CN201698851U - Thin type resistor - Google Patents

Thin type resistor Download PDF

Info

Publication number
CN201698851U
CN201698851U CN2010202291494U CN201020229149U CN201698851U CN 201698851 U CN201698851 U CN 201698851U CN 2010202291494 U CN2010202291494 U CN 2010202291494U CN 201020229149 U CN201020229149 U CN 201020229149U CN 201698851 U CN201698851 U CN 201698851U
Authority
CN
China
Prior art keywords
sheet metal
resistance
slim
model
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2010202291494U
Other languages
Chinese (zh)
Inventor
廖进忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHUANGYU ELECTRONIC (SHENZHEN) CO Ltd
Taiwan FUTABA Electronics Corp
Original Assignee
SHUANGYU ELECTRONIC (SHENZHEN) CO Ltd
Taiwan FUTABA Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHUANGYU ELECTRONIC (SHENZHEN) CO Ltd, Taiwan FUTABA Electronics Corp filed Critical SHUANGYU ELECTRONIC (SHENZHEN) CO Ltd
Priority to CN2010202291494U priority Critical patent/CN201698851U/en
Application granted granted Critical
Publication of CN201698851U publication Critical patent/CN201698851U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Abstract

The utility model relates to a thin type resistor comprising a metal sheet, a ceramic substrate and at least two metal wires. The metal sheet comprises a plurality of conductive channels. The ceramic substrate is provided with a groove in which the metal sheet is embedded, and the metal sheet is packaged in an insulation way by utilizing silica resin. The at least two metal wires are respectively welded with the metal sheet.

