CN201774733U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN201774733U CN201774733U CN2010201835142U CN201020183514U CN201774733U CN 201774733 U CN201774733 U CN 201774733U CN 2010201835142 U CN2010201835142 U CN 2010201835142U CN 201020183514 U CN201020183514 U CN 201020183514U CN 201774733 U CN201774733 U CN 201774733U
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- CN
- China
- Prior art keywords
- hole
- wiring board
- ground
- buried via
- blind
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a circuit board, which comprises a circuit board and ground holes. The ground holes include a through hole, a buried hole and a blind hole, wherein the through hole is arranged at the edge of the circuit board, and the buried hole and the blind hole are arranged in a blank area of the circuit board in a combined manner. The circuit board can effectively shorten the time of drilling the ground holes, also can enhance ground network connectivity, improves firmness of the whole board and realizes ground protection of sensitive signal networks.
Description
Technical field
The utility model relates to a kind of hole, ground arrangement of wiring board, and in particular a kind of mobile phone wiring board is at hole, the ground arrangement of the white space of cabling not.
Background technology
In the design of present mobile phone wiring board, the hole, ground is a very important part, if the hole, ground solve the bad interference that will cause a lot of radio frequency problems and audio frequency.
In the drafting of pcb board, be POWER PCB as artboard tool, be example with 6 layers of single order wiring board, the type in hole is except through hole (as: V1-6 is promptly from ground floor passage layer 6), and (as: V1-2 is promptly from the ground floor passage second layer also to need blind hole; V5-6, promptly from layer 5 passage layer 6) and buried via hole (as: V2-5, promptly from second layer passage layer 5), general through hole is beaten at edges of boards, cause the firm degree of whole plank to descend for fear of too much through hole, in the intermediate blank zone, for the zone network beeline that makes each layer to main ground, need scattered many blind holes and the buried via hole beaten.A mobile phone board generally needs hole, 2000-10000 ground, and is just pretty troublesome when the ground boring ratio is more, consider all even interference in hole, ground, generally all needs for a long time.
Therefore, prior art has yet to be improved and developed.
The utility model content
The purpose of this utility model is to provide a kind of effective wiring board, is intended to solve that the existing line plate need take long to when beating the hole, ground and the bad problem of solidness of wiring board.
The technical solution of the utility model is as follows:
A kind of wiring board comprises wiring board and hole, ground, and hole, described ground comprises through hole, buried via hole, blind hole, and wherein, described through hole is arranged on the panel edges of wiring board, and described buried via hole and blind hole combination are arranged on the white space of wiring board.
Described wiring board, wherein, described blind hole is divided into positive blind hole and back side blind hole.
Described wiring board, wherein, two positive blind holes and a buried via hole are combined as hole, one group of ground, and two positive blind holes are symmetrical arranged with respect to buried via hole.
Described wiring board, wherein, two back side blind holes and a buried via hole are combined as hole, one group of ground, and two back side blind holes are symmetrical arranged with respect to buried via hole.
Described wiring board, wherein, the buried via hole in the middle of two symmetrically arranged positive blind holes and two symmetrically arranged back side blind holes are orthogonal to, described being symmetrical arranged with respect to described buried via hole.
Described wiring board, wherein, positive blind hole and back side blind hole be overlapping to be set to overlapping blind hole.
Described wiring board, wherein, described two overlapping blind holes and a buried via hole are combined as hole, one group of ground, and two overlapping blind holes are symmetrical arranged with respect to buried via hole.
Described wiring board, wherein, described wiring board is at least four layers.
The utility model is owing to adopted in the design of mobile phone wiring board; at many white spaces; the white space of radio frequency part particularly; cleverly with blind hole and buried via hole as hole, one group of ground, duplicate then, reduced the time of beating the hole, ground effectively; can strengthen the zone network connectedness again; also solve the solidness of whole plank, strengthened the connectedness of zone network, realized the ground protection of sensitive signal network.
Description of drawings
Fig. 1 is first kind of ground pore structure schematic diagram in the utility model;
Fig. 2 is second kind of ground pore structure schematic diagram in the utility model;
Fig. 3 is the third ground pore structure schematic diagram in the utility model;
Fig. 4 is the 4th kind of ground pore structure schematic diagram in the utility model;
Fig. 5 is the wiring board schematic diagram that adopts various ground pore structure among Fig. 1 to Fig. 4.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, clear and definite, below the utility model is further specified with reference to the accompanying drawing embodiment that develops simultaneously.
The utility model is an example with 6 layers wiring board, is elaborated.In this wiring board the type in hole through hole is arranged, hole, this ground is by each layer wiring board, note is done usually: V1-6.In addition, cause the firm degree of whole plank to descend for fear of too much through hole, lead ground for the arriving of zone network beeline that makes each layer simultaneously, intermediate blank zone at wiring board, the white space of radio frequency part particularly, need scattered many blind holes and the buried via hole beaten, blind hole and buried via hole are used.For example blind hole is made as exactly and is communicated with the ground floor and the second layer, is called positive blind hole at this, and note is done usually: V1-2, and also having a kind of blind hole is to be communicated with layer 5 and layer 6, is called back side blind hole at this, note is done usually: V5-6; Buried via hole is the hole, ground that is arranged on the wiring board intermediate layer, and it need cooperate the blind hole setting, because the blind hole that is provided with previously is 1 to 2 layer and 5 to 6 layers, so the buried via hole in the present embodiment is set to the second layer to layer 5, note is done usually: V2-5.Be provided with in the present embodiment is the 4th layer mainly.
