CN201611982U - Surface cladding structure of electronic device shell - Google Patents
Surface cladding structure of electronic device shell Download PDFInfo
- Publication number
- CN201611982U CN201611982U CN2009200942784U CN200920094278U CN201611982U CN 201611982 U CN201611982 U CN 201611982U CN 2009200942784 U CN2009200942784 U CN 2009200942784U CN 200920094278 U CN200920094278 U CN 200920094278U CN 201611982 U CN201611982 U CN 201611982U
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- electronic device
- device housing
- coating layer
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Abstract
The utility model relates to a surface cladding structure of an electronic device shell, belonging to electrical appliances. The surface cladding structure of the electronic device shell comprises a substrate, a cladding layer, a decorating area and a closing layer, wherein the substrate is a metal substrate, and is provided with the cladding layer which is formed by an anodizing manner or an electric adhesion manner; the cladding layer is provided with the decorating area which is one of etching treatment, laser engraving treatment, drilling and cutting treatment, sand blast treatment, evaporation treatment, sputtering treatment or hairline treatment so as to increase the aesthetic feeling; and then the closing layer formed by the electric adhesion treatment or the anodizing treatment and covers the substrate, the cladding layer and the decorating layer, therefore, the cladding structure leads the substrate to have high-level compact metal texture, and simultaneously achieves the purposes of obtaining needed colors and patterns.
Description
Technical field
The utility model relates to electric information, and particularly a kind of surperficial coating structure of electronic device housing refers to a kind of surperficial coating structure that makes the electronic device housing that body surface has metal-like especially.
Background technology
General electronic installation for lightweight so that produce and make, its shell adopts plastics or plastic material made mostly, but the shell of plastic material manufacturing, effect and texture when vision or touching are relatively poor, therefore, the dealer can have good visual sense of beauty and texture in order to make the electronic installation plastic casing, just the mode by plastic electroplating, coating metal level on the shell of plastic material is as the 6045866th invention of United States Patent (USP).Only can be more inactive metals such as copper, nickel in the metal level that employed plastic electroplating mode is plated, and as desire when using on the plastic electroplating mode as more active metal such as aluminium, its degree of difficulty is higher, and this plastic electroplating mode itself the step of process comparatively complicated, loaded down with trivial details go up the low and spent cost height of efficient so that produce.For solving the problem of plastic electroplating mode, therefore No. 5660934 patented invention of United States Patent (USP) a kind of by the thermal spraying mode, on working of plastics, to be formed with metal level, and this layer metal series of strata on this working of plastics directly contact with external environment so that easily with environment in dirt contact and corrosion-vulnerable.
Above-mentioned thermal spraying mode waits to improve for having following point and deficiency really when using:
Because of material is to become the particle shape with high temperature melt, in the time of on being attached to surface of bottom material, can produce many spaces between particle, and have sometimes and do not melt particle completely, make surface of bottom material texture not good.
The utility model content
Main purpose of the present utility model is to provide a kind of surperficial coating structure of electronic device housing, solves thermal spraying and is attached between the surface of bottom material particle and can produces many gaps, and have sometimes and do not melt particle completely, makes the problem that surface of bottom material texture is not good.
Electronic device housing is a ground, and this surface of bottom material system is provided with a coating layer, is provided with an ornamental area in coating layer, and is covered on this ground, coating layer and the decorative zones with a confining bed; Wherein this coating layer can be further with anode treatment mode or electricity mode form; Wherein this decorative zones can be that etch processes, laser engraving processing, drilling processing, blasting treatment, vapor deposition treatment, sputter are handled or hair is handled wherein a kind of, and drapes over one's shoulders and be located at this coating layer surface; Then, cover an electricity and the confining bed that processing or anode treatment mode form, have the metal-like of high compaction film to make surface of bottom material; Wherein this ground can be materials such as metal materials such as steel, iron, stainless steel, red metal, brass, titanium alloy, carbon fiber, tinplate or conductive material.
