CN201774737U - Flexible circuit board structure with function of preventing short circuit in assembly - Google Patents
Flexible circuit board structure with function of preventing short circuit in assembly Download PDFInfo
- Publication number
- CN201774737U CN201774737U CN2010202803948U CN201020280394U CN201774737U CN 201774737 U CN201774737 U CN 201774737U CN 2010202803948 U CN2010202803948 U CN 2010202803948U CN 201020280394 U CN201020280394 U CN 201020280394U CN 201774737 U CN201774737 U CN 201774737U
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- lateral margin
- conductive layer
- circuit board
- coverlay
- flexible circuit
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Abstract
A flexible circuit board structure with a function of preventing short circuit in assembly comprises a conductive layer, a first covering film and a second covering film, wherein the first covering film is arranged on the lower surface of the conductive layer and the second covering film is arranged on the upper surface of the conductive layer. As one end of the first covering film contacting with a conductor is protruded from the conductive layer, the problem of short circuit caused when the conductive layer is pressed to contact with the conductor by external force during crimping assembly can be avoided.
Description
Technical field
The utility model relates to a kind of flexible circuit board structure, refers to a kind of flexible circuit board structure that prevents to assemble short-circuit function that has especially.
Background technology
Printed circuit board (PCB) can be divided into rigid circuit board and flexible electric circuit board according to the difference of materials used, wherein flexible electric circuit board is exactly the flexible circuit board that is commonly called as, flexible circuit board is a kind of highly flexual printed circuit board (PCB) that has, and circuit board bending, distortion, folding and volume is arbitrarily scratched.Utilize the advantage of flexible circuit board, just can reach the compact demand of electronic product, make flexible circuit board be widely used in industries such as electronic computer, communication, space flight and household electrical appliances.
In the tradition flexible circuit board, conductive layer is designed to extend to the finished product external form, and the PIN pin of conductive layer flushes with the finished product external form.Yet when flexible circuit board when crimping is assembled, conductive layer be subjected to external force extruding and to around extend, make conductive layer may protrude in coverlay.Therefore conductive layer just can contact with conductor and the situation that is short-circuited, and then influences process rate.
So, the improving of the above-mentioned defective of inventor's thoughts, and according to the correlation experience of being engaged in for many years in this respect, the concentrated observation and research, and cooperate the utilization of scientific principle, and propose a kind of reasonable in design and effectively improve the utility model of above-mentioned defective.
The utility model content
Main purpose of the present utility model: be to provide a kind of flexible circuit board structure that prevents to assemble short-circuit function that has, wherein, the coverlay of being located at the conductive layer below has an outstanding structure, and more traditional flexible circuit board structure more can intercept the probability that is short-circuited between conductive layer and conductor fully.
To achieve the above object: the utility model provides a conductive layer to have one first lateral margin and second lateral margin relative with this first lateral margin; One is located at first coverlay of the lower surface of this conductive layer, and it has second coverlay that one the 3rd lateral margin and four lateral margin and relative with the 3rd lateral margin are located at the upper surface of this conductive layer.Wherein, the 3rd lateral margin of this first coverlay protrudes in this first lateral margin of this conductive layer, to form an outstanding structure.
The utlity model has following effect: the length that this outstanding structure is extended can be subjected to the external force extrusion and the space of extension as this conductive layer, therefore be assembled in conductor also during stressed crimping when having the flexible circuit board structure that prevents to assemble short-circuit function, can avoid the outside extension of this conductive layer and contact this conductor, so can solve the problem that is short-circuited between conductive layer and conductor.
For enabling further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Fig. 1 is the schematic diagram with the flexible circuit board structure that prevents to assemble short-circuit function of the present utility model;
Fig. 2 A is the schematic diagram of flexible circuit board structure after the mould cutting that prevents to assemble short-circuit function that have of the present utility model;
Fig. 2 B is the schematic diagram of flexible circuit board structure when crimping is assembled that prevents to assemble short-circuit function that have of the present utility model;
Fig. 2 C is that of the present utility model to have the flexible circuit board structure that prevents to assemble short-circuit function be schematic diagram when being subjected to the external force extruding.