Description

Slim resistance
Technical field
The utility model relates to a kind of slim resistance, particularly a kind of slim resistance that utilizes sheet metal to make.
Background technology
Along with the progress of science and technology, present electronic product all is the target of design with frivolous.Therefore on the market a kind of slimming TV has appearred, for example the LED TV.With the specification of general LED TV, its thickness is about 20 millimeters.But its panel accounts for about 10 millimeters, and thickness of shell is 2 millimeters, so the thickness of all the other internal circuit elements certainly will will reduce.Thus, the passive component of slimming will be the trend of design.Disclosed a kind of slim resistance in the prior art, it utilizes the mode of transfer graphic (Print pattern) and application laser engraving to make.But the slim resistance that utilizes this mode to make must be after transfer printing, and therefore finishing one by one or delineate required resistance value and error amount is a big problem on volume production speed and manufacturing cost.And the resistance value that the mode of utilizing laser-induced thermal etching can produce is selected will be restricted because of the figure of transfer printing, and the thickness of conductive layer is thinner than the design, have many restrictions on utilizing.If will make thin passive component, also have the problem of pulse strength deficiency.
The utility model content
Main purpose of the present utility model is to provide a kind of slim resistance, and it utilizes the technology manufacturing of precision stamping sheet metal.
For achieving the above object, the slim resistance of the utility model comprises sheet metal, ceramic matrix and at least two plain conductors.This sheet metal comprises a plurality of conductive paths.This ceramic matrix has groove, and sheet metal is embedded in groove.This at least two plain conductor is welded to connect with sheet metal respectively.Sheet metal by a plurality of conductive paths so that a resistance value to be provided.
Slim resistance described in the utility model, wherein, this sheet metal utilizes a Sheet Metal Forming Technology to form.
Slim resistance described in the utility model wherein, also comprises a silicones, in order to this ceramic matrix of insulated enclosure and this sheet metal.
Slim resistance described in the utility model, wherein, the thickness of this sheet metal is between 0.025 millimeter to 0.1 millimeter.
Slim resistance described in the utility model, wherein, the thickness of this slim resistance is between 1.9 millimeters to 2.1 millimeters.
The utlity model has following beneficial effect is: the slim resistance that satisfies resistance value and thickness requirement simultaneously can be provided, also can overcome the problem of undercapacity in the prior art, obviously be better than the resistance of prior art.
Description of drawings
Figure 1A-1B is the schematic diagram that sheet metal of the present utility model is embedded in an execution mode of ceramic matrix.
Fig. 1 C is the schematic appearance of the slim resistance of the utility model.
Fig. 2 is the front view of sheet metal of the present utility model.
Fig. 3 is the end view of sheet metal of the present utility model.
Fig. 4 is the step of manufacturing flow chart of the slim resistance of the utility model.
[main element symbol description]
Slim resistance 10
Sheet metal 20
Conductive path 21
Impression 22
Ceramic matrix 30
Groove 31
Plain conductor 40
Silicones 50
Spacing d
Thickness t
Width W
Length L
Embodiment
For above-mentioned and other purpose, feature and advantage of the present utility model can be become apparent, cited below particularlyly go out specific embodiment of the utility model, and accompanying drawing shown in cooperating, be described in detail below.
Please arrive the relevant schematic diagram of 1C with reference to Figure 1A simultaneously earlier about the slim resistance of the utility model, wherein Figure 1A-1B is the schematic diagram that sheet metal of the present utility model is embedded in an execution mode of ceramic matrix, and Fig. 1 C is the schematic appearance of the slim resistance of the utility model.Wherein sheet metal 20 to be embedded in ceramic matrix 30, forms the slim resistance 10 shown in Fig. 1 C by the mode shown in Figure 1A-1B at last again.
The slim resistance 10 of the utility model is used in the electronic installation (figure does not show), in order to a resistance value to be provided.The thickness of slim resistance 10 is preferably between 1.9 millimeters to 2.1 millimeters.When the thickness of ultrathin electronic installation (for example ultrathin TV or display) only had 2 centimetres, the part that it is inner required accordingly also must be extremely thin, so the slim resistance 10 of the utility model can satisfy this demand.
Slim resistance 10 comprises sheet metal 20, ceramic matrix 30 and plain conductor 40.Slim resistance 10 mainly feature such as material by sheet metal 20 and shape so that different resistance values to be provided.About the manufacture of sheet metal 20 after can have a detailed description, so do not give unnecessary details earlier at this.Ceramic matrix 30 is made by a ceramic material, and has groove 31, and sheet metal 20 can be embedded in the groove 31 of ceramic matrix 30.The ceramic matrix 30 that ceramic material is made can provide the supporting role of slim resistance 10, to solve the shortcoming of slim passive component easy deformation in the prior art.
Plain conductor 40 is preferably a copper cash or a copper covered steel wire (but the utility model is not limited thereto) is made.Plain conductor 40 is welded on the sheet metal 20, so that slim resistance 10 can electrically connect with other part (figure does not show) of electronic installation.The welding manner of plain conductor 40 and sheet metal 20 can be the mode of spot welding, but the utility model is not as limit.Plain conductor 40 can be 2 or 4, and the utility model does not exceed with the quantity shown in scheming.
