CN201781187U

CN201781187U - Light emitter

Info

Publication number: CN201781187U
Application number: CN201020506500XU
Authority: CN
Inventors: 邱垂侥
Original assignee: HUAXIN OPTOELECTRONICS TECHNOLOGY Inc
Current assignee: HUAXIN OPTOELECTRONICS TECHNOLOGY Inc
Priority date: 2010-08-27
Filing date: 2010-08-27
Publication date: 2011-03-30
Anticipated expiration: 2020-08-27

Abstract

A light emitter comprises a body, a laser diode element, a collimating lens and a light beam forming lens. The body is provided with a reference surface, the laser diode element is arranged on the body, laser diode crystal grains of the laser diode element are perpendicular to the reference surface of the body, the collimating lens is arranged on the reference surface of the body and opposite to a light emergent end of the laser diode element, and further, the light beam forming lens is arranged on the reference surface of the body and opposite to a light emergent end of the collimating lens. The light emitter is thinned, is simple in structure and has the function of improving heat dissipation.

Description

Light emitting devices

Technical field

The utility model relates to and a kind of laser diode element, collimating lens and light beam is formed the design that lens all give flattening, relates in particular to a kind of light emitting devices.

Background technology

The packaged type of laser diode crystal grain is packaged in TO (Transistor Outline)-can packaging body 10 inside mostly as shown in Figure 1; Therefore, when laser diode crystal grain after TO-can packaging body 10 encapsulation, when being applied to light emitting devices 20 such as laser pen, Laser Line Marker, CD-ROM device, rangefinder, Projection Display again, as shown in Figure 2, its thickness is difficult to less than 3.3mm, so can't satisfy the market demand of slimming.

The utility model content

Technical problem underlying to be solved in the utility model is, overcomes the problem that thickness that prior art exists is difficult to reduce, and a kind of light emitting devices is provided, and have the effect of slimming, and the structure dress is simple, also has the function that promotes thermal diffusivity.

The technical scheme that its technical problem that solves the utility model adopts is:

A kind of light emitting devices is characterized in that, comprising: a body has a datum level; One laser diode element is arranged at this body, and makes the datum level of its laser diode crystal grain perpendicular to this body; One collimation lens, the bright dipping end of this laser diode element and be arranged at the datum level of this body relatively.

Aforesaid light emitting devices, wherein further the bright dipping end of described relatively collimating lens is provided with a light beam and forms lens in the datum level of described body.

Aforesaid light emitting devices, wherein the laser diode element is provided with the first surface Copper Foil in the surface of an insulated substrate, second surface Copper Foil and the 3rd surperficial Copper Foil, and one photodiode fin is set in this first surface Copper Foil, this photodiode fin is provided with for a laser diode crystal grain, in this second surface Copper Foil one automated power calibration diode crystal particle is set in addition, and with this laser diode crystal grain, the photodiode fin, automated power calibration diode crystal particle, the first surface Copper Foil, second surface Copper Foil and the 3rd surperficial Copper Foil utilize several wires to constitute and electrically connect.

Aforesaid light emitting devices, wherein laser diode crystal grain is arranged at described photodiode fin in the mode that wafer directly encapsulates.

Aforesaid light emitting devices, wherein the described relatively first surface Copper Foil in the bottom surface of insulated substrate, second surface Copper Foil and the 3rd surperficial Copper Foil are respectively arranged with the first bottom surface Copper Foil, the second bottom surface Copper Foil and the 3rd bottom surface Copper Foil, and borrow the first connection perforation, the second connection perforation to be connected perforation with the 3rd and to be connected respectively.

Aforesaid light emitting devices, wherein insulated substrate is low-temperature co-fired ceramic substrate or High Temperature Co Fired Ceramic substrate.

Aforesaid light emitting devices, wherein body further is provided with a guard shield.

The beneficial effects of the utility model are have the effect of slimming, and the structure dress to be simple, also has the function that promotes thermal diffusivity.

Description of drawings

Below in conjunction with drawings and Examples the utility model is further specified.

Fig. 1 is the structure schematic appearance of existing TO-can packaging body.

Fig. 2 is the structure schematic appearance of existing light emitting devices.

Fig. 3 is a structure schematic appearance of the present utility model.

Fig. 4 is a combining structure schematic diagram of the present utility model.

Fig. 5 is a laser diode component structure schematic diagram of the present utility model.

Fig. 6 is an insulated substrate structure cutaway view of the present utility model.

The number in the figure explanation:

10TO-can packaging body 416 the 3rd bottom surface Copper Foil

20 light emitting devices 417 first connect perforation

30 bodies 418 second connect perforation

31 guard shields 419 the 3rd connect perforation

32 datum levels, 42 photodiode fin

40 laser diode elements, 43 laser diode crystal grain

41 insulated substrates, 45 automated powers calibration diode crystal particle

411 first surface Copper Foils, 46 leads

412 second surface Copper Foils, 50 collimating lenses

413 the 3rd surperficial Copper Foil 60 light beams form lens

414 first bottom surface Copper Foils

415 second bottom surface Copper Foils

Embodiment

At first, see also Fig. 3, shown in Figure 4, preferred embodiment of the present utility model includes: a body 30 has a datum level 32; One laser diode element 40 is arranged at this body 30, and makes the datum level 32 of its laser diode crystal grain 43 perpendicular to this body 30; One collimation lens (collimator lens, 50), the bright dipping end of this laser diode element 40 and be arranged at the datum level 32 of this body 30 relatively; One light beam form lens (shapping lens, 60) relatively this collimating lens 50 the bright dipping end and be arranged at the datum level 32 of this body 30; Again, this body 30 further is provided with a guard shield 31, protects this laser diode element 40, collimating lens 50 to form lens 60 with light beam and do not damage.

