CN201725810U - Packaging structure of high-power LED - Google Patents
Packaging structure of high-power LED Download PDFInfo
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- CN201725810U CN201725810U CN2010201340652U CN201020134065U CN201725810U CN 201725810 U CN201725810 U CN 201725810U CN 2010201340652 U CN2010201340652 U CN 2010201340652U CN 201020134065 U CN201020134065 U CN 201020134065U CN 201725810 U CN201725810 U CN 201725810U
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- led
- power led
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Abstract
The utility model discloses a packaging structure of a high-power LED, and aims to provide a packaging structure of a high-power LED with high yield; the structure comprises an LED wafer; the positive pole and the negative pole of the LED wafer are respectively connected with gold threads; the gold threads are respectively welded and fixed with the pins of the positive pole and negative pole of the LED; and small gold balls are welded at welding points between the gold threads and the LED pins. The packaging structure of the high-power LED has simple process, and is safe, reliable and applicable to the field of high-power LEDs.
Description
Technical field
The utility model relates to field of photoelectric technology, is specifically related to a kind of encapsulating structure of the great power LED that all can use safely indoor and outdoor.
Background technology
Great power LED is a kind of novel semi-conductor solid-state light source, has advantages such as energy-conservation, rich color, long service life, environmental protection, is applied to various lightings so LED replaces conventional light source and landscape lamp decoration becomes inexorable trend.But also there are some unsatisfactory parts in the encapsulating structure of current great power LED in practical application, at the both positive and negative polarity of led chip and gold thread of pin both positive and negative polarity weldering, and at each both positive and negative polarity a solder joint is arranged all, and the pad between gold thread and the pin is insecure; This simple Welding Design causes easily dead lamp when crossing the experiment of reflow soldering and high/low-temperature impact, has increased the qualification rate that has reduced product, to the actual pressure that has caused very big cost of applying.
Summary of the invention
The purpose of this utility model is the structural defect that overcomes the encapsulating structure existence of great power LED in the prior art, the technical problem that causes the qualification rate in the production process to descend; A kind of encapsulating structure of great power LED is provided,, fundamentally solves above-mentioned technological deficiency to improve the yields of great power LED when crossing the experiment of reflow soldering and high/low-temperature impact.
For realizing above technical purpose, the technical solution of the utility model is
A kind of encapsulating structure of great power LED; Include the LED wafer, the both positive and negative polarity of described LED wafer respectively is connected with a gold thread, and described gold thread is fixing with the both positive and negative polarity pin welding of LED respectively, and the pad place at described gold thread and LED pin also is welded with little gold goal.
Further, around described little gold goal and pad place, be provided with the rubberised layer of reinforcing.
Both positive and negative polarity pin and the welding between the gold thread at described LED are reinforced with the method for the rubberised layer of little gold goal and increase reinforcing, thereby strengthen pin with firm welding between the gold thread.
Useful technique effect of the present utility model is: by having increased little gold goal of welding and glue curing, make the firm stable more that is connected of gold thread and both positive and negative polarity pin, difficult drop-off in subsequent handling, the utility model technology is simple, safe and reliable, production cost is low, and practical value is big, manipulate flexiblely, be beneficial to popularization.
Description of drawings
Fig. 1 is the structural representation of an embodiment of great power LED of the present utility model.
Embodiment
With reference to accompanying drawing 1, the encapsulating structure of a kind of great power LED of the utility model; The both positive and negative polarity that includes the wafer 300 of LED respectively is connected with a gold thread 101, and described gold thread 101 is fixing with both positive and negative polarity pin 100 welding of LED respectively, and at the pad place of described gold thread 101 with LED pin 100, also is welded with little gold goal 200.With around the pad place, also be provided with the rubberised layer 201 of reinforcing at described little gold goal 200.Both positive and negative polarity pin 100 and the welding between the gold thread 101 at described LED are reinforced with the method for the rubberised layer 201 of little gold goal 200 and increase reinforcing, thereby strengthen firm welding between both positive and negative polarity pin 100 and the gold thread 101; Little gold goal 200 promptly is the suitable small metal ball of a size.
In process of production, after finishing in little gold goal 200 welding, at little gold goal 200 and pad place, glue makes glue curing by heating on the point again, forms the rubberised layer of reinforcing 201; By having increased the curing of the rubberised layer 201 that welds little gold goal 200 and reinforce, make gold thread 101 and LED both positive and negative polarity pin 100 be connected firm stable more, difficult drop-off in subsequent handling, the utility model technology is simple, safe and reliable, manipulating flexiblely, be beneficial to popularization, is the not only practical but also novel technological improvement of one of this area.
Claims (2)
1. the encapsulating structure of a great power LED; Include the LED wafer, the both positive and negative polarity of described LED wafer respectively is connected with a gold thread, and described gold thread is fixing with the both positive and negative polarity pin welding of LED respectively, and it is characterized in that: the pad place at described gold thread and LED pin also is welded with little gold goal.
2. the encapsulating structure of a kind of great power LED according to claim 1; It is characterized in that: around described little gold goal and pad place, be provided with the rubberised layer of reinforcing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201340652U CN201725810U (en) | 2010-03-16 | 2010-03-16 | Packaging structure of high-power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201340652U CN201725810U (en) | 2010-03-16 | 2010-03-16 | Packaging structure of high-power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201725810U true CN201725810U (en) | 2011-01-26 |
Family
ID=43494158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201340652U Expired - Fee Related CN201725810U (en) | 2010-03-16 | 2010-03-16 | Packaging structure of high-power LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201725810U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449946A (en) * | 2016-12-18 | 2017-02-22 | 东莞市蓝晋光电有限公司 | High-temperature-resistant damage-proof LED packaging structure |
| CN113540330A (en) * | 2021-07-12 | 2021-10-22 | 格力电器（合肥）有限公司 | Light-emitting diode |
-
2010
- 2010-03-16 CN CN2010201340652U patent/CN201725810U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449946A (en) * | 2016-12-18 | 2017-02-22 | 东莞市蓝晋光电有限公司 | High-temperature-resistant damage-proof LED packaging structure |
| CN113540330A (en) * | 2021-07-12 | 2021-10-22 | 格力电器（合肥）有限公司 | Light-emitting diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Longgang District of Shenzhen City, Guangdong province 518000 Longgang street Longgang community Baolong Industrial Zone Cui Lu 28 SEG Navigation Technology Park 1 4 floor Patentee after: Shenzhen City Department of photoelectric Polytron Technologies Inc Address before: 10, 3 floor, third industrial district, Shiyan Town, Shiyan City, Guangdong, Shenzhen, Baoan District 518018, China Patentee before: Shenzhen Unionlight Optoelectronics Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110126 Termination date: 20180316 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |