CN201808158U

CN201808158U - Solar silicon chip cutting directing bar

Info

Publication number: CN201808158U
Application number: CN2010205390152U
Authority: CN
Inventors: 王图强
Original assignee: SHANGHAI SCINFO ELECTRONIC TECHNOLOGY Co Ltd
Current assignee: SHANGHAI SCINFO ELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2010-09-21
Filing date: 2010-09-21
Publication date: 2011-04-27
Anticipated expiration: 2020-09-21

Abstract

The utility model provides a solar silicon chip cutting directing bar, belongs to the technical field of solar silicon chip cutting, and relates to the solar silicon chip cutting directing bar. The cutting directing bar is arranged above a crystal bar to be cut. The solar silicon chip cutting directing bar is provided with thickness information for cutting the crystal bar. The cutting directing bar is a resin rubber bar. The crystal bar is hard, a steel wire mark marked on the crystal bar is used as a directing line in the past, but the steel line is hard and instable so as to cause big cutter inlet cutting seams, and the silicon chip is thin as required, so the silicon chips at the cutter inlet and the cutter outlet have non-uniform thickness. Nowadays, the steel line is changed into the cutting directing bar, so the cutting effect is good, the qualification rate is greatly improved, and the work efficiency of a machine is greatly improved; and after the distance between guide wheels is corrected, even if the belt sand is insufficient in cutting, the whole size controlled within a tolerance value can be ensured.

Description

Bar is guided in the solar silicon wafers cutting into

Technical field

The utility model belongs to solar silicon wafers cutting technique field, relates to a kind of solar silicon wafers cutting and guides bar into.

Background technology

In short supply along with the energy, photovoltaic generation more and more is subjected to people's attention, and the market demand of solar silicon wafers is also increasing.Silicon chip of solar cell cuts into thin slice with square silicon single crystal rod and forms, but because silicon wafer material price costliness, especially at home silicon wafer material and rare, the cost that therefore how to reduce solar silicon wafers is most important to the competitiveness of traditional energy for improving solar energy.

For reducing the cost of silicon chip of solar cell, need make a square silicon single crystal rod can cut more silicon chip, just allow every silicon chip thin as far as possible,

Along with the popularization of green energy resource in the global range and the develop rapidly of semiconductor industry in recent years, the supply and demand in silicon chip market degree to the utmost is uneven, and the backwardness of cutting processing ability and the wretched insufficiency of production capacity have constituted the bottleneck of whole semiconductor industry chain.As the key technology of silicon chip production upstream, but advantage such as the novel silicon chip multifibres cutting technique that emerges in recent years has cutting surface quality height, cutting efficiency high cut lengths are big and following process is convenient.And Japanese NTC butt machine stable fluctuation ratio in just producing the product process is bigger, and qualification rate only has only about 50%, needs through reconditioning could be qualified once more, and these defective square rods have brought great loss to company.

The utility model content

The purpose of this utility model is all difficulties and the problem that has overcome in the present processing procedure control procedure, and a kind of configurable intelligence processing procedure control system and its implementation are provided.

Bar is guided in a kind of solar silicon wafers cutting into, and this cutting is guided bar into and is arranged on above the crystal bar to be cut.

Further, bar is guided in described a kind of solar silicon wafers cutting into, also has following technical characterictic:

Guide into above the bar in described a kind of solar silicon wafers cutting, also be provided with the thickness information that crystal bar need cut.

It is the resin adhesive tape that bar is guided in described cutting into.

Advantage of the present utility model: because crystal bar is harder, all be to draw the steel wire mark in the above in the past, as the line of guiding into of crystal bar cutting, but because steel wire is too hard unstable, cause feed mouth cutting seam big, silicon chip is thinner than what require, follows out edge of a knife silicon chip to produce very big became uneven.Now we change steel wire into present cutting and guide bar into, and cutting effect is good, and qualification rate increases substantially, and have greatly improved the operating efficiency of machine; The directive wheel spacing even band sand is not enough in the cutting, also can guarantee that whole dimension is controlled in the tolerance value through after revising.

Description of drawings

Below in conjunction with the drawings and specific embodiments the utility model is described in further detail:

Fig. 1 guides the structural representation of bar into for a kind of solar silicon wafers cutting described in the utility model.

The specific embodiment

For further disclosing the technical solution of the utility model, convenient your auditor's censorship is described with reference to the accompanying drawings embodiment of the present utility model now:

The explanation of Fig. 1:

Join shown in Figure 1ly, showed that a kind of solar silicon wafers cutting described in the utility model guides the structure of bar 110 into.On crystal bar 100, be provided with two solar silicon wafers cuttings and guide bar 110 into.Because crystal bar is harder, all is to draw the steel wire mark in the above in the past, as the line of guiding into of crystal bar cutting, but, cause feed mouth cutting seam big because steel wire is too hard unstable, silicon chip is thinner than what require, follows out edge of a knife silicon chip to produce very big became uneven.Only need guide the described solar silicon wafers cutting of this practicality into bar 110 now, be fixed on above the crystal bar 100, on this guides bar 110 into, the silicon wafer thickness that mark needs, be made up of resin material because this guides bar 110 into, quality is soft, is convenient to cut, and, feed mouth and to go out the edge of a knife in full accord.Brought great convenience for the cutting of solar silicon wafers like this.

More than, basic design of the present utility model and basic principle have been set forth by description of listed embodiment.But the utility model never is limited to above-mentioned listed embodiment, and every equivalent variations, improvement and deliberately of inferior quality behavior of doing based on the technical solution of the utility model of change all should belong to protection domain of the present utility model.

Claims

1. bar is guided in a solar silicon wafers cutting into, it is characterized in that this cutting is guided bar into and is arranged on above the crystal bar to be cut.

2. bar is guided in a kind of solar silicon wafers cutting according to claim 1 into, it is characterized in that, guides into above the bar in described a kind of solar silicon wafers cutting, also is provided with the thickness information that crystal bar need cut.

3. bar is guided in a kind of solar silicon wafers cutting according to claim 1 into, it is characterized in that it is the resin adhesive tape that bar is guided in described cutting into.