CN201853249U - 一种智能双界面卡的封装结构 - Google Patents
一种智能双界面卡的封装结构 Download PDFInfo
- Publication number
- CN201853249U CN201853249U CN2010206056008U CN201020605600U CN201853249U CN 201853249 U CN201853249 U CN 201853249U CN 2010206056008 U CN2010206056008 U CN 2010206056008U CN 201020605600 U CN201020605600 U CN 201020605600U CN 201853249 U CN201853249 U CN 201853249U
- Authority
- CN
- China
- Prior art keywords
- chip
- antenna
- card
- card base
- groove position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000000463 material Substances 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 22
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 description 20
- 238000010586 diagram Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241000446313 Lamella Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010206056008U CN201853249U (zh) | 2010-11-12 | 2010-11-12 | 一种智能双界面卡的封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010206056008U CN201853249U (zh) | 2010-11-12 | 2010-11-12 | 一种智能双界面卡的封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201853249U true CN201853249U (zh) | 2011-06-01 |
Family
ID=44095636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010206056008U Expired - Lifetime CN201853249U (zh) | 2010-11-12 | 2010-11-12 | 一种智能双界面卡的封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201853249U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102063637A (zh) * | 2010-11-12 | 2011-05-18 | 上海一芯智能科技有限公司 | 一种智能双界面卡及其焊接封装工艺 |
CN102376012A (zh) * | 2011-11-01 | 2012-03-14 | 上海祯显电子科技有限公司 | 一种新型双界面智能卡 |
CN102708399A (zh) * | 2012-04-16 | 2012-10-03 | 韦业明 | 双界面智能卡的焊接封装方法 |
-
2010
- 2010-11-12 CN CN2010206056008U patent/CN201853249U/zh not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102063637A (zh) * | 2010-11-12 | 2011-05-18 | 上海一芯智能科技有限公司 | 一种智能双界面卡及其焊接封装工艺 |
CN102063637B (zh) * | 2010-11-12 | 2012-11-28 | 王莉萍 | 一种智能双界面卡及其焊接封装工艺 |
CN102376012A (zh) * | 2011-11-01 | 2012-03-14 | 上海祯显电子科技有限公司 | 一种新型双界面智能卡 |
CN102708399A (zh) * | 2012-04-16 | 2012-10-03 | 韦业明 | 双界面智能卡的焊接封装方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102063637B (zh) | 一种智能双界面卡及其焊接封装工艺 | |
CN102867210A (zh) | 一种智能双界面卡焊接封装工艺 | |
CN105224979B (zh) | 一种双界面卡的自动生产***和生产方法 | |
CN201853249U (zh) | 一种智能双界面卡的封装结构 | |
CN201570056U (zh) | 一种双界面卡的自动化生产线 | |
CN102073898A (zh) | 一种双界面智能卡inlay的制造方法 | |
CN102543769A (zh) | 一种双界面卡的生产方法及其设备 | |
CN102969254B (zh) | 一种双界面卡的封装方法 | |
CN102789589B (zh) | 一种智能双界面卡及其焊接封装工艺 | |
CN102446868A (zh) | 一种新型双界面智能卡模块及其实现方式 | |
CN209314144U (zh) | 一种印刷贴片辅助装置 | |
CN206774530U (zh) | 用于双基岛封装电路的引线框架 | |
CN206774529U (zh) | 双基岛封装电路 | |
CN102891089B (zh) | 智能卡的封装方法 | |
CN206976332U (zh) | 一种三层堆叠的幅度均衡器射频芯片 | |
CN207381340U (zh) | 一种具有生产信息可追溯功能的保险丝自动组装机 | |
CN212169293U (zh) | 一种具有加热模组的ic模块拾取装置 | |
CN102915994A (zh) | 一种超薄非接触模块用载带、非接触模块以及封装方法 | |
CN103447705B (zh) | 双界面卡焊接芯片方法 | |
CN103632186A (zh) | 双界面卡芯片碰焊及封装的方法及其装置 | |
CN204348709U (zh) | 一种微型智能卡 | |
CN202306619U (zh) | 一种基于金凸点封装的非接触式智能卡 | |
CN202275438U (zh) | 一种智能双界面卡 | |
CN206639242U (zh) | 一种采用单界面条带的双界面智能卡 | |
CN202267985U (zh) | 一种双界面卡 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI XINKUN ELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHANGHAI YIXIN INTELLIGENT TECHNOLOGY CO., LTD. Effective date: 20141103 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20141103 Address after: Shanghai Road Pudong New Area town Shanghai city 201300 No. 9628 Building 1 room 541 Patentee after: SHANGHAI XINKUN ELECTRONICS TECHNOLOGY CO., LTD. Address before: 201300 Shanghai city Pudong New Area Nanhui Industrial Park Road No. 55 Patentee before: Shanghai Yixin Intelligent Technology Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI YIXIN INTELLIGENT TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHANGHAI XINKUN ELECTRONIC TECHNOLOGY CO., LTD. Effective date: 20150723 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150723 Address after: 201300, No. 55, middle Garden Road, Nanhui Industrial Park, Shanghai, Pudong New Area, 5 Patentee after: Shanghai Yixin Intelligent Technology Co., Ltd. Address before: Shanghai Road Pudong New Area town Shanghai city 201300 No. 9628 Building 1 room 541 Patentee before: SHANGHAI XINKUN ELECTRONICS TECHNOLOGY CO., LTD. |
|
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201300, No. 55, middle Garden Road, Nanhui Industrial Park, Shanghai, Pudong New Area, 5 Patentee after: One Core Intelligent Technology Co., Ltd. Address before: 201300, No. 55, middle Garden Road, Nanhui Industrial Park, Shanghai, Pudong New Area, 5 Patentee before: Shanghai Yixin Intelligent Technology Co., Ltd. |
|
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: 1, 1 building, 55 Middle Garden Road, Nanhui Industrial Park, Shanghai, Pudong New Area, 201300 Patentee after: One Core Intelligent Technology Co., Ltd. Address before: 201300, No. 55, middle Garden Road, Nanhui Industrial Park, Shanghai, Pudong New Area, 5 Patentee before: One Core Intelligent Technology Co., Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 4, 1 building, 55 Middle Garden Road, Nanhui Industrial Park, Shanghai, Pudong New Area, 201300 Patentee after: Shanghai Yixin Intelligent Technology Co., Ltd. Address before: 1, 1 building, 55 Middle Garden Road, Nanhui Industrial Park, Shanghai, Pudong New Area, 201300 Patentee before: One Core Intelligent Technology Co., Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20110601 |