Referring to Fig. 1, the first kind of ground pore structure that is illustrated as in the present embodiment to be provided, bilateral symmetry at buried via hole 100 is provided with two positive blind holes 200, the ground wire that the ground pore structure of this combination can satisfy the ground floor and the second layer is by being communicated with positive blind hole 200, then by buried via hole 100 be connected to be the 4th layer mainly on.
Referring to Fig. 2, the second kind of ground pore structure that is illustrated as in the present embodiment to be provided, back side blind hole 300 is symmetricly set on the both sides of buried via hole 100, and the earth connection that the ground pore structure design of this combination can be satisfied layer 5 and layer 6 can cooperate on the main stratum that is communicated to wiring board with buried via hole 100 by back side blind hole 300.
Referring to Fig. 3, the third ground pore structure that is illustrated as in the present embodiment to be provided, be illustrated as the pore structure in combination of overlapping blind hole 400 and buried via hole 100, wherein hole 400 schematically illustrates for positive blind hole 200 and back side blind hole 300 are arranged on a kind of of lap position overlappingly, overlapping blind hole 400 also is the both sides that are symmetricly set on buried via hole 100, this design is more convenient, can save a buried via hole setting compared to preceding two kinds.The ground wire of the ground wire of first and second layer and the 5th, six layer all is connected to the 4th layer on the main stratum of wiring board by buried via hole 100.
The 4th kind of ground pore structure that Figure 4 shows that in the present embodiment to be provided, include two positive blind holes 200, two back side blind holes 300 and buried via holes 100 in this kind ground pore structure, wherein two positive blind holes 200 are symmetrical in buried via hole 100 settings, two back side blind holes 300 also are symmetricly set in the both sides of buried via hole 100, and with two positive blind hole 200 quadratures.The project organization in this kind ground pore structure and the third hole, ground is similar, and the ground wire of the ground wire of first and second layer and the 5th, six layer all is connected to the 4th layer on the main stratum of wiring board by buried via hole 100.
Fig. 5 is the above-mentioned application of various ground pore structure in actual track plate fabric swatch, as shown in the figure, through hole 500 is arranged on the panel edges of wiring board, evenly be furnished with the buried via hole and the blind hole of various combinations at the white space of wiring board, every kind of ground pore structure is all only with drawing one group when drawing wiring board, duplicate pore structure accordingly then as required, and be arranged in the white space of wiring board uniformly, such design can improve the layout time in hole, wiring board ground and improve the connectivity of zone network, can also satisfy the solidness that does not reduce wiring board under the situation of performance need.
Should be understood that; application of the present utility model is not limited to above-mentioned giving an example; for those of ordinary skills, can be improved according to the above description or conversion, all these improvement and conversion all should belong to the protection range of the utility model claims.
Claims (8)
1. a wiring board comprises wiring board and hole, ground, and hole, described ground comprises through hole, buried via hole, blind hole, it is characterized in that, described through hole is arranged on the panel edges of wiring board, and described buried via hole and blind hole combination are arranged on the white space of wiring board.
2. wiring board according to claim 1 is characterized in that, described blind hole is divided into positive blind hole and back side blind hole.
3. wiring board according to claim 2 is characterized in that, two positive blind holes and a buried via hole are combined as hole, one group of ground, and two positive blind holes are symmetrical arranged with respect to buried via hole.
4. wiring board according to claim 2 is characterized in that, two back side blind holes and a buried via hole are combined as hole, one group of ground, and two back side blind holes are symmetrical arranged with respect to buried via hole.
5. wiring board according to claim 2 is characterized in that, the buried via hole in the middle of two symmetrically arranged positive blind holes and two symmetrically arranged back side blind holes are orthogonal to, described being symmetrical arranged with respect to described buried via hole.
6. wiring board according to claim 2 is characterized in that, positive blind hole and back side blind hole be overlapping to be set to overlapping blind hole.
7. wiring board according to claim 6 is characterized in that, described two overlapping blind holes and a buried via hole are combined as hole, one group of ground, and two overlapping blind holes are symmetrical arranged with respect to buried via hole.
8. wiring board according to claim 1 is characterized in that described wiring board is at least four layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201835142U CN201774733U (en) | 2010-04-27 | 2010-04-27 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201835142U CN201774733U (en) | 2010-04-27 | 2010-04-27 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201774733U true CN201774733U (en) | 2011-03-23 |
Family
ID=43754573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201835142U Expired - Fee Related CN201774733U (en) | 2010-04-27 | 2010-04-27 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201774733U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105260569A (en) * | 2015-11-09 | 2016-01-20 | 浪潮集团有限公司 | Method of automatically punching ground holes based on CadenceAllegro |
| CN106061097A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Mobile terminal and PCB |
| CN110780397A (en) * | 2019-11-08 | 2020-02-11 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2010
- 2010-04-27 CN CN2010201835142U patent/CN201774733U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105260569A (en) * | 2015-11-09 | 2016-01-20 | 浪潮集团有限公司 | Method of automatically punching ground holes based on CadenceAllegro |
| CN106061097A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Mobile terminal and PCB |
| CN110780397A (en) * | 2019-11-08 | 2020-02-11 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN110780397B (en) * | 2019-11-08 | 2021-07-27 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110323 Termination date: 20130427 |