of depth of described groove is set to equate with upper surface to the distance between connecting portion 7 upper surfaces of aerofoil profile pin 2 of SOP paster device body 1.
As shown in Figure 4, the pin flattening course of the SOP paster device of present embodiment is such, the upper surface of SOP paster device body 1 is installed in the groove that two relative boss 5 of base plate 3 form, press the middle part (will note antistatic) of the lower surface of SOP paster device body 1 then with have gentle hands, slightly run into the upper surface of base plate 3 up to the toe section 8 of the aerofoil profile pin 2 of SOP paster device, then cover plate 6 is covered on the toe section 8 of pin 2 on base plate 3 surfaces fully, the final force pressing can be finished the pin leveling work of SOP paster device.
Embodiment two
As shown in Figure 5, present embodiment has provided another and has been used for the device of paster device pin leveling, the difference of itself and embodiment one only is that the structure of base plate 3 changes, its change is: described base plate 3 is provided with pan 4, be equipped with boss 5 on four sides in the described pan 4, described boss 5 is located at the bottom of pan, the thickness of described boss 5 is less than the degree of depth of pan 4, and the distance between the boss 5 facing each other is less than the distance between the side facing each other in the corresponding pan 4, and promptly boss 5 makes the centre position, bottom of pan 4 form a groove 9.
Present embodiment is mainly used in the pin leveling of QFP paster device, therefore, base plate 3 upper surfaces are set to equal the upper surface of connecting portion 7 of QFP paster device aerofoil profile pin 2 to the distance between the upper surface of the toe section 8 of the aerofoil profile pin 2 of QFP paster device to the distance between the upper surface of boss 5, the length of described pan 4, width are set to equal the distance of length that distance between the end of toe section of relative aerofoil profile pin of QFP paster device deducts the toe section of twice respectively; The degree of depth of described groove 9 is set to equal QFP paster device body upper surface to the distance between the upper surface of the connecting portion of aerofoil profile pin, and the length and width of described groove 9 is set to equate with the length and width of QFP paster device body respectively.
The pin flattening course of the QFP paster device of present embodiment is such, the upper surface of QFP paster device body is installed in the groove 9 of base plate 3, press the middle part (will note antistatic) of the lower surface of QFP paster device body then with have gentle hands, up to the surface that the toe section of the aerofoil profile pin of QFP paster device is slightly run into base plate 3, then cover plate 6 is covered on the toe section of aerofoil profile pin on base plate 3 surfaces fully, the final force pressing can be finished the pin leveling work of QFP paster device.
The concrete size of above-described embodiment can be made change according to actual conditions, so that use on the different paster devices with aerofoil profile pin.And, as long as the area of base plate is enough big, can on same base plate, a plurality of pans be set, to carry out the pin leveling work of a plurality of paster devices simultaneously, increase work efficiency.
Above-described embodiment is a more preferably embodiment of the utility model, and common variation that those skilled in the art carry out in the utility model scheme scope and replacement all should be included in the protection range of the present utility model.
Claims (7)
1. one kind is used for the device that the paster device pin flattens, comprise cover plate and base plate, described cover plate and base plate are formation plate, it is characterized in that: described base plate is provided with pan, relative two sides are provided with boss in the described pan, and the thickness of described boss is less than the width of the distance between the degree of depth of pan and the two relative boss less than pan.
2. a kind of device that is used for the leveling of paster device pin as claimed in claim 1 is characterized in that: described boss is located at the pan bottom.
3. a kind of device that is used for the leveling of paster device pin as claimed in claim 1 is characterized in that: the length of boss and the equal in length of pan.
4. a kind of device that is used for the leveling of paster device pin as claimed in claim 3, it is characterized in that: the length of described pan equals the length of SOP paster device body; The width of pan equals the distance of length that distance between the end of toe section of relative aerofoil profile pin of SOP paster device deducts the toe section of twice; Plate upper surface to the distance between the boss upper surface equals the upper surface of connecting portion of SOP paster device aerofoil profile pin to the distance between the upper surface of the toe section of the aerofoil profile pin of SOP paster device; Distance between the two relative boss of pan equals the width of SOP paster device body; The thickness of boss equals the upper surface of SOP paster device body to the distance between the connecting portion upper surface of aerofoil profile pin.
5. one kind is used for the device that the paster device pin flattens, comprise cover plate and base plate, described cover plate and base plate are formation plate, it is characterized in that: described base plate is provided with pan, be equipped with boss on four sides in the described pan, the thickness of described boss is less than the degree of depth of pan, and the distance between the boss facing each other is less than the distance between the side facing each other in the corresponding pan.
6. a kind of device that is used for the leveling of paster device pin as claimed in claim 5 is characterized in that: described boss is located at the pan bottom.
7. a kind of device that is used for paster device pin leveling as claimed in claim 5 is characterized in that: plate upper surface equals the upper surface of connecting portion of QFP paster device aerofoil profile pin to the distance between the upper surface of the toe section of the aerofoil profile pin of QFP paster device to the distance between the upper surface of boss; The length of described pan, width equal the distance of length that distance between the end of toe section of relative aerofoil profile pin of QFP paster device deducts the toe section of twice respectively; The thickness of described boss equals QFP paster device body upper surface to the distance between the upper surface of the connecting portion of aerofoil profile pin; Distance between the boss facing each other equals length, the width of QFP paster device body respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205546067U CN201860547U (en) | 2010-09-30 | 2010-09-30 | Pin leveling device for paster component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205546067U CN201860547U (en) | 2010-09-30 | 2010-09-30 | Pin leveling device for paster component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201860547U true CN201860547U (en) | 2011-06-08 |
Family
ID=44106342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205546067U Expired - Fee Related CN201860547U (en) | 2010-09-30 | 2010-09-30 | Pin leveling device for paster component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201860547U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781342A (en) * | 2014-02-20 | 2014-05-07 | 无锡江南计算技术研究所 | Single BGA product patch invert-mounting device and use method thereof |
| CN104284572A (en) * | 2013-07-05 | 2015-01-14 | 珠海格力电器股份有限公司 | IC pin correcting device and correcting method |
-
2010
- 2010-09-30 CN CN2010205546067U patent/CN201860547U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104284572A (en) * | 2013-07-05 | 2015-01-14 | 珠海格力电器股份有限公司 | IC pin correcting device and correcting method |
| CN104284572B (en) * | 2013-07-05 | 2017-03-22 | 珠海格力电器股份有限公司 | IC pin correcting device and correcting method |
| CN103781342A (en) * | 2014-02-20 | 2014-05-07 | 无锡江南计算技术研究所 | Single BGA product patch invert-mounting device and use method thereof |
| CN103781342B (en) * | 2014-02-20 | 2016-04-13 | 无锡江南计算技术研究所 | Single BGA product upside-down mounting paster apparatus and using method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110608 Termination date: 20120930 |