Advantage of the present utility model is, by above-mentioned technology, can at original thermal spraying mode existing because of material be to become the particle shape with high temperature melt, in the time of on being attached to surface of bottom material, can produce many spaces between particle, and have sometimes and do not melt particle completely, make that the not good problem points of surface of bottom material texture is broken through, reach ground and have the high compaction metal-like, and can obtain to have simultaneously the practical improvement of required color and pattern.
Description of drawings
Fig. 1 is the stereogram of the utility model preferred embodiment.
Fig. 2 is the cutaway view of the utility model preferred embodiment.
Fig. 3 is the flow chart of the utility model preferred embodiment.
Fig. 4 is the schematic flow sheet of the utility model preferred embodiment.
Embodiment
Shown in accompanying drawing 1 and accompanying drawing 2, stereogram and cutaway view for the utility model preferred embodiment, the utility model electronic device housing is a ground 10, these ground 10 surface systems are provided with a coating layer 11, be to be provided with a decorative zones 12 on this coating layer 11, and be covered in this ground 10 with a confining bed 13, on coating layer 11 and this decorative zones 12, wherein this ground 10 can be steel, iron, stainless steel, red metal, brass, titanium alloy, carbon fiber, metal material or one of them person of conductive material such as tinplate, and described coating layer 11 is can further form in the anode treatment mode or further mode with electricity to form, and the decorative zones of being located on this coating layer 11 12 is to can be etch processes, laser engraving is handled, drilling is handled, blasting treatment, vapor deposition treatment, sputter is handled or hair is handled wherein a kind of, confining bed 13 that processing or anode treatment mode form with its covering by this with electricity again, have the high compaction metal-like to finish, and can obtain to have simultaneously the coating structure of required color and pattern.
Form design by said structure, be described as follows with regard to use situation of the present utility model, shown in accompanying drawing 3 and accompanying drawing 4, be the flow chart and the schematic flow sheet of the utility model preferred embodiment, find out that by knowing among the figure surperficial coating structure of the present utility model is to carry out according to the following step:
(a) on ground 10 surfaces, carry out anode treatment or the electricity processing;
(b) on ground 10 surfaces, be formed with coating layer 11;
(c) on coating layer 11, handle or hair processing a kind of institute coating wherein with etch processes, laser engraving processing, drilling processing, blasting treatment, vapor deposition treatment, sputter;
(d) on coating layer 11, be formed with decorative zones 12; And
(e) on above-mentioned ground 10, coating layer 11, decorative zones 12, carry out electricity and processing or anode treatment to be formed with confining bed 13.It is can with these ground 10 surfaces with anode treatment or the electricity processing, go up formation coating layer 11 in ground 10 surfaces, can further impose etch processes, laser engraving is handled, drilling is handled, blasting treatment, vapor deposition treatment, sputter is handled or hair is handled one of them person, these ground 10 surfaces then are formed with decorative zones 12, can the his-and-hers watches mask there be the ground 10 of coating layer 11 and decorative zones 12 to carry out electricity and processing or anode treatment, and formation confining bed 13, and then be accomplished with this ground 10 of coating layer 11 coatings in addition decorative zones 12 and confining bed 13, make it have the purpose of high compaction metal-like.Its above-mentioned anode treatment is a kind of electrolytic process, and the sheet metal effect that coated metal is provided is just like anode, and electrolyte is generally the solion that is plating metal, and the plated body effect is then just like negative electrode.Behind the input voltage, attract the metal ion in the electrolyte to swim between anode and negative electrode, promptly plating on it after the reduction to negative electrode.And should electricity is to allow powder pigment evenly be attached to the surface with energising, but the surface can be as powder do not struck off by sharp object and just drop, and can provide anti-corrosion, a kind of processing of pigmentable on ground 10 again.
Claims (5)
1. the surperficial coating structure of an electronic device housing, it is characterized in that: this electronic device housing is a ground, this surface of bottom material system is provided with a coating layer, is provided with a decorative zones in this coating layer, and is covered on this ground, coating layer and this decorative zones with a confining bed.
