CN201680207U - LED (light-emitting diode) light source module - Google Patents
LED (light-emitting diode) light source module Download PDFInfo
- Publication number
- CN201680207U CN201680207U CN2010202049594U CN201020204959U CN201680207U CN 201680207 U CN201680207 U CN 201680207U CN 2010202049594 U CN2010202049594 U CN 2010202049594U CN 201020204959 U CN201020204959 U CN 201020204959U CN 201680207 U CN201680207 U CN 201680207U
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- China
- Prior art keywords
- source module
- led light
- circuit board
- emitting diode
- light
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Led Device Packages (AREA)
Abstract
The utility model provides an LED (light-emitting diode) light source module which comprises a metal base, a circuit board, a plurality of LEDs, a plurality of welding wires and an encapsulating layer. The metal base is provided with a bottom wall and a surrounding wall extending upwards from the bottom wall. The bottom wall and the surrounding wall define a containing space. The circuit board and the LEDs are respectively arranged on the bottom wall. The welding wires are respectively and electrically connected with the LEDs to the circuit board. The encapsulating layer is arranged in the containing space, and covers the LEDs and the welding wires. With excellent radiating effect, the LED light source module can further improve the entire luminous brightness.
Description
Technical field
The relevant a kind of LED light-source module of the utility model is especially relevant for a kind of LED light-source module with great heat radiation effect.
Background technology
Light emitting diode has energy-conservation advantage, replaces conventional incandescent gradually recently or fluorescent lamp uses as general illumination.No matter be the bigger street lamp of power consumption, or general indoor lamp adopts all light emitting diode to reduce the consumption of the energy.Yet, owing to can lower its luminous efficiency under the high temperature of light emitting diode when operation, and may detract its life-span, therefore, must carry out effectively light emitting diode and heat radiation rapidly through various means.
As shown in Figure 1, be a kind of known LED light-source module, it comprises a metal base plate 11, is located at the insulating barrier 12 on the metal base plate 11, most bar and is located at circuit 13 on the insulating barrier 12, at least one bonding wire 15, frame 16 around light emitting diode 14 and bonding wire 15 that is located at light emitting diode 14 on the insulating barrier 12, many electrical interconnections 13 and light emitting diode 14, and an encapsulated layer 17 that covers light emitting diode 14 and bonding wire 15.During practical operation, the heat that light emitting diode 14 is sent can conduct to metal base plate 11 and frame 16 via insulating barrier 12, help heat radiation by metal base plate 11 and frame 16, to reduce the operating temperature of light emitting diode 14 itself, prevent that light emitting diode 14 from high temperature reducing its luminous efficiency.
Yet, because light emitting diode 14 is arranged on the insulating barrier 12, the heat that light emitting diode 14 is produced when operation must can conduct on the metal base plate 11 through insulating barrier 12 earlier, radiating efficiency is comparatively not good, and heat more easily lodges in light emitting diode 14 and causes its luminous efficiency to lower on every side.
On the other hand, because light emitting diode 14 and circuit 13 are arranged on the insulating barrier 12 equally and respectively occupy certain area, improved the degree of difficulty of circuit 13 on layout on the insulating barrier 12, remote-effects on insulating barrier 12, set up more multiple optical diode 14 possibilities, cause the whole luminosity of LED light-source module further to promote.And, also can't shorten and reach the needed minimum range of even mixed light by setting up more light emitting diode 14.
The utility model content
The purpose of this utility model is to propose a kind of LED light-source module, not only can have preferable radiating effect, and can improve the whole luminosity of LED light-source module.
For reaching above-mentioned purpose, LED light-source module of the present utility model comprises a metal base, a circuit board, a plurality of light emitting diode, many bonding wires, and an encapsulated layer.This metal base has a diapire and by the upwardly extending surrounding wall of this diapire, and this diapire and this surrounding wall define an accommodation space.This circuit board and these light emitting diodes are located at respectively on this diapire.These bonding wires are electrically connected this light emitting diode respectively to this circuit board.This encapsulated layer is located in this accommodation space and is covered these light emitting diodes and these bonding wires.
