CN201608185U

CN201608185U - Integrated module provided with lower collecting electrode, lower soleplate and control circuit, and solar battery plate

Info

Publication number: CN201608185U
Application number: CN 201020119597
Authority: CN
Inventors: 王祖宝
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-02-26
Filing date: 2010-02-26
Publication date: 2010-10-13
Anticipated expiration: 2020-02-26

Abstract

The utility model relates to an integrated module provided with a lower collecting electrode, a lower soleplate and a control circuit and applied to a solar battery plate. The integrated module is a circuit board which comprises the lower collecting electrode, the lower soleplate and the control circuit kept close in turn, wherein, the lower collecting electrode is a first conducting surface, the lower soleplate is a rigid parent metal, the control circuit unit is a second conducting surface; the structure is better that the first conducting surface is a first metal surface, the second conducting surface is a second metal surface, the rigid parent metal is provided with a conducting hole, the first conducting surface is connected with the second conducting surface through the conducting hole or the first conducting surface is electrically connected with the second conducting surface through a wire. The utility model also relates to a solar battery plate provided with the integrated module. The utility model has the advantages of skillful concept, unique design, simple and novel structure; the utility model is qualified for large-scale promotion and application because the percent of pass of the solar battery plates is improved, the production procedure is simplified, the production efficiency is improved and the production cost is reduced.

Description

The integration module and the solar panel of following collecting electrodes, lower shoe and control circuit

Technical field

The utility model relates to the solar panel technology field, be particularly related to the integration module technical field of solar panel, specifically be meant a kind of integration module and relevant solar panel that is applied to following collecting electrodes, lower shoe and the control circuit unit of solar panel.

Background technology

At present, as shown in Figure 1, the structure of solar panel mainly is to encapsulate manufacturing by upper cover plate (film) 1, last collecting electrodes 2, solar silicon wafers (film) 3, following collecting electrodes 4 and lower shoe 5, and control circuit unit is independent module.Upper cover plate (film) 1 main materials such as toughened glass, polyacrylic acid resinoid, PEP, transparent polyester, poly-carbon ester, lower shoe 5 main toughened glass, aluminium alloy, polymethyl methacrylate, the TPF composite membranes etc. of using of using.Wherein be upper cover plate (film) 1 with toughened glass, the TPF composite membrane is that lower shoe 5 is the most common.The toughened glass of upper cover plate (film) 1 plays printing opacity and supporting role simultaneously, and lower shoe 5 mainly plays a supportive role.

The trend of development is that upper cover plate (film) 1 uses high transparent membrane to come instead of glass now, and to increase light transmission, weight reduction reduces cost.Yet upper cover plate (film) 1 uses high transparent membrane to come instead of glass can cause upper cover plate (film) 1 not have supporting role, and the TPF composite membrane of passive lower shoe 5 can't be stood the solar panel high temperature in when encapsulation, bent plate is out of shape even damage thereby cause solar silicon wafers (film) 3 to bend easily.For following collecting electrodes 4, industry uses electric conducting materials such as special-purpose metal material or serous coat and solar silicon wafers (film) 3 to combine closely usually, forms collecting electrodes 4 down, needs the independent operation operation of process.And the existing control circuit unit that is used for solar panel is independent module.Therefore product percent of pass is low, manufacturing process is complicated, production efficiency is low, production cost is high.

Therefore, expectation provides a kind of integration module of following collecting electrodes, lower shoe and control circuit unit of solar panel, to improve product percent of pass, simplifies manufacturing process, enhances productivity, and reduces production costs.

The utility model content

The purpose of this utility model is to have overcome above-mentioned shortcoming of the prior art, a kind of integration module and relevant solar panel that is applied to following collecting electrodes, lower shoe and the control circuit unit of solar panel is provided, this integration module is skillfully constructed, design is unique, and novelty simple for structure has improved the product percent of pass of solar panel, simplified manufacturing process, improve production efficiency, reduced production cost, be suitable for large-scale promotion application.

To achieve these goals, in first aspect of the present utility model, a kind of following collecting electrodes that is applied to solar panel is provided, the integration module of lower shoe and control circuit unit, its main feature is, described collecting electrodes down, the integration module of lower shoe and control circuit unit is a wiring board, described wiring board comprises the following collecting electrodes that pastes successively, lower shoe and control circuit unit, described collecting electrodes down is first conducting surface, described lower shoe is a rigid substrate, described control circuit unit is second conducting surface, and described first conducting surface is electrically connected described second conducting surface.

Preferably, described first conducting surface is first metal covering, and described second conducting surface is second metal covering.

More preferably, described first metal covering is first copper face, and described second metal covering is second copper face.

Preferably, described rigid substrate is provided with via, and described first conducting surface is electrically connected described second conducting surface by described via.

Preferably, described first conducting surface is electrically connected described second conducting surface by lead.

In second aspect of the present utility model, a kind of solar panel is provided, comprise the upper cover plate that pastes successively, last collecting electrodes and solar silicon wafers, its main feature is, described solar panel also comprises above-mentioned integration module, and described solar silicon wafers pastes on first conducting surface of the described integration module of collecting electrodes, lower shoe and control circuit unit down.

The beneficial effects of the utility model are: the utility model utilize wiring board can resistant to elevated temperatures rigid substrate as lower shoe, first conducting surface that utilizes wiring board is as following collecting electrodes, utilize second conducting surface of wiring board to make control circuit unit, make the lower shoe of solar panel by wiring board, following collecting electrodes and control circuit unit assemble a modular assembly, be skillfully constructed, design is unique, novelty simple for structure, improved the product percent of pass of solar panel, simplified manufacturing process, improve production efficiency, reduced production cost, be suitable for large-scale promotion application.

Description of drawings

Fig. 1 is the structural representation of existing conventional solar cells plate.

Fig. 2 is the structural representation of a specific embodiment of solar panel of the present utility model.

Embodiment

In order more to be expressly understood technology contents of the present utility model, describe in detail especially exemplified by following examples.

See also shown in Figure 2, solar panel of the present utility model comprises the upper cover plate (film) 11 that pastes successively, last collecting electrodes 12, solar silicon wafers (film) 13 and integrated time collecting electrodes, the integration module of lower shoe and control circuit unit (being wiring board 17), described wiring board 17 comprises first conducting surface 14 that pastes successively, the rigid substrate 15 and second conducting surface 16, described first conducting surface 14 is electrically connected described second conducting surface 16, described first conducting surface 14 is as described collecting electrodes down, described rigid substrate 15 is as described lower shoe, and described second conducting surface 16 is as described control circuit unit.Described solar silicon wafers (film) 13 pastes on described first conducting surface 14.

Preferably, described first conducting surface 14 is first metal covering, and described second conducting surface 16 is second metal covering.In specific embodiment of the utility model, described first metal covering is first copper face, and described second metal covering is second copper face.First copper face and second copper face are Copper Foil.

In specific embodiment of the utility model, described rigid substrate 15 is provided with the via (not shown), and described first conducting surface 14 is electrically connected described second conducting surface 16 by described via.Described first conducting surface 14 also can be electrically connected described second conducting surface 16 by lead.

When solar panel of the present utility model is made, with first copper face of rigidity copper-clad plate (i.e. processing before wiring board 17) size and dimension according to solar silicon wafers (film) 13, reserve the contact conductor figure, etch away unnecessary Copper Foil according to circuit board technique, form collecting electrodes and lead-in wire circuit down.Second copper face etches away unnecessary Copper Foil according to the control circuit figure according to circuit board technique, forms control circuit.The copper face on two sides (i.e. first copper face and second copper face) is holed according to being connected needs with circuit, by electroplate forming via, satisfies the demand (can with the while operation of wiring board welding resistance technology) of sealed package afterwards with the printing ink plug-hole.It is gold-plated to use chemical nickel and gold technology or electrogilding technology to carry out then, perhaps uses hot air leveling technology to cover and goes up tin, is used to prevent the copper face oxidation.For solar silicon wafers (film) 13, use conductive silver paste, tin cream, carbon film, conducting resinl etc. that solar silicon wafers (film) 13 and first copper face of wiring board 17 are combined closely, solve the conduction of current problem.Also can on first copper face of wiring board 17, directly form battery membranes by direct spraying plating N/NP/P layer.The contact conductor of reserving can directly carry out electric current output, and the circuit that also can connect second copper face by the via on the wiring board 17 carries out electric current output, reduces the needed lead material of common collecting electrodes.The control circuit of second copper face can weld various electronic components with design as required, forms control circuit, no longer needs independently control circuit unit.Paste collecting electrodes 12 and upper cover plate (film) 11 on the solar silicon wafers (film) 13 successively.

In order to reduce the operation of solar panel, reduce cost, and the problem of the high temperature when solving the TPF composite membrane and can't stand the solar panel encapsulation, the utility model is introduced solar battery process with wiring board 17, with the rigid substrate 15 of wiring board 17 as lower shoe, with first copper face on the wiring board 17 as following collecting electrodes, and utilize second copper face of wiring board 17 to make control circuit, form a modular assembly of solar panel, thereby solved the problem of TPF composite membrane non-refractory, reduce the component count of solar panel, simplified technological process, reduced cost.

To sum up, the integration module of following collecting electrodes, lower shoe and the control circuit unit of solar panel of the present utility model is skillfully constructed, design is unique, novelty simple for structure, improve the product percent of pass of solar panel, simplified manufacturing process, improved production efficiency, reduce production cost, be suitable for large-scale promotion application.

In this specification, the utility model is described with reference to its certain embodiments.But, still can make various modifications and conversion obviously and not deviate from spirit and scope of the present utility model.Therefore, specification and accompanying drawing are regarded in an illustrative, rather than a restrictive.

Claims

1. integration module that is applied to following collecting electrodes, lower shoe and the control circuit unit of solar panel, it is characterized in that, the described integration module of collecting electrodes, lower shoe and control circuit unit down is a wiring board, described wiring board comprises following collecting electrodes, lower shoe and the control circuit unit that pastes successively, described collecting electrodes down is first conducting surface, described lower shoe is a rigid substrate, described control circuit unit is second conducting surface, and described first conducting surface is electrically connected described second conducting surface.

2. the integration module that is applied to following collecting electrodes, lower shoe and the control circuit unit of solar panel according to claim 1 is characterized in that described first conducting surface is first metal covering, and described second conducting surface is second metal covering.

3. the integration module that is applied to following collecting electrodes, lower shoe and the control circuit unit of solar panel according to claim 2 is characterized in that described first metal covering is first copper face, and described second metal covering is second copper face.

4. the integration module that is applied to following collecting electrodes, lower shoe and the control circuit unit of solar panel according to claim 1, it is characterized in that, described rigid substrate is provided with via, and described first conducting surface is electrically connected described second conducting surface by described via.

5. the integration module that is applied to following collecting electrodes, lower shoe and the control circuit unit of solar panel according to claim 1 is characterized in that described first conducting surface is electrically connected described second conducting surface by lead.

6. solar panel, comprise the upper cover plate that pastes successively, last collecting electrodes and solar silicon wafers, it is characterized in that, described solar panel comprises also that according to each described integration module in the claim 1,4,5 described solar silicon wafers pastes on first conducting surface of the described integration module of collecting electrodes, lower shoe and control circuit unit down.

7. solar panel according to claim 6 is characterized in that, described first conducting surface is first metal covering, and described second conducting surface is second metal covering.

8. solar panel according to claim 7 is characterized in that, described first metal covering is first copper face, and described second metal covering is second copper face.