CN201796875U - Proximity sensitive package structure - Google Patents
Proximity sensitive package structure Download PDFInfo
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- CN201796875U CN201796875U CN2010202955423U CN201020295542U CN201796875U CN 201796875 U CN201796875 U CN 201796875U CN 2010202955423 U CN2010202955423 U CN 2010202955423U CN 201020295542 U CN201020295542 U CN 201020295542U CN 201796875 U CN201796875 U CN 201796875U
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Abstract
The utility model provides a proximity sensitive package structure. The structure comprises a package body, wherein the package body is provided with a first internal space, a second internal space, a first hole and a second hole; the first internal space and the second internal space are independent of each other; the first hole and the second hole are communicated with the first internal space, the second internal space and external environment respectively; a light emitting diode wafer is arranged in the first internal space and corresponds to the first hole so as to be positioned below the first hole, so that the light emitting diode wafer emits light through the first hole; and a light source sensitive wafer is arranged in the second internal space and corresponds to the second hole so as to be positioned above or below the second hole, so that the light source sensitive wafer receives the light through the second hole. Through the structure, two independent spaces which do not interfere with each other are utilized, so that two wafers are not influenced by each other.
Description
Technical field
The utility model relates to a kind of encapsulating structure, particularly a kind of sensing encapsulating structure that closely connects.
Background technology
Sensing is very main base electronic with control, in order to carry out sensing, need a signal, this signal shows with the form of light usually, signal with this light is delivered to testee then, reflect back into sensor again, then this signal that contains information will be read out, to do further application.Because the difference of element physical characteristic, and in order to reach the element function optimization, as shown in Figure 1, light source wafer 10 and induction wafer 12 are manufactured separately usually and encapsulate, and utilize printed circuit board (PCB) 14 that it is electrically connected, can be used for surveying testee 16 by this.
For instance, the sensor that in the past was used for distance sensing is two wafers independently, and one is light-emitting diode (LED) wafer, and another is for receiving the light source sensing wafer.Because two wafers must independently be made and be integrated, so higher, the required manufacturing process of required cost of manufacture is also more various, and the assembly program very complicated, and in addition, the encapsulating structure volume after finishing is also bigger; Another person has only a sensing wafer for this kind structure, and the distance that can detect is quite limited, can't generally be applicable to general consumer electronic product, causes the consumer to perplex.
In view of this, the utility model is satisfied the disappearance at above-mentioned known technology, proposes a kind of sensing encapsulating structure that closely connects, effectively to overcome these above-mentioned problems.
Summary of the invention
Main purpose of the present utility model, be to provide a kind of sensing encapsulating structure that closely connects, it has two independently inner spaces, so that LED wafer and light source sensing wafer to be installed respectively, this encapsulating structure not only has small size, more can avoid sensing wafer directly to be subjected to transmitting illuminant and disturb, to promote product usefulness.
For reaching above-mentioned purpose, the utility model provides a kind of sensing encapsulating structure that closely connects, comprise a packaging body, a LED wafer and a light source sensing wafer, packaging body has mutually independently first, second inner space, with first, second perforate, first, second perforate is communicated with first, second inner space and external environment condition respectively.LED wafer is located in first inner space, and the corresponding first perforate setting, to be positioned at first perforate below, makes LED wafer pass through first perforate emission light.The light source sensing wafer is located in second inner space, and the corresponding second perforate setting, to be positioned at above or below second perforate, to make the light source sensing wafer see through second perforate and receives above-mentioned light.
Now for making your auditor further understanding and understanding more be arranged to architectural feature of the present utility model and the effect reached, sincerely help with preferred embodiment figure and cooperate detailed explanation, illustrate as afterwards:
Description of drawings
Fig. 1 is the encapsulating structure cutaway view of prior art;
Fig. 2 is the first example structure cutaway view of the present utility model;
Fig. 3 is the first example structure vertical view of the present utility model;
Fig. 4 is the second example structure cutaway view of the present utility model;
Fig. 5 is the second example structure vertical view of the present utility model.
Description of reference numerals: 10-light source wafer; 12-responds to wafer; The 14-printed circuit board (PCB); The 16-testee; The 18-packaging body; The 20-LED wafer; 22-light source sensing wafer; 24-first inner space; 26-second inner space; 28-first perforate; 30-second perforate; 32-optically focused reflector; The 34-light transmission piece; The 36-transparent colloid; 38-input and output pin; The 40-pedestal; The 42-barricade; The 44-cover plate; The 46-dividing plate.