Slim resistance 10 also can comprise silicones (Silicon Resin) 50.Silicones 50 is in order to insulated enclosure sheet metal 20 and ceramic matrix 30, in order to protect the structure of slim resistance 10.Sheet metal 20 is embedded in the groove 31 of ceramic matrix 30 after welding with plain conductor 40 again.Slim resistance 10 after chimeric is promptly shown in Figure 1B.Utilize silicones 50 with sheet metal 20 and ceramic matrix 30 sealings at last again, handle the back to protect the structure of slim resistance 10 through baking and curing.
Then please refer to Fig. 2 and Fig. 3 relevant schematic diagram about sheet metal of the present utility model, wherein Fig. 2 is the front view of sheet metal of the present utility model, and Fig. 3 is the end view of sheet metal of the present utility model.
Sheet metal 20 available machines used precision stamping manufacturings of the present utility model form, and are automatically banded (Auto-tape) form, are beneficial to assemble automatically with other member.The material of sheet metal 20 can be copper, but the utility model also can be made by other metal not as limit, to adjust the required resistance of slim resistance 10.Sheet metal 20 comprises a plurality of conductive paths 21 and impression 22.Sheet metal 20 can pass through its shape, and promptly the quantity of conductive path 21 and/or spacing are adjusted the required resistance of slim resistance 10.In the present embodiment, the spacing d of any two adjacent conductive paths 21 is about 0.2 millimeter, but the utility model is not as limit.
In an embodiment of the present utility model, plain conductor 40 utilizes the mode of spot welding to be fixed on impression 22, so the quantity of the quantity complexed metal lead 40 of impression 22.
On the other hand, the resistance value of slim resistance 10 also can be by the thickness t decision of sheet metal 20.In the present embodiment, the thickness t of sheet metal 20 is between 0.025 millimeter to 0.1 millimeter.
In detail, the resistance value of slim resistance 10 can be tried to achieve by following formula:
t = L R × W × ρ
Wherein t is the thickness of sheet metal 20, and L is the length of the conductive path 21 of sheet metal 20, and W is the width of the conductive path 21 of sheet metal 20, and ρ is the resistivity of the material of sheet metal 20, and last R is the resistance value of slim resistance 10.
By above-mentioned explanation as can be known, sheet metal 20 can utilize the length L of its thickness t, its conductive path 21 and width W with and material (ρ) obtain required resistance value.Therefore, in the utility model, sheet metal 20 can utilize different collocation modes, to obtain 0.025 ohm to 47 ohm resistance value.
Then please refer to the step of manufacturing flow chart of Fig. 4 for the slim resistance of the utility model.Be noted that herein, though below be the manufacture method of the slim resistance of example explanation the utility model with above-mentioned slim resistance 10, the manufacture method of the slim resistance of the utility model is not so that be used in above-mentioned slim resistance 10 and exceed.
At first carry out step 401: according to a required resistance value, utilize a Sheet Metal Forming Technology to form a sheet metal, this sheet metal comprises a plurality of conductive paths.
At first choose sheet metal 20 according to required resistance value, and the shape of design sheet metal 20.Sheet metal utilizes the technology manufacturing of machine precision stamping, and produces and to become automatic belt-like form, promptly can increase speed of production and output thus.In the present embodiment, the shape of sheet metal 20 as shown in Figure 2, sheet metal 20 forms a plurality of conductive paths 21 and at least two impressions 22.And sheet metal 20 can be according to required resistance value to determine its shape, i.e. the quantity of conductive path 21 and its length L and width W.The utility model does not exceed with shape shown in Figure 2.Except utilizing above-mentioned shape, also can utilize the technology of machine punching press to produce the sheet metal 20 of different materials and thickness, to determine resulting resistance value.
Then carry out step 402: provide at least two plain conductors to connect this sheet metal respectively.
Then provide at least two plain conductors 40, to be connected to sheet metal 20 respectively.In an embodiment of the present utility model, plain conductor 40 utilizes the mode of spot welding to be welded in the impression 22 of sheet metal 20 respectively.
Carry out step 403 again: a ceramic matrix is provided, and this ceramic matrix comprises a groove, with chimeric this sheet metal in the groove of this ceramic matrix.
Then provide ceramic matrix 30 again, this ceramic matrix 30 comprises groove 31.Sheet metal 20 is embedded in the groove 31 of ceramic matrix 30, promptly shown in Figure 1A-1B.
Step 404 a: silicones is provided,, and carries out the oven dry flow process with this ceramic matrix of insulated enclosure and this sheet metal.
Ceramic matrix 30 and sheet metal 20 are utilized silicones 50 sealings, carry out again the oven dry flow process with silicones 50 baking and curing to finish whole technical processs.Can obtain the slim resistance 10 shown in Fig. 1 C at last.
Carry out step 405 at last: the resistance value of measuring this slim resistance.
After above-mentioned steps 401 is finished to step 404, can obtain slim resistance 10.Can measure the resistance value of slim resistance 10 at last, to determine whether to meet demand.
Be noted that herein the manufacture method of the slim resistance of the utility model is not exceeded with the order of above-mentioned steps, as long as can reach the purpose of this utility model, but the also change of the order of above-mentioned steps.
Pass through above-mentioned steps, can produce resistance range at 0.025 ohm to 47 ohm slim resistance 10, and the thickness of slim resistance 10 is about between 1.9 millimeters to 2.1 millimeters, also can overcome the problem of undercapacity in the prior art, obviously is better than the resistance of prior art.
In sum, no matter the utility model all shows it be different from the feature of prior art with regard to purpose, means and effect.But it should be noted that the foregoing description is only given an example for convenience of explanation, the protection range that the utility model is advocated should be as the criterion with the utility model scope of disclosure, but not only limits to the foregoing description.