Fig. 3 A is the schematic diagram of flexible circuit board structure after the etching first time that prevents to assemble short-circuit function that have of the present utility model.
Fig. 3 B is the schematic diagram of flexible circuit board structure after the exposure second time that prevents to assemble short-circuit function that have of the present utility model;
Fig. 3 C is the schematic diagram of flexible circuit board structure after the etching second time that prevents to assemble short-circuit function that have of the present utility model;
Fig. 3 D is the schematic diagram of flexible circuit board structure after sticking second coverlay that prevents to assemble short-circuit function that have of the present utility model.
[main element description of reference numerals]
1 has the flexible circuit board structure that prevents to assemble short-circuit function
10 conductive layers
10A first lateral margin
10B second lateral margin
11 first coverlays
11A the 3rd lateral margin
11B the 4th lateral margin
110 outstanding structures
111 first adhesion layers
112 first substrates
12 second coverlays
12A the 5th lateral margin
12B the 6th lateral margin
121 second adhesion layers
122 second substrates
20 conductors
30 egative films
40 external form moulds
Embodiment
Shown in Fig. 1 and Fig. 2 C, the utility model discloses a kind of flexible circuit board structure 1 that prevents to assemble short-circuit function that has, and it comprises a conductive layer 10; One is located at first coverlay 11 of the lower surface of this conductive layer 10; And second coverlay 12 of being located at the upper surface of this conductive layer 10, wherein, protrude in this conductive layer 10 one with this first coverlay 11 of the contact jaw of conductor 20, so when crimping is assembled, can avoid this conductive layer 10 to be subjected to external force to push and be contacted with above-mentioned conductor 20, the short circuit problem that is caused.
Please refer to Fig. 1 and Fig. 2 C, conductive layer 10 has one first lateral margin 10A and second a lateral margin 10B relative with this first lateral margin 10A; And this first coverlay 11 of being located at the lower surface of this conductive layer 10 has one the 3rd lateral margin 11A and four a lateral margin 11B relative with the 3rd lateral margin 11A, the 3rd lateral margin 11A is corresponding to this first lateral margin 10A, and the 3rd lateral margin 11A of this first coverlay 11 protrudes in this first lateral margin 10A of this conductive layer 10, to form an outstanding structure 110, the length of should outstanding structure 110 extending can be subjected to the external force extrusion and the space of extending as this conductive layer 10, to avoid this conductive layer 10 to be subjected to the external force extrusion and to contact above-mentioned conductor 20.In addition, the upper surface of this conductive layer 10 then can be provided with this second coverlay 12; In other words, this conductive layer 10 is located between this first coverlay 11 and this second coverlay 12, prevents that the flexible circuit board structure 1 of assembling short-circuit function has enough mechanical strengths so that this has.
In addition, as shown in Figure 1, this first coverlay 11 has one first adhesion layer 111 and one first substrate 112.Wherein this first substrate 112 can be an insulating part, for example PI (pi), PET plastics such as (polyester films), and it is in order to keep the insulating properties of circuit and each layer; This first adhesion layer 111 sticks between this first substrate 112 and this conductive layer 10, and linking this first substrate 112 and this conductive layer 10, and this first adhesion layer 111 can be strengthened the structural strength that this has the flexible circuit board structure 1 that prevents to assemble short-circuit function.
On the one hand, this second coverlay 12 has one second adhesion layer 121 and one second substrate 122 again.Be same as this first substrate 112, this second substrate 122 can be the insulating properties of an insulating part with maintenance circuit and each layer, and the material of this second substrate 122 can be same as or be different from this first substrate 112; This second adhesion layer 121 sticks between this second substrate 122 and this conductive layer 10, and linking this second substrate 122 and this conductive layer 10, and this second adhesion layer 121 can be strengthened the structural strength that this has the flexible circuit board structure 1 that prevents to assemble short-circuit function.Moreover this conductive layer 10 can be a kind of Copper Foil, and it is in order to the media as the transmission of electronic installation signal.