Embodiment
Below introduce first embodiment of the present utility model, and see also Fig. 2 and Fig. 3.The utility model mainly comprises a packaging body 18, a LED wafer 20 and a light source sensing wafer 22.Packaging body 18 has mutually independently first, second inner space 24,26, with first, second perforate 28,30, wherein first, second perforate 28,30 is communicated with first, second inner space 24,26 and external environment condition respectively, and second perforate 30 is as receiving the light focal aperture, only accept the light at specific light wave, specific reflection angle, disturb to avoid light source sensing wafer 22 to be subjected to noise.More be provided with the optically focused reflector 32 of a dead smooth on the surface, inside of first inner space 24, and LED wafer 20 is located in first inner space 24, and corresponding first perforate 28 is provided with, to be positioned at first perforate, 28 belows, the astigmatism of light-emitting diode 20 emissions can be assembled in optically focused reflector 32, and be focused to a light, to be incident upon a determinand from first perforate 28; Light source sensing wafer 22 is located in second inner space 26, and corresponding second perforate, 30 settings, to be positioned at second perforate, 30 belows, to make light source sensing wafer 22 see through second perforate 30 and receives above-mentioned light through the determinand reflection.
In addition in order to protect wafer; in first, second perforate 28,30, be respectively equipped with a light transmission piece 34; to cover first, second perforate 28,30; in addition; also respectively in first, second inner space 24,26; filling one material is the transparent colloid 36 of plastic cement, to coat LED wafer 20 and light source sensing wafer 22 respectively.Packaging body 18 is provided with a plurality of input and output pins (I/O pin) 38 all around in response to design requirement in the bottom surface.
If have in response to design needs, the element setting that also can omit light transmission piece 34 and transparent colloid 36.
The utility model is installed in same packaging body 18 with LED wafer 20 and light source sensing wafer 22, to reduce cost and to dwindle encapsulation volume.Packaging body 18 more comprises a pedestal 40 and a barricade 42, and pedestal 40 can be conductive metal frames or substrate, and the material of barricade can be plastic cement.Pedestal 40 bottoms are provided with input and output pin 38, and the vertical surroundings that link pedestals 40 of barricade 42 to form a groove with pedestal 40, on production method, can form barricade 42 and pedestal 40 simultaneously with ejection formation or the mode that stacks bonding.Be provided with a cover plate 44 on barricade 42, with closed pockets, and this cover plate 44 has first, second perforate 28,30, and forms an accommodation space with pedestal 40, barricade 42.In addition in this accommodation space, be provided with a dividing plate 46, make first, second perforate 28,30 be positioned at the different both sides of dividing plate 46, dividing plate 46 vertical pedestal 40 and the cover plates 44 of linking, be first, second inner space 24,26 to separate accommodation space, optically focused reflector 32 is located on pedestal 40, barricade 42 and the dividing plate 46 of first inner space 24, LED wafer 20 is positioned on the pedestal 40 of first inner space 24 again, and be positioned at first perforate, 28 belows, light source sensing wafer 22 is positioned on the pedestal 40 of second inner space 26, and is positioned at second perforate, 30 belows.Because first, second inner space the 24, the 26th independently, therefore can be avoided light source sensing wafer 22 directly to be subjected to LED wafer 20 and disturb, to promote product usefulness.And two transparent colloid 36 difference fillings are in first, second inner space 24,26, to coat LED wafer 20 and light source sensing wafer 22 respectively.
The astigmatism that LED wafer 20 is sent can be incident upon earlier on the optically focused reflector, and the optically focused reflector can be reflected above-mentioned astigmatism, and focuses to first perforate 28 through transparent colloid 36, to be incident upon determinand by first perforate 28 and light transmission piece 34.Determinand is reflected again afterwards, to be incident upon on the light source sensing wafer 22 by light transmission piece 34, second perforate 30 and transparent colloid 36, in order to receive.
First embodiment be source reflection and sense path in the same side, in addition also can be at opposition side, shown in second embodiment that Fig. 4 and Fig. 5 introduce.