Above-mentioned LED light-source module, wherein, this diapire is recessed to form a groove downwards, and at least one part of this circuit board is positioned at this groove.
Above-mentioned LED light-source module, wherein, this diapire runs through formation one downwards wears groove, and this circuit board is positioned at this and wears groove.
Above-mentioned LED light-source module, wherein, this circuit board is a single layer board, or multilayer circuit board.
Above-mentioned LED light-source module wherein, is formed with a reflecting layer on this metal base.
Above-mentioned LED light-source module, wherein, this reflecting layer is plating, sputter, or coating forms.
Above-mentioned LED light-source module, wherein, this encapsulated layer comprises fluorescent grain or granule proliferation.
Above-mentioned LED light-source module wherein, more comprises the lens jacket of being located on this encapsulated layer.
Above-mentioned LED light-source module wherein, more comprises the fluorescence coating of being located on this encapsulated layer.
Above-mentioned LED light-source module wherein, more comprises the diffusion barrier of being located on this encapsulated layer.
Above-mentioned LED light-source module, wherein, this diffusion barrier is formed by the mode of coating or attaching.
Above-mentioned LED light-source module wherein, more comprises the lens jacket of being located at this encapsulated layer top.
Above-mentioned LED light-source module, wherein, this lens jacket is a Fresnel Lenses layer.
Above-mentioned LED light-source module, wherein, this light emitting diode is the light-emitting diode component that light-emitting diode chip for backlight unit or encapsulation are finished.
Because light emitting diode of the present utility model is not to be arranged on the circuit board, but be arranged on the diapire of metal base, be electrically connected on this circuit board by bonding wire, so light emitting diode can be directly conducted on the metal base at the heat that operation the time is produced, radiating efficiency is preferable again.And, because light emitting diode is not to be arranged on this circuit board, can make that the configuration on the circuit board is more or less freely, and can be on this diapire light emitting diode be set, to improve the whole luminosity of LED light-source module in mode more closely.
Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to qualification of the present utility model.
Description of drawings
Fig. 1 is the profile of known LED light-source module;
Fig. 2 is the schematic diagram of a preferred embodiment of the utility model LED light-source module;
Fig. 3 is the cutaway view of the LED light-source module of this preferred embodiment;
Fig. 4 is the cutaway view of another embodiment of this LED light-source module;
Fig. 5 is the cutaway view of another embodiment of this LED light-source module;
Fig. 6 is the cutaway view of another embodiment of this LED light-source module;
Fig. 7 is the cutaway view of another embodiment of this LED light-source module;
Fig. 8 is the cutaway view of another embodiment of this LED light-source module;
Fig. 9 is the cutaway view of another embodiment of this LED light-source module; And
Figure 10 is the cutaway view of another embodiment of this LED light-source module.
Wherein, Reference numeral
21 metal bases
211 diapires
212 surrounding walls
213 accommodation spaces
214 grooves
215 wear groove
22 circuit boards
23 light emitting diodes
24 bonding wires
25 encapsulated layers
25 ' encapsulated layer
26 reflecting layer
27 fluorescence coatings
271 fluorescent grains
27 ' diffusion layer
271 ' granule proliferation
27 " lens jacket
28 diffusion layers
29 Fresnel Lenses layers
The specific embodiment
Below in conjunction with the drawings and specific embodiments technical solutions of the utility model being described in detail, further understanding the purpose of this utility model, scheme and effect, but is not the restriction as the utility model claims protection domain.
As shown in Figures 2 and 3, be a preferred embodiment of the utility model LED light-source module, this LED light-source module mainly comprises a metal base 21, a circuit board 22, a plurality of light emitting diode 23, many bonding wires 24, and an encapsulated layer 25.
