CN201789684U - High layer PCB (printed circuit board) with low layer deviation - Google Patents
High layer PCB (printed circuit board) with low layer deviation Download PDFInfo
- Publication number
- CN201789684U CN201789684U CN2010205049859U CN201020504985U CN201789684U CN 201789684 U CN201789684 U CN 201789684U CN 2010205049859 U CN2010205049859 U CN 2010205049859U CN 201020504985 U CN201020504985 U CN 201020504985U CN 201789684 U CN201789684 U CN 201789684U
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- pcb
- high laminate
- deviation
- pressing
- rivet
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Abstract
The utility model discloses a high layer PCB (printed circuit board) with low layer deviation. A plurality of rivets used for riveting the middle are arranged in the middle of the high layer PCB. The plurality of rivets is symmetrically distributed around the geometric center of the front surface of the high layer PCB. The layer deviation of the high layer PCB with low layer deviation can be effectively reduced by additionally arranging the rivets in the middle.
Description
Technical field
The utility model belongs to the printed wiring board technical field, relates to a kind of high laminate of the inclined to one side PCB of substratum that has.
Background technology
Pressing is exactly the internal layer circuit plate after Tong Be, film and oxidation processes, is pressed into high-rise wiring board.Wherein modal pressing mode has fusion, riveted, Pin-Lam pressing.Low layer wiring board (below 6 layers) during fusion is generally used in these three kinds of pressing modes, riveted and Pin-Lam pressing are used for high-rise wiring board (more than 6 layers).In the pressing process of the large scale pcb board of high level, no matter be that riveted or Pin-Lam pressing anomalies such as pressing off normal, interior weak point, wrinkling, white edge, slab warping all take place easily and cause this pcb board to be scrapped.Therefore, how to solve the off normal problem in the pressing, be the difficult problem of industry always.
The utility model content
The purpose of this utility model is to provide a kind of high laminate of the inclined to one side PCB of substratum that has, and this has the high laminate of the inclined to one side PCB of substratum by inclined to one side with the layer that effectively reduces the high laminate of PCB at the middle part of the high laminate of PCB increase rivet.
The utility model is to solve the problems of the technologies described above the technical scheme that is adopted to be:
A kind of have a high laminate of the inclined to one side PCB of substratum, is provided with the rivet that is used for the middle part riveted of the high laminate of PCB at the middle part of the high laminate of PCB.
Described rivet is a plurality of.
A plurality of rivets are symmetrically distributed about the geometric center in the high laminate of PCB front.
The geometric center that a plurality of rivets equidistantly are distributed in the high laminate of PCB front is on the circumference in the center of circle.
The beneficial effects of the utility model:
The utlity model has following characteristics:
1. simple to operate, technology is practical, and operating cost is low: the technology that rivet is set on the high laminate of PCB is very ripe, therefore be easy to realize, and cost is low.
2. adopt the high laminate pressing of the PCB fraction defective of this scheme pressing obviously to reduce.Owing at the middle part of the high laminate of PCB the relative position that rivet further defines each layer pcb board is set, therefore, the layer that can further reduce in the pressing process is inclined to one side.Experiment shows, this pressing mode of the present utility model to the layer that occurs easily in the high laminate pressing process partially a problem improve significantly, and anomalies such as the interior weak point that causes because of pressing, wrinkling, white edge, slab warping also reduce to some extent.
Description of drawings
Fig. 1 is the structural representation of embodiment 1 of the present utility model;
Fig. 2 is the structural representation of the high laminate riveted of existing P CB.
The high laminate of label declaration: 1-PCB, the rivet at the high laminate of 2-PCB middle part, the rivet of the high-rise panel edges part of 3-PCB.
Embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
Embodiment 1:
As shown in Figure 1, suitably increase by 8 rivets around "+" font in the middle of the high laminate of PCB intersects, at the center of "+" font, promptly the geometric center of the high laminate of PCB also increases a rivet.8 rivets on every side are about the geometric center symmetry of the high laminate of PCB.
The concrete operations of this scheme are as follows:
1. the designer is at middle "+" font symmetry rivet hole of designing in advance of pcb board that is fit to add rivet;
2. the stitching operation personnel at first begin riveted then successively to edges of boards from the centre when riveted;
3. when holing, "+" font symmetry rivet in the plate is got out in the lump;
4. will there be the position gong of rivet hole to fall during moulding.
Choose with batch 18 layers of each 800PCS of pcb board carry out pressing according to the pressing structure that adds rivet in the pressing structure of traditional edges of boards riveter nail and the plate respectively, the product quality statistics is as follows:
The pressing structure lamination comparison diagram that adds rivet in the pressing structure of the traditional edges of boards riveter nail of table one and the plate
Other execution modes: wherein a kind of is the mode of circular symmetry: the geometric center that a plurality of rivets equidistantly are distributed in the high laminate of PCB front is on the circumference in the center of circle.Also has the triangular symmetry mode in addition, the center of equilateral triangle is arranged on the geometric center in the high laminate of PCB front, a top fixed point of equilateral triangle is arranged on the vertical extended line of this geometric center, and two end points on equilateral triangle base are separately positioned on the left and right sides of this geometric center.These modes that are symmetrical arranged rivet can play the inclined to one side effect of minimizing layer of embodiment 1 equally.
Claims (4)
1. one kind has the high laminate of the inclined to one side PCB of substratum, it is characterized in that, is provided with the rivet that is used for the middle part riveted of the high laminate of PCB at the middle part of the high laminate of PCB.
2. according to claim 1 have a high laminate of the inclined to one side PCB of substratum, it is characterized in that described rivet is a plurality of.
3. according to claim 2 have a high laminate of the inclined to one side PCB of substratum, it is characterized in that, a plurality of rivets are symmetrically distributed about the geometric center in the high laminate of PCB front.
4. according to claim 3 have a high laminate of the inclined to one side PCB of substratum, it is characterized in that the geometric center that a plurality of rivets equidistantly are distributed in the high laminate of PCB front is on the circumference in the center of circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205049859U CN201789684U (en) | 2010-08-25 | 2010-08-25 | High layer PCB (printed circuit board) with low layer deviation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205049859U CN201789684U (en) | 2010-08-25 | 2010-08-25 | High layer PCB (printed circuit board) with low layer deviation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201789684U true CN201789684U (en) | 2011-04-06 |
Family
ID=43821632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205049859U Expired - Fee Related CN201789684U (en) | 2010-08-25 | 2010-08-25 | High layer PCB (printed circuit board) with low layer deviation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201789684U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103249266A (en) * | 2013-04-03 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Multilayer circuit board production method capable of preventing layer deviation |
| CN105472911A (en) * | 2014-09-12 | 2016-04-06 | 深南电路有限公司 | Lamination positioning and detecting method |
-
2010
- 2010-08-25 CN CN2010205049859U patent/CN201789684U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103249266A (en) * | 2013-04-03 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Multilayer circuit board production method capable of preventing layer deviation |
| CN105472911A (en) * | 2014-09-12 | 2016-04-06 | 深南电路有限公司 | Lamination positioning and detecting method |
| CN105472911B (en) * | 2014-09-12 | 2018-03-20 | 深南电路有限公司 | One kind lamination positioning and detection method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110406 Termination date: 20120825 |