CN201787386U

CN201787386U - Metal substrate LED module for illumination

Info

Publication number: CN201787386U
Application number: CN2010202972861U
Authority: CN
Inventors: 熊大曦; 李蕊
Original assignee: SUZHOU KEYI-SKY SEMICONDUCTOR TECHNOLOGIES Inc
Current assignee: SUZHOU KEYI-SKY SEMICONDUCTOR TECHNOLOGIES Inc
Priority date: 2010-08-19
Filing date: 2010-08-19
Publication date: 2011-04-06
Anticipated expiration: 2020-08-19

Abstract

The utility model discloses a metal substrate LED module for illumination, which comprises a metal substrate and at least one LED chip. The LED chips are fixedly connected onto the metal substrate, a circuit layer is further arranged on the metal substrate, an insulating layer is arranged between the circuit layer and the metal substrate, and the LED chips are electrically connected with each other by the circuit layer. The metal substrate LED module has the advantages that the LED chips are directly fixedly connected onto the metal substrate, processing technique such as welding, silver paste die bonding and the like can be adopted without other processing techniques, greatly reduces thermal resistance as no insulation layer is arranged among the metal substrate and the LED chips, and is simple in integral product structure and lower in production cost.

Description

A kind of illumination metal substrate LED module

Technical field

The utility model relates to a kind of LED illuminating product, a kind of especially illumination metal substrate LED module.

Background technology

Along with the develop rapidly of LED technology and reaching its maturity of great power LED production technology, its low consumption, efficiently, volume is little, numerous advantages such as in light weight and long-life, it is widely used, the Development of Packaging Technology of great power LED, accelerated the application of great power LED greatly at lighting field, the encapsulation of great power LED at present mainly is devoted to solve heat dissipation problem, promptly reduce the problem of thermal resistance, as patent of invention 200410027821.0, announced a kind of method for packing of low-thermal resistance high-power light-emitting diode, complex manufacturing, product structure is also complicated, need insulating barrier, cover the copper layer, electrode layer and external insulation layer, the metal substrate center is provided with pit, and led chip is installed in the pit, causes manufacturing procedure more, production cost is higher, and the insulating barrier below the copper-clad plate has also increased thermal resistance in addition; Utility model patent 200820093684.4 has been announced a kind of array LED encapsulation, comprise on substrate, the substrate line layer that order is provided with chip, be connected pin of chip, be connected by articulamentum between described substrate and the line layer, articulamentum is the scolder of thermal conductivity factor greater than 30W/M.K, this patent radiating effect is better, but solder layer easily produces bubble and other impurity defects in production process, influences the product total quality, and processing technology is had relatively high expectations.

The utility model content

For addressing the above problem, the purpose of this utility model is to provide a kind of production technology simple, and cost is lower, the less illumination of thermal resistance metal substrate LED module.

For achieving the above object, the technical solution of the utility model is: a kind of illumination metal substrate LED module, comprise metal substrate and at least one led chip, described led chip directly is fixedly connected on the described metal substrate, also be provided with line layer on the described metal substrate, be provided with insulating barrier between described line layer and the metal substrate, be electrically connected by described line layer between the described led chip.

Preferably, described led chip same polarity direction in a row is fixedly connected sequentially on described metal substrate, described line layer is to be located between adjacent two row's led chips and the outside of head and the tail two row's led chips, and the line layer bar in a row of mutually insulated, every row's line layer bar comprises at least one line layer bar independently, the positive pole of every row's led chip and negative pole be electrically connected on respectively on the line layer bar of relevant position and and be unified at least one group of parallel connection LED chip, then constitute series connection between adjacent two row's led chips.

Preferably, the direct high heat conduction of described led chip is fixedly connected on the described metal substrate.

Preferably, described high heat conduction is fixedly connected to comprise that welding, silver slurry are solid brilliant, and between described led chip and described metal substrate the coated with thermally conductive silicone grease.

Preferably, described metal substrate is high-thermal conductive metal copper, aluminium, silver.

Preferably, described metal substrate is the copper alloy or the aluminium alloy of high heat conduction.

Preferably, the temperature sensor that detects the metal substrate temperature and send cut-offing instruction to described illumination with the supply unit of metal substrate LED module when temperature surpasses setting value also is installed on the described metal substrate.

Adopt the beneficial effect of the technical program to be: led chip directly is fixedly connected on the metal substrate, can adopt processing technologys such as welding, the solid crystalline substance of silver slurry, do not need through other processing technology, there is not insulating barrier between metal substrate and the led chip, greatly reduce thermal resistance, entire product is simple in structure, and production cost is lower.