Second embodiment comprises a packaging body 18, a LED wafer 20 and a light source sensing wafer 22.Packaging body 18 has mutually independently first, second inner space 24,26, with first, second perforate 28,30, wherein first, second perforate 28,30 is communicated with first, second inner space 24,26 and external environment condition respectively, and 30 light of accepting specific light wave, specific reflection angle of second perforate disturb to avoid light source sensing wafer 22 to be subjected to noise.More be provided with the optically focused reflector 32 of a dead smooth on the surface, inside of first inner space 24, and LED wafer 20 is located in first inner space 24, and corresponding first perforate 28 is provided with, to be positioned at first perforate, 28 belows, the astigmatism of light-emitting diode 20 emissions can be assembled in optically focused reflector 32, and be focused to a light, to be incident upon a determinand from first perforate 28; Light source sensing wafer 22 is located in second inner space 26, and corresponding second perforate, 30 settings, to be positioned at second perforate, 30 tops, makes light source sensing wafer 22 receive above-mentioned light through the determinand reflection by second perforate 30.
In order to protect wafer; in first, second perforate 28,30, be respectively equipped with a light transmission piece 34; to cover first, second perforate 28,30; in addition; also respectively in first, second inner space 24,26; filling one material is the transparent colloid 36 of plastic cement, to coat LED wafer 20 and light source sensing wafer 22 respectively.Packaging body 18 is provided with a plurality of input and output pins (I/O pin) 38 all around in response to design requirement in the bottom surface.
Similarly, if having in response to design needs, the element setting that also can omit light transmission piece 34 and transparent colloid 36.
In order to reduce cost and to dwindle encapsulation volume, second embodiment also is installed in same packaging body 18 with LED wafer 20 and light source sensing wafer 22.Packaging body 18 more comprises a pedestal 40 and a barricade 42, and pedestal 40 can be conductive metal frames or substrate, and the material of barricade can be plastic cement.Pedestal 40 has second perforate 30, and the bottom of pedestal 40 is provided with input and output pin 38, and the barricade 42 vertical surroundings that link pedestal 40 are to form a groove with pedestal 40, on production method, barricade 42 and pedestal 40 can be formed with ejection formation or the mode that stacks bonding simultaneously.Be provided with a cover plate 44 in barricade 42, with closed pockets, and this cover plate 44 has first perforate 28, and forms an accommodation space with pedestal 40, barricade 42.In addition in this accommodation space, be provided with a dividing plate 46, make first, second perforate 28,30 be positioned at the different both sides of dividing plate 46, dividing plate 46 vertical pedestal 40 and the cover plates 44 of linking, be first, second inner space 24,26 to separate accommodation space, optically focused reflector 32 is located on pedestal 40, barricade 42 and the dividing plate 46 of first inner space 24, LED wafer 20 is positioned on the pedestal 40 of first inner space 24 again, and be positioned at first perforate, 28 belows, light source sensing wafer 22 is positioned on the pedestal 40 of second inner space 26, and is positioned at second perforate, 30 tops.Because first, second inner space the 24, the 26th independently, therefore can be avoided light source sensing wafer 22 directly to be subjected to LED wafer 20 and disturb, to promote product usefulness.And the 36 difference fillings of two transparent colloids are in first, second inner space 24,26, to coat LED wafer 20 and light source sensing wafer 22 respectively.
The light emission of second embodiment is identical with first embodiment with receive mode, repeats no more in this.
In sum, the utility model not only has small size, more can avoid sensing wafer directly to be subjected to transmitting illuminant and disturb, with effective lifting product sensing effect.
The above, it only is the utility model one preferred embodiment, be not to be used for limiting the scope that the utility model is implemented, so the equalization of doing according to the described shape of the utility model claim, structure, feature and spirit changes and modifies such as, all should be included in the claim of the present utility model.
Claims (10)
1. one kind closely connects the sensing encapsulating structure, it is characterized in that, comprises:
One packaging body, it has mutually independently first inner space and second inner space, and with first perforate and second perforate, this first perforate and second perforate are communicated with this first inner space and second inner space and external environment condition respectively;
One LED wafer, it is located in this first inner space, and to should the first perforate setting, with by this first perforate emission light; And
One light source sensing wafer, it is located in this second inner space, and to should the second perforate setting, to receive this light by this second perforate.
2. the sensing encapsulating structure that closely connects as claimed in claim 1 is characterized in that the surface, inside of this first inner space more is provided with an optically focused reflector, assembling the astigmatism of this light-emitting diode emission, and is focused to this light, to penetrate from this first perforate.
3. the sensing encapsulating structure that closely connects as claimed in claim 1 is characterized in that, more comprises two transparent colloids, and its difference filling is in this first inner space and second inner space, to coat this LED wafer and this light source sensing wafer respectively.
4. the sensing encapsulating structure that closely connects as claimed in claim 3 is characterized in that the material of these two transparent colloids is a plastic cement.