This metal base 21 has a diapire 211 and by these diapire 211 upwardly extending surrounding walls 212, and this diapire 211 and this surrounding wall 212 define an accommodation space 213.This metal base 21 can utilize metallic plate to form through punch forming, and its material can adopt materials such as good aluminium of thermal diffusivity or copper to make.
This circuit board 22 is a strip and is located at this diapire 211 centre, and its upper surface is formed with most bar circuits and contact (figure does not show).This circuit board 22 can adopt single or multiple lift formula printed circuit board (PCB), in addition, more can adopt flexible circuit board.And, more can be provided with most electronic building bricks on this circuit board 22.
These light emitting diodes 23 are positioned at this accommodation space 213 and are arranged on the diapire 211 of metal base 21, are electrically connected to respectively on this circuit board 22 by these bonding wires 24 again.The light that these light emitting diodes 23 are sent can be identical single color, perhaps can include multicolour such as red, green, blue.In the present embodiment, this light emitting diode 23 is an example with the light-emitting diode chip for backlight unit, during actual enforcement, also can be the light-emitting diode component that encapsulation is finished, as the light-emitting diode component of bulb type (lamp type) or SMD LED surface-mount device LED (surfacemounted type).
This encapsulated layer 25 is a transparent material, it is located in this accommodation space 213 and covers this circuit board 22, these light emitting diodes 23, and these bonding wires 24, use and make this circuit board 22, these light emitting diodes 23, and these bonding wires 24 can not cause oxidation, and its performance that detracts because of the contact outside air.
By this, because light emitting diode 23 of the present utility model is not to be arranged on the circuit board 22, but be arranged on the diapire 211 of metal base 21, be electrically connected on this circuit board 22 by bonding wire 24 again, therefore the heat that produced when operation of light emitting diode 23 can be directly conducted on the metal base 21, and radiating efficiency is preferable.On the other hand, because light emitting diode 23 is not to be arranged on this circuit board 22, can make that the configuration on the circuit board 22 is more or less freely, and can be on this diapire 211 light emitting diode 23 be set, to improve the whole luminosity of LED light-source module in mode more closely.
In addition,, therefore, as shown in Figure 4, can make this diapire 211 be recessed to form a groove 214 downwards, be arranged at partially in this groove 214 for this circuit board 22 because this circuit board 22 can cover the part side direction light that light emitting diode 23 is sent.Perhaps, as shown in Figure 5, visual practical situations is further adjusted the degree of depth of this groove 214, and this circuit board 22 can fully be arranged in this groove 214.
In addition, as shown in Figure 6, this diapire 214 more can run through downwards and forms one and wears groove 215, and makes this circuit board 22 be positioned at this to wear groove 215.Because groove 215 is worn to exposing outside via this in the bottom surface of this circuit board 22, can wear groove 215 via this for extraneous power supply and be electrically connected with this circuit board 22, or input electrical signal by this.
During actual enforcement, as shown in Figure 7, more can be formed with the reflecting layer 26 of a high reflectance on this metal base 21, in order to improve the reflectivity of 21 pairs of light emitting diode 23 issued light lines of this metal base.This reflecting layer 26 can utilize plating, sputter, or coating is formed.In addition, more a fluorescence coating 27 can be set on this encapsulated layer 25.This fluorescence coating 27 can be formed by coating or the mode that attaches, and it contains most fluorescent grain 271, in order to change this light emitting diode 23 light with a predetermined wavelength that sends into another different wave length light.
Perhaps, as shown in Figure 8, more can on this encapsulated layer 25 diffusion layer 27 ' be set, this diffusion layer 27 ' also can be formed by coating or the mode that attaches, it contains a most granule proliferation 271 ', uses so that the light that light emitting diode 23 is sent spreads to reach the effect of luminenscence homogenization.