Claims (5)

1. a slim resistance is characterized in that, comprising:
One sheet metal comprises a plurality of conductive paths;
One ceramic matrix has a groove, and this sheet metal is embedded in this groove; And
At least two plain conductors, these plain conductors are welded to connect with this sheet metal respectively.
2. slim resistance as claimed in claim 1 is characterized in that, this sheet metal utilizes a Sheet Metal Forming Technology to form.
3. slim resistance as claimed in claim 1 is characterized in that, also comprises a silicones, in order to this ceramic matrix of insulated enclosure and this sheet metal.
4. slim resistance as claimed in claim 1 is characterized in that, the thickness of this sheet metal is between 0.025 millimeter to 0.1 millimeter.
5. slim resistance as claimed in claim 1 is characterized in that, the thickness of this slim resistance is between 1.9 millimeters to 2.1 millimeters.
CN2010202291494U 2010-06-17 2010-06-17 Thin type resistor Expired - Lifetime CN201698851U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202291494U CN201698851U (en) 2010-06-17 2010-06-17 Thin type resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202291494U CN201698851U (en) 2010-06-17 2010-06-17 Thin type resistor

Publications (1)

Publication Number Publication Date
CN201698851U true CN201698851U (en) 2011-01-05

Family

ID=43400097

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202291494U Expired - Lifetime CN201698851U (en) 2010-06-17 2010-06-17 Thin type resistor

Country Status (1)

Country Link
CN (1) CN201698851U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102290170A (en) * 2010-06-17 2011-12-21 台湾双羽电机股份有限公司 Thin resistor and production method thereof
CN105989935A (en) * 2015-03-19 2016-10-05 瑞昱半导体股份有限公司 A resistor apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102290170A (en) * 2010-06-17 2011-12-21 台湾双羽电机股份有限公司 Thin resistor and production method thereof
CN105989935A (en) * 2015-03-19 2016-10-05 瑞昱半导体股份有限公司 A resistor apparatus

Similar Documents

Publication Publication Date Title
CN101128890B (en) Surface mount electrical resistor with thermally conductive, electrically non-conductive filler and method for producing the same
CN105304241B (en) Thick film high power low resistance patch resistor and its manufacture method
JPWO2005105691A1 (en) Glass plate having conductive print and method for producing the same
CN201698851U (en) Thin type resistor
CN100572058C (en) Text printout half tone and adopt this literal printing screen plate to make the method for circuit board
CN100518438C (en) Production technology for high-precision fully resistance carbon film overlapping board
JP5824495B2 (en) Terminal manufacturing method, and terminal and electronic component core manufacturing method
US9347800B2 (en) Sensor and sensor element
CN106205911B (en) Short-circuit-proof thermosensitive chip and preparation method thereof
CN102290170A (en) Thin resistor and production method thereof
CN103367509A (en) Solar cell and formation method thereof
CN104781925B (en) The discrete device being installed on substrate
CN103247580A (en) Electronic component module and method for producing same
CN202857131U (en) Circuit board capable of reducing glue overflow and circuit structure thereof
CN102881387A (en) Micro-resistance product bonded by lamination glue and its manufacturing method
CN101364463A (en) Chip resistor and preparation thereof
CN102024538B (en) Microresistor assembly
CN107567721A (en) Coil coating process
CN103400674B (en) The manufacture method of ultrathin alloy plate sensitive resistor
KR20110125771A (en) Manufacturing method of internal antenna using multilayered structure dissimilar metalsand internal antenna thereof
CN101854777A (en) Fabricating methods for special power electronic circuit board for power supply and power module
CN210579295U (en) Flat thick film heater
CN204596786U (en) A kind of power model
CN103207227B (en) Manufacturing method for oxygen sensor chips
CN219894680U (en) Heating unit and heating body comprising same

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20110105