Description of drawings

Fig. 1 is that a kind of illumination of the utility model used the cutaway view of metal substrate LED module embodiment 1;

Fig. 2 is that a kind of illumination of the utility model used the schematic diagram of metal substrate LED module embodiment 1;

Fig. 3 is that a kind of illumination of the utility model used the schematic diagram of metal substrate LED module embodiment 2.

Numeral and the represented corresponding component title of letter among the figure:

1. metal substrate 2.LED chip 21.LED chip pin 3. line layer bars 4. insulating barriers 5. temperature sensors

The specific embodiment

Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.

Embodiment 1,

As depicted in figs. 1 and 2, a kind of illumination metal substrate LED module, comprise metal substrate 1 and 16 led chips 2, led chip 2 is welded on the metal substrate 1, also be provided with line layer 3 on the metal substrate 1, be provided with insulating barrier 4 between line layer 3 and the metal substrate 1, led chip 2 same polarity directions in a row are arranged on the metal substrate 1, line layer 3 is for being located between adjacent two row's led chips 2 and the outside of head and the tail two row's led chips 2, and the line layer bar in a row of mutually insulated, the positive pole of every row's led chip 2 and negative pole be electrically connected on the line layer bar of relevant position by led chip pin 21 respectively and and be unified into one group of parallel connection LED chip, then constitute series connection between adjacent two row's led chips 2.The temperature sensor 5 that detects metal substrate 1 temperature and send cut-offing instruction to illumination with the supply unit of metal substrate LED module when temperature surpasses setting value also is installed on the metal substrate 1.

Metal substrate 1 is high-thermal conductive metal or alloy, be copper, aluminium, a kind of in silver or copper alloy and the aluminium alloy, insulating barrier is not established in its bottom, radiating effect is better, the thickness of metal substrate 1 is more a lot of than the metal bed thickness of the copper-clad plate of available technology adopting, has bigger heat sink capacity, the setting of temperature sensor 5, more product has increased safety coefficient, it is too high and damage to stop product Yin Wendu, and the arrangement connected mode of led chip 2 is after can making product minority led chip 2 damaging therein, still can work on, overcome the problem that single line series connection product causes the entire product to work because of one of them led chip 2 after damaging.

Embodiment 2,

As shown in Figure 3, all the other are identical with embodiment 1, difference is, every row's line layer bar is two, therefore every row's led chip 2 is divided into the led chip 2 of two groups of parallel connections, led chip 2 on the whole metal substrate 1 constitutes 2 groups of two groups of led chips of connecting again in parallel earlier, can constitute double-colored light source like this or can carry out the two-stage adjustment to brightness of illumination.

In the foregoing description, led chip 2 high heat conduction are fixedly connected on the metal substrate 1, comprise that welding, silver slurry are solid brilliant, and between led chip 2 and metal substrate 1 the coated with thermally conductive silicone grease.

Above-described only is preferred implementation of the present utility model; should be pointed out that for the person of ordinary skill of the art, under the prerequisite that does not break away from the utility model creation design; can also make some distortion and improvement, these all belong to protection domain of the present utility model.

Claims

1. an illumination is with metal substrate LED module, comprise metal substrate and at least one led chip, it is characterized in that, described led chip directly is fixedly connected on the described metal substrate, also be provided with line layer on the described metal substrate, be provided with insulating barrier between described line layer and the metal substrate, be electrically connected by described line layer between the described led chip.

2. illumination according to claim 1 metal substrate LED module, it is characterized in that, described led chip same polarity direction in a row is fixedly connected sequentially on described metal substrate, described line layer is to be located between adjacent two row's led chips and the outside of head and the tail two row's led chips, and the line layer bar in a row of mutually insulated, every row's line layer bar comprises at least one line layer bar independently, the positive pole of every row's led chip and negative pole be electrically connected on respectively on the line layer bar of relevant position and and be unified at least one group of parallel connection LED chip, then constitute series connection between adjacent two row's led chips.

3. illumination according to claim 1 and 2 is characterized in that with metal substrate LED module the direct high heat conduction of described led chip is fixedly connected on the described metal substrate.

4. illumination according to claim 3 is characterized in that with metal substrate LED module described high heat conduction is fixedly connected to comprise welding, the solid crystalline substance of silver slurry, and between described led chip and described metal substrate the coated with thermally conductive silicone grease.

5. illumination according to claim 3 is characterized in that with metal substrate LED module described metal substrate is high-thermal conductive metal copper, aluminium or silver.

6. illumination according to claim 3 is characterized in that with metal substrate LED module described metal substrate is the copper alloy or the aluminium alloy of high heat conduction.

7. illumination according to claim 3 metal substrate LED module, it is characterized in that, the temperature sensor that detects the metal substrate temperature and send cut-offing instruction to described illumination with the supply unit of metal substrate LED module when temperature surpasses setting value also is installed on the described metal substrate.