Then, please consult Fig. 5, shown in Figure 6 again, this laser diode element 40 is to be provided with first surface Copper Foil 411, second surface Copper Foil 412 and the 3rd surperficial Copper Foil 413 in the surface of an insulated substrate 41; And a photodiode fin (Photodiode submount is set in this first surface Copper Foil 411,42), this photodiode fin 42 is provided with in the mode that wafer directly encapsulates (chip on board) for a laser diode crystal grain (laser diode chip, 43); In this second surface Copper Foil 412 automated power calibration diode crystal particle (APC diode chip, 45) is set in addition; And this laser diode crystal grain 43, photodiode fin 42, automated power are calibrated diode crystal particle 45, first surface Copper Foil 411, second surface Copper Foil 412 and the 3rd surperficial Copper Foil 413 utilize several wires 46 to constitute electric connection.

Moreover, the bottom surface of this insulated substrate 41 this first surface Copper Foil 411, second surface Copper Foil 412 and the 3rd surperficial Copper Foil 413 relatively is respectively arranged with the first bottom surface Copper Foil 414, the second bottom surface Copper Foil 415 and the 3rd bottom surface Copper Foil 416, and borrows the first connection perforation 417, the second connection perforation 418 to be connected perforation 419 with the 3rd and to be connected respectively; Again, this insulated substrate 41 be low-temperature co-fired ceramic substrate (Low Temperature Co-fired Ceramics, LTCC) or the High Temperature Co Fired Ceramic substrate (High Temperature Co-fired Ceramics, HTCC).

Based on said structure, the utility model makes this laser diode element 40, collimating lens 50 form all designs of flattening of lens 60 with light beam, can reduce module thickness to 1.5mm, and have the effect of slimming.Other is the person, this laser diode crystal grain 43 is arranged at this photodiode fin 42 in the mode that wafer directly encapsulates, and then this photodiode fin 42 and automated power calibration diode crystal particle 45 are arranged at the first surface Copper Foil 411 and second surface Copper Foil 412 of this insulated substrate 41, and the electric connection that utilizes several wires 46 to constitute between each associated components, whole member is changed on a small quantity, adorns simple effect and have structure.Again, this first bottom surface Copper Foil 414, the second bottom surface Copper Foil 415, the 3rd bottom surface Copper Foil 416, first connect perforation 417, second and connect perforation 418 is connected perforation 419 with the 3rd setting, can be with the work used heat of this laser diode crystal grain 43, photodiode fin 42 and automated power calibration diode crystal particle 45, transmit downwards fast and outwards transmit by outside line again, and have the effect that promotes thermal diffusivity.

The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any simple modification, equivalent variations and modification that above embodiment did.

In sum, the utility model is on structural design, use practicality and cost benefit, it is required to meet industry development fully, and the structure that is disclosed also is to have unprecedented innovation structure, have novelty, creativeness, practicality, the regulation that meets relevant novel patent requirement is so mention application in accordance with the law.

Claims

1. a light emitting devices is characterized in that, comprising:

One body has a datum level;

One laser diode element is arranged at this body, and makes the datum level of its laser diode crystal grain perpendicular to this body;

One collimation lens, the bright dipping end of this laser diode element and be arranged at the datum level of this body relatively.

2. light emitting devices according to claim 1 is characterized in that, further the bright dipping end of described relatively collimating lens is provided with a light beam and forms lens in the datum level of described body.

3. light emitting devices according to claim 1 and 2, it is characterized in that, described laser diode element is provided with the first surface Copper Foil in the surface of an insulated substrate, second surface Copper Foil and the 3rd surperficial Copper Foil, and one photodiode fin is set in this first surface Copper Foil, this photodiode fin is provided with for a laser diode crystal grain, in this second surface Copper Foil one automated power calibration diode crystal particle is set in addition, and with described laser diode crystal grain, the photodiode fin, automated power calibration diode crystal particle, the first surface Copper Foil, second surface Copper Foil and the 3rd surperficial Copper Foil utilize several wires to constitute and electrically connect.

4. light emitting devices according to claim 3 is characterized in that, described laser diode crystal grain is arranged at described photodiode fin in the mode that wafer directly encapsulates.

5. light emitting devices according to claim 4, it is characterized in that, the described relatively first surface Copper Foil in the bottom surface of described insulated substrate, second surface Copper Foil and the 3rd surperficial Copper Foil are respectively arranged with the first bottom surface Copper Foil, the second bottom surface Copper Foil and the 3rd bottom surface Copper Foil, and borrow the first connection perforation, the second connection perforation to be connected perforation with the 3rd and to be connected respectively.

6. light emitting devices according to claim 5 is characterized in that, described insulated substrate is low-temperature co-fired ceramic substrate or High Temperature Co Fired Ceramic substrate.

7. light emitting devices according to claim 6 is characterized in that described body further is provided with a guard shield.