2. the surperficial coating structure of electronic device housing according to claim 1 is characterized in that: wherein these coating series of strata can be further with anode treatment mode or electricity mode form.
3. the surperficial coating structure of electronic device housing according to claim 1, it is characterized in that: wherein this decorative zones can be that etch processes, laser engraving processing, drilling processing, blasting treatment, vapor deposition treatment, sputter are handled or hair is handled wherein a kind of, and drapes over one's shoulders and be located at this coating layer surface.
4. the surperficial coating structure of electronic device housing according to claim 1 is characterized in that: wherein this confining bed can further processing with electricity or anode treatment forms.
5. the surperficial coating structure of electronic device housing according to claim 1 is characterized in that: wherein this ground can be wherein a kind of of metal materials such as steel, iron, stainless steel, red metal, brass, titanium alloy, carbon fiber, tinplate or conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200942784U CN201611982U (en) | 2009-08-28 | 2009-08-28 | Surface cladding structure of electronic device shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200942784U CN201611982U (en) | 2009-08-28 | 2009-08-28 | Surface cladding structure of electronic device shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201611982U true CN201611982U (en) | 2010-10-20 |
Family
ID=42962618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200942784U Expired - Fee Related CN201611982U (en) | 2009-08-28 | 2009-08-28 | Surface cladding structure of electronic device shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201611982U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102145631A (en) * | 2010-10-22 | 2011-08-10 | 镭射印证有限公司 | Titanium-plated stainless steel metal photograph and manufacturing method thereof |
| CN105306635A (en) * | 2015-10-27 | 2016-02-03 | 重庆开确科技有限公司 | Mobile phone metal shell |
| CN105357343A (en) * | 2015-10-27 | 2016-02-24 | 重庆开确科技有限公司 | Mobile phone metal shell |
| CN105543928A (en) * | 2016-01-26 | 2016-05-04 | 广东欧珀移动通信有限公司 | Metal or alloy shell and manufacturing method thereof |
| CN106976350A (en) * | 2016-01-19 | 2017-07-25 | 瑞宏精密电子（太仓）有限公司 | Imprint sheet material and its method for stamping |
| CN109514174A (en) * | 2011-09-30 | 2019-03-26 | 苹果公司 | Laser-graining and anodized surface processing |
| WO2022197306A1 (en) * | 2021-03-19 | 2022-09-22 | Hewlett-Packard Development Company, L.P. | Covers for electronic devices |
-
2009
- 2009-08-28 CN CN2009200942784U patent/CN201611982U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102145631A (en) * | 2010-10-22 | 2011-08-10 | 镭射印证有限公司 | Titanium-plated stainless steel metal photograph and manufacturing method thereof |
| CN109514174A (en) * | 2011-09-30 | 2019-03-26 | 苹果公司 | Laser-graining and anodized surface processing |
| CN105306635A (en) * | 2015-10-27 | 2016-02-03 | 重庆开确科技有限公司 | Mobile phone metal shell |
| CN105357343A (en) * | 2015-10-27 | 2016-02-24 | 重庆开确科技有限公司 | Mobile phone metal shell |
| CN105357343B (en) * | 2015-10-27 | 2018-11-02 | 重庆开确科技有限公司 | A kind of mobile phone metal shell |
| CN105306635B (en) * | 2015-10-27 | 2019-01-01 | 重庆开确科技有限公司 | A kind of mobile phone metal shell |
| CN106976350A (en) * | 2016-01-19 | 2017-07-25 | 瑞宏精密电子（太仓）有限公司 | Imprint sheet material and its method for stamping |
| CN105543928A (en) * | 2016-01-26 | 2016-05-04 | 广东欧珀移动通信有限公司 | Metal or alloy shell and manufacturing method thereof |
| CN105543928B (en) * | 2016-01-26 | 2018-01-16 | 广东欧珀移动通信有限公司 | Metal or alloy housing and preparation method thereof |
| WO2022197306A1 (en) * | 2021-03-19 | 2022-09-22 | Hewlett-Packard Development Company, L.P. | Covers for electronic devices |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101020 Termination date: 20170828 |