CN201699670U - Adhesive encapsulation quartz crystal resonator - Google Patents
Adhesive encapsulation quartz crystal resonator Download PDFInfo
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- CN201699670U CN201699670U CN2010202514365U CN201020251436U CN201699670U CN 201699670 U CN201699670 U CN 201699670U CN 2010202514365 U CN2010202514365 U CN 2010202514365U CN 201020251436 U CN201020251436 U CN 201020251436U CN 201699670 U CN201699670 U CN 201699670U
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Abstract
The utility model relates to an adhesive encapsulation quartz crystal resonator, which comprises a ceramic base, a metal cover plate, a wafer and a lead pin, wherein the edge of the upper end of the ceramic base is provided with a downwards step, the lower end of the metal cover plate is provided with a plane matched with the step at the edge of the ceramic base, and the metal cover plate is glued with the ceramic base through adhesives at the plane. The utility model changes the structure of the ceramic base, can realize connection through the adhesives, can simplify the structure of the ceramic base, can improve the quality and the finished product rate of the ceramic base, can reduce the production cost of products, and is convenient for miniaturization of the products.
Description
Technical field
The utility model relates to quartz-crystal resonator, specifically a kind of viscose glue packaged quartz crystal resonator.
Background technology
The surface-adhered type ceramic-packaged quartz crystal resonator of existing moulding is the SMD quartz-crystal resonator, its structure as shown in Figure 1, form by base of ceramic 1, metal cover board 2, wafer 4 and pin 6, base of ceramic 1 top is provided with groove 3, be provided with in the groove 3 be electrically connected with pin 6 print electrode 5, wafer 4 is fixed in the groove 3 by conducting resinl.Though metal cover board 2 can pass through adhering with epoxy resin with base of ceramic 1, but, epoxy resin cause wafer 4 contaminated in the groove 3 that flows into easily base of ceramic 1 owing to being squeezed when bonding, thereby, metal cover board 2 connects with the parallel sealing method of base of ceramic 1 general employing, promptly above base of ceramic, be provided with the cut down ring 7 that is connected with metal cover board 2, this can cut down ring 7 is a kind of Kufil materials, when the base of ceramic sintering, inlay up, advantage is can not pollute wafer, shortcoming is that can to cut down ring sintering technology difficulty very big, controlling bad will causing a little can cut down annular strain or inlay the not firm slit that has, leak gas during the moulding of SMD quartz-crystal resonator, influence electrical property; Its two can cut down the ring composition be Kufil, the cost of raw material is very high.
Summary of the invention
The purpose of this utility model is at the deficiencies in the prior art part, and a kind of viscose glue packaged quartz crystal resonator is provided, and does not need on the pedestal to be provided with to cut down ring, has advantage simple in structure, easy to process, that production cost is low.
For achieving the above object, the utility model has adopted following technical scheme: it comprises base of ceramic, metal cover board, wafer and pin, there is a downward step at the edge of base of ceramic upper end, there is the plane that cooperates with the step at base of ceramic edge the metal cover board lower end, and metal cover board is bonding by viscose glue and base of ceramic at the place, plane.Because the viscose glue coating zone is located on the step of below at base of ceramic edge, the bonding Shi Buhui of being squeezed flow to base of ceramic above, can not pollute wafer, thereby metal cover board and base of ceramic do not need to adopt and can cut down ring and be connected, do not need expensive sealing device, not only can reduce the manufacturing cost of quartz-crystal resonator, can also reduce equipment investment.
A preferred version of the present utility model is: the upper end of base of ceramic is a platform, and platform is provided with printing electrode of being electrically connected with pin, and wafer is fixed on the platform of base of ceramic upper end.Owing to do not need to be provided with the groove that wafer is installed on the base of ceramic, can simplify the structure of base of ceramic, avoided the sintering process of multilayer stack, thereby can solve the problem of gas leakage that interlayer occurs, foaming, cracking effectively, can improve the quality and the rate of finished products of base of ceramic, reduce the processing cost of base of ceramic; Can also be convenient to the miniaturization of product at the thickness that guarantees the situation decline low production that pedestal intensity is constant.
