CN201572728U - Matrix automatic adhesive dispenser and adhesive dispenser of semiconductor component - Google Patents
Matrix automatic adhesive dispenser and adhesive dispenser of semiconductor component Download PDFInfo
- Publication number
- CN201572728U CN201572728U CN2009202713012U CN200920271301U CN201572728U CN 201572728 U CN201572728 U CN 201572728U CN 2009202713012 U CN2009202713012 U CN 2009202713012U CN 200920271301 U CN200920271301 U CN 200920271301U CN 201572728 U CN201572728 U CN 201572728U
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- glue
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Abstract
The utility model relates to a matrix automatic adhesive dispenser which comprises a mobile device, a bearing platform, a syringe fixing device, and a plurality of rows of syringes, wherein, the bearing platform is used for bearing an adhesive dispensing support; the syringe fixing device capable of moving relative to the bearing platform is coupled with the mobile device; and each row of syringes comprises a plurality of syringes used for being aligned with the corresponding adhesive cup on the adhesive dispensing support, so as to improve the efficiency of the adhesive dispensing process. The utility