In addition, also can as shown in Figure 9 a lens jacket 27 be set on this encapsulated layer 25 further ", the feasible light that light emitting diode 23 is sent converges with imitating.Contain fluorescent grain or granule proliferation 251 in this encapsulated layer 25 ', so that wavelength translation function or light diffusion function are provided.
In addition, as shown in figure 10,, Fresnel (Fresnel) lens jacket 29 that the same light that light emitting diode 23 is sent has convergence effect can be set further on this diffusion layer 28 more except in being provided with on this encapsulated layer 25 diffusion layer 28.
Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the utility model.
Claims (14)
1. a LED light-source module is characterized in that, comprises:
One metal base has a diapire and by the upwardly extending surrounding wall of this diapire, and this diapire and this surrounding wall define an accommodation space;
One circuit board is located on this diapire;
A plurality of light emitting diodes are located on this diapire;
Many bonding wires are electrically connected this light emitting diode respectively to this circuit board; And
One encapsulated layer is located in this accommodation space and is covered this circuit board, this light emitting diode and this bonding wire.
2. LED light-source module as claimed in claim 1 is characterized in that this diapire is recessed to form a groove downwards, and at least one part of this circuit board is positioned at this groove.
3. LED light-source module as claimed in claim 1 is characterized in that, this diapire runs through formation one downwards wears groove, and this circuit board is positioned at this and wears groove.
4. LED light-source module as claimed in claim 1 is characterized in that, this circuit board is a single layer board, or multilayer circuit board.
5. LED light-source module as claimed in claim 1 is characterized in that, is formed with a reflecting layer on this metal base.
6. LED light-source module as claimed in claim 5 is characterized in that, this reflecting layer is plating, sputter, or coating forms.
7. LED light-source module as claimed in claim 1 is characterized in that this encapsulated layer comprises fluorescent grain or granule proliferation.
8. LED light-source module as claimed in claim 7 is characterized in that, more comprises the lens jacket of being located on this encapsulated layer.
9. LED light-source module as claimed in claim 1 is characterized in that, more comprises the fluorescence coating of being located on this encapsulated layer.
10. LED light-source module as claimed in claim 1 is characterized in that, more comprises the diffusion barrier of being located on this encapsulated layer.
11. LED light-source module as claimed in claim 9 is characterized in that, this diffusion barrier is formed by the mode of coating or attaching.
12. as claim 9 or the 10th described LED light-source module, it is characterized in that, more comprise the lens jacket of being located at this encapsulated layer top.
13. LED light-source module as claimed in claim 12 is characterized in that, this lens jacket is a Fresnel Lenses layer.
14. LED light-source module as claimed in claim 1 is characterized in that, this light emitting diode is the light-emitting diode component that light-emitting diode chip for backlight unit or encapsulation are finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202049594U CN201680207U (en) | 2010-05-21 | 2010-05-21 | LED (light-emitting diode) light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202049594U CN201680207U (en) | 2010-05-21 | 2010-05-21 | LED (light-emitting diode) light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201680207U true CN201680207U (en) | 2010-12-22 |
Family
ID=43345251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202049594U Expired - Fee Related CN201680207U (en) | 2010-05-21 | 2010-05-21 | LED (light-emitting diode) light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201680207U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102222759A (en) * | 2011-07-01 | 2011-10-19 | 钰桥半导体股份有限公司 | Light emitting diode (LED) optical reflecting structure with circuit board |
| TWI825905B (en) * | 2022-08-05 | 2023-12-11 | 台亞半導體股份有限公司 | Led package structure providing rectangular light source |
-
2010
- 2010-05-21 CN CN2010202049594U patent/CN201680207U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102222759A (en) * | 2011-07-01 | 2011-10-19 | 钰桥半导体股份有限公司 | Light emitting diode (LED) optical reflecting structure with circuit board |
| TWI825905B (en) * | 2022-08-05 | 2023-12-11 | 台亞半導體股份有限公司 | Led package structure providing rectangular light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101222 Termination date: 20130521 |