CN201859845U - 承漏盘以及晶圆刻蚀*** - Google Patents
承漏盘以及晶圆刻蚀*** Download PDFInfo
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- CN201859845U CN201859845U CN2010205844579U CN201020584457U CN201859845U CN 201859845 U CN201859845 U CN 201859845U CN 2010205844579 U CN2010205844579 U CN 2010205844579U CN 201020584457 U CN201020584457 U CN 201020584457U CN 201859845 U CN201859845 U CN 201859845U
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Application Number | Priority Date | Filing Date | Title |
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CN2010205844579U CN201859845U (zh) | 2010-10-29 | 2010-10-29 | 承漏盘以及晶圆刻蚀*** |
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CN2010205844579U CN201859845U (zh) | 2010-10-29 | 2010-10-29 | 承漏盘以及晶圆刻蚀*** |
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CN201859845U true CN201859845U (zh) | 2011-06-08 |
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CN2010205844579U Expired - Fee Related CN201859845U (zh) | 2010-10-29 | 2010-10-29 | 承漏盘以及晶圆刻蚀*** |
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CN (1) | CN201859845U (zh) |
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2010
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130326 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20130326 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110608 Termination date: 20181029 |