5. the sensing encapsulating structure that closely connects as claimed in claim 1 is characterized in that, more is provided with a plurality of input and output pins around the bottom surface of this packaging body.
6. the sensing encapsulating structure that closely connects as claimed in claim 1 is characterized in that, is respectively equipped with a light transmission piece in this first perforate and second perforate, to cover this first perforate and second perforate.
7. the sensing encapsulating structure that closely connects as claimed in claim 1 is characterized in that this packaging body more comprises:
One pedestal;
One barricade, it vertically links the surrounding of this pedestal, to form a groove with this pedestal;
One cover plate is located on this barricade, sealing this groove, and form an accommodation space with this pedestal, this barricade, and this cover plate has this first perforate and second perforate; And
One dividing plate, it is arranged in this accommodation space, and this first perforate and second perforate are positioned at the different both sides of this dividing plate, this divider upright links this pedestal and this cover plate, be this first inner space and second inner space to separate this accommodation space, this LED wafer is positioned on this pedestal of this first inner space, and is positioned at this first perforate below, this light source sensing wafer is positioned on this pedestal of this second inner space, and is positioned at this second perforate below.
8. the sensing encapsulating structure that closely connects as claimed in claim 1 is characterized in that this packaging body more comprises:
One pedestal has this second perforate;
One barricade, it vertically links the surrounding of this pedestal, to form a groove with this pedestal;
One cover plate is located on this barricade, sealing this groove, and form an accommodation space with this pedestal, this barricade, and this cover plate has this first perforate; And
One dividing plate, it is arranged in this accommodation space, and this first, second perforate is positioned at the different both sides of this dividing plate, this divider upright links this pedestal and this cover plate, be this first inner space and second inner space to separate this accommodation space, this LED wafer is positioned on this pedestal of this first inner space, and is positioned at this first perforate below, this light source sensing wafer is positioned on this cover plate of this second inner space, and is positioned at this second perforate top.
9. as claim 7 or the 8 described sensing encapsulating structures that closely connect, it is characterized in that this pedestal is conductive metal frames or substrate.
10. as claim 7 or the 8 described sensing encapsulating structures that closely connect, it is characterized in that the material of this barricade is a plastic cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202955423U CN201796875U (en) | 2010-08-18 | 2010-08-18 | Proximity sensitive package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202955423U CN201796875U (en) | 2010-08-18 | 2010-08-18 | Proximity sensitive package structure |
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| Publication Number | Publication Date |
|---|---|
| CN201796875U true CN201796875U (en) | 2011-04-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202955423U Expired - Fee Related CN201796875U (en) | 2010-08-18 | 2010-08-18 | Proximity sensitive package structure |
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| Country | Link |
|---|---|
| CN (1) | CN201796875U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI550894B (en) * | 2014-09-30 | 2016-09-21 | Magnetic induction module and its manufacturing method | |
| CN106648041A (en) * | 2015-11-03 | 2017-05-10 | 原相科技股份有限公司 | Optical detection device capable of avoiding environmental pollution |
| CN109213385A (en) * | 2017-07-05 | 2019-01-15 | 光宝新加坡有限公司 | Mobile device and its proximity sensing module |
| US10378952B2 (en) | 2015-10-26 | 2019-08-13 | Pixart Imaging Inc. | Optical detecting device capable of preventing environmental pollution |
-
2010
- 2010-08-18 CN CN2010202955423U patent/CN201796875U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI550894B (en) * | 2014-09-30 | 2016-09-21 | Magnetic induction module and its manufacturing method | |
| US10378952B2 (en) | 2015-10-26 | 2019-08-13 | Pixart Imaging Inc. | Optical detecting device capable of preventing environmental pollution |
| CN106648041A (en) * | 2015-11-03 | 2017-05-10 | 原相科技股份有限公司 | Optical detection device capable of avoiding environmental pollution |
| CN106648041B (en) * | 2015-11-03 | 2020-05-22 | 原相科技股份有限公司 | Optical detection device capable of avoiding environmental pollution |
| CN109213385A (en) * | 2017-07-05 | 2019-01-15 | 光宝新加坡有限公司 | Mobile device and its proximity sensing module |
| CN109213385B (en) * | 2017-07-05 | 2021-07-20 | 光宝科技新加坡私人有限公司 | Mobile device and proximity sensing module thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110413 Termination date: 20150818 |
|
| EXPY | Termination of patent right or utility model |