For the pollution that prevents that viscose glue from may cause wafer, the shoulder height of base of ceramic is greater than the thickness of metal cover board and base of ceramic adhesive-layer.
As shown from the above technical solution, the utility model has changed the structure of base of ceramic, the step that is provided for the viscose glue connection by external margin can cut down ring structure to substitute, adopt viscose glue to connect, can reduce the production cost, and do not need expensive sealing device, can reduce equipment investment; Can also simplify the structure of base of ceramic, avoid the sintering process of multilayer stack, thereby can solve the problem of gas leakage that interlayer occurs, foaming, cracking effectively, improve the quality and the rate of finished products of base of ceramic, reduce the processing cost of base of ceramic; Can also be convenient to the miniaturization of product at the thickness that guarantees the situation decline low production that pedestal intensity is constant.
Description of drawings
Fig. 1 is existing SMD quartz-crystal resonator structural representation;
Fig. 2 is the utility model structural representation;
Fig. 3 is the A-A cutaway view of Fig. 2.
Embodiment
As Fig. 2, shown in Figure 3, the upper end of base of ceramic 1 is a platform, platform be provided be electrically connected with pin 6 print electrode 5, wafer 4 is fixed on the platform of base of ceramic 1 upper end by conducting resinl 10.Base of ceramic 1 upper end platform edges has a downward step 9, and step 9 height are greater than the thickness of metal cover board 2 with base of ceramic 1 adhesive-layer 8.There is the plane 11 that cooperates with the step 8 at base of ceramic 1 edge metal cover board 2 lower ends, metal cover board 2 on the plane 11 places bonding by viscose glue 8 and base of ceramic 1, viscose glue 8 can adopt epoxy resin.
Claims (3)
1. viscose glue packaged quartz crystal resonator, comprise base of ceramic (1), metal cover board (2), wafer and pin (6), it is characterized in that: there is a downward step at the edge of base of ceramic (1) upper end, there is the plane that cooperates with the step at base of ceramic edge the metal cover board lower end, and metal cover board is bonding by viscose glue and base of ceramic at the place, plane.
2. viscose glue packaged quartz crystal resonator according to claim 1 is characterized in that: the upper end of base of ceramic is a platform, and platform is provided with printing electrode of communicating with pin, and wafer is fixed on the platform of base of ceramic upper end.
3. viscose glue packaged quartz crystal resonator according to claim 1 and 2 is characterized in that: the shoulder height of base of ceramic (1) is greater than the thickness of metal cover board and base of ceramic viscose glue context layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202514365U CN201699670U (en) | 2010-07-07 | 2010-07-07 | Adhesive encapsulation quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202514365U CN201699670U (en) | 2010-07-07 | 2010-07-07 | Adhesive encapsulation quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201699670U true CN201699670U (en) | 2011-01-05 |
Family
ID=43400915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202514365U Expired - Lifetime CN201699670U (en) | 2010-07-07 | 2010-07-07 | Adhesive encapsulation quartz crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201699670U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970001A (en) * | 2012-10-31 | 2013-03-13 | 成都晶宝时频技术股份有限公司 | Quartz crystal resonator and reflow soldering method thereof |
| CN105717284A (en) * | 2014-12-05 | 2016-06-29 | 国竤工业有限公司 | Biochemical reaction detector |
-
2010
- 2010-07-07 CN CN2010202514365U patent/CN201699670U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102970001A (en) * | 2012-10-31 | 2013-03-13 | 成都晶宝时频技术股份有限公司 | Quartz crystal resonator and reflow soldering method thereof |
| CN102970001B (en) * | 2012-10-31 | 2016-01-20 | 成都晶宝时频技术股份有限公司 | A kind of quartz-crystal resonator and reflow soldering method thereof |
| CN105717284A (en) * | 2014-12-05 | 2016-06-29 | 国竤工业有限公司 | Biochemical reaction detector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: The two economic and Technological Development Zone in Anhui province Tongling City Road 244061 No. 1258 Patentee after: Anhui Polytron Technologies Inc Address before: The two economic and Technological Development Zone in Anhui province Tongling City Road 244061 No. 1258 Patentee before: Tongling City Jingsai Electronic Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110105 |