In this specific embodiment, this second coverlay 12 has one the 5th lateral margin 12A and six a lateral margin 12B relative with the 5th lateral margin 12A, this first lateral margin 10A of this conductive layer 10 protrudes in the 5th lateral margin 12A of this second coverlay 12, makes the 5th lateral margin 12A, this first lateral margin 10A and the 3rd lateral margin 11A form a step structure; And the 6th lateral margin 12B of this second lateral margin 10B of the 4th lateral margin 11B of this first coverlay 11, this conductive layer 10 and this second coverlay 12 flushes mutually.
Please refer to Fig. 2 A, Fig. 2 B and Fig. 2 C, have flexible circuit board structure 1 crimping that prevents to assemble short-circuit function and be assembled in this conductor 20 and (for example conduct electricity silver foil when above-mentioned, stainless steel substrates, panel or the like) time, one crimping external force (arrow shown in Fig. 2 B and Fig. 2 C) can put on this this first coverlay 11 with the flexible circuit board structure 1 that prevents to assemble short-circuit function, this first lateral margin 10A of this conductive layer 10 is formed should to give prominence to structure 110 because the 3rd lateral margin 11A of this first coverlay 11 protrudes in, the part that this conductive layer 10 is prolonged by above-mentioned crimping external force also can't contact with this conductor 20, so can intercept the probability of this conductive layer 10 and these conductor 20 short circuits fully.In this specific embodiment, this outstanding structure 110 is at least 0.2 millimeter by the length that this first lateral margin 10A of this conductive layer 10 is given prominence to, to reach the situation of short circuit when avoiding crimping.
Please refer to Fig. 3 A to Fig. 3 D, above-mentioned have prevent that the flexible circuit board structure 1 of assembling short-circuit function from can utilize secondary exposure (processing procedure of similar exposure, development) and the moulding of second etch mode, concrete processing procedure is as follows: at first, this conductive layer 10 is sticked on this first coverlay 11; Then carry out the exposure first time, will give tacit consent to pattern and be transferred on this conductive layer 10 and this first coverlay 11; And utilize etching for the first time, these conductive layer 10 etchings are formed predetermined altitude, and the 3rd lateral margin 11A of this first lateral margin 10A of this conductive layer 10 and this first coverlay 11 flushes mutually, in other words, this outstanding structure 110 not moulding as yet.Next, carry out the exposure second time, one egative film 30 is set on this conductive layer 10, it covers the subregion of this conductive layer 10, in other words, this conductive layer 10 is not covered by this egative film 30 fully, utilizes etching for the second time again, etching is carried out in the zone that is not covered by this egative film 30 removed, should give prominence to structure 110 to form so that the 3rd lateral margin 11A of this first coverlay 11 can protrude in this first lateral margin 10A of this conductive layer 10; Can again this second coverlay 12 be sticked on this conductive layer 10 afterwards, to form the flexible circuit board structure 1 that prevents to assemble short-circuit function that has of the present utility model.
And made having prevent to assemble the flexible circuit board structure 1 of short-circuit function can be through an external form mould 40 (shown in Fig. 2 A) and moulding so that carry out follow-up crimping assembling.
In sum, of the present utility model have prevent to assemble the flexible circuit board structure 1 of short-circuit function when crimping is assembled, this this first coverlay 11 with the flexible circuit board structure 1 that prevents to assemble short-circuit function bears external force and this conductor 20 fluid-tight engagement, the 3rd lateral margin 11A of this first coverlay 11 protrudes in this first lateral margin 10A of this conductive layer 10, should make this conductive layer 10 to contact by the 3rd outstanding lateral margin 11A, intercept the probability of this conductive layer 10 and these conductor 20 short circuits fully with this conductor 20.
The above only is a preferable possible embodiments of the present utility model, and is non-so limit to claim protection range of the present utility model, so the equivalence techniques that all utilization the utility model specifications and accompanying drawing are done changes, all is contained in the scope of the present utility model.
Claims (7)
1. one kind has the flexible circuit board structure that prevents to assemble short-circuit function, it is characterized in that, comprises:
One conductive layer, it has one first lateral margin and second lateral margin relative with this first lateral margin;
One is located at first coverlay of the lower surface of this conductive layer, and it has one the 3rd lateral margin and four lateral margin relative with the 3rd lateral margin; And
One is located at second coverlay of the upper surface of this conductive layer;
Wherein, the 3rd lateral margin of this first coverlay protrudes in this first lateral margin of this conductive layer, to form an outstanding structure.
2. as claimed in claim 1 have a flexible circuit board structure that prevents to assemble short-circuit function, it is characterized in that this first coverlay has one first adhesion layer and one first substrate, and this first adhesion layer sticks between this first substrate and this conductive layer.
3. as claimed in claim 2 have a flexible circuit board structure that prevents to assemble short-circuit function, it is characterized in that this second coverlay has one second adhesion layer and one second substrate, and this second adhesion layer sticks between this second substrate and this conductive layer.
4. as claimed in claim 1 have a flexible circuit board structure that prevents to assemble short-circuit function, it is characterized in that this conductive layer is a Copper Foil.
5. as claimed in claim 1 have a flexible circuit board structure that prevents to assemble short-circuit function, it is characterized in that, this second coverlay has one the 5th lateral margin and six lateral margin relative with the 5th lateral margin, this of this conductive layer first lateral margin protrudes in the 5th lateral margin of this second coverlay, makes the 5th lateral margin, this first lateral margin and the 3rd lateral margin form a step structure.
6. as claimed in claim 5 have a flexible circuit board structure that prevents to assemble short-circuit function, it is characterized in that this second lateral margin of the 4th lateral margin of this first coverlay, this conductive layer and the 6th lateral margin of this second coverlay flush mutually.
7. as claimed in claim 1 have a flexible circuit board structure that prevents to assemble short-circuit function, it is characterized in that the length that this outstanding structure is given prominence to by this first lateral margin of this conductive layer is at least 0.2 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202803948U CN201774737U (en) | 2010-07-28 | 2010-07-28 | Flexible circuit board structure with function of preventing short circuit in assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202803948U CN201774737U (en) | 2010-07-28 | 2010-07-28 | Flexible circuit board structure with function of preventing short circuit in assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201774737U true CN201774737U (en) | 2011-03-23 |
Family
ID=43754577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202803948U Expired - Fee Related CN201774737U (en) | 2010-07-28 | 2010-07-28 | Flexible circuit board structure with function of preventing short circuit in assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201774737U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10559437B1 (en) | 2018-08-30 | 2020-02-11 | Chicony Electronics Co., Ltd. | Membrane switch device and keyboard device |
| TWI713896B (en) * | 2018-08-30 | 2020-12-21 | 群光電子股份有限公司 | Membrane switch device and keyboard device |
-
2010
- 2010-07-28 CN CN2010202803948U patent/CN201774737U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10559437B1 (en) | 2018-08-30 | 2020-02-11 | Chicony Electronics Co., Ltd. | Membrane switch device and keyboard device |
| TWI713896B (en) * | 2018-08-30 | 2020-12-21 | 群光電子股份有限公司 | Membrane switch device and keyboard device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Career Electronic (Kunshan) Co., Ltd. Assignor: Career Technology Mfg. Co., Ltd. Contract record no.: 2014990000003 Denomination of utility model: Flexible circuit board structure with function of preventing short circuit in assembly Granted publication date: 20110323 License type: Exclusive License Record date: 20140106 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Career Electronic (Kunshan) Co., Ltd. Assignor: Career Technology Mfg. Co., Ltd. Contract record no.: 2014990000003 Denomination of utility model: Flexible circuit board structure with function of preventing short circuit in assembly Granted publication date: 20110323 License type: Exclusive License Record date: 20140106 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110323 Termination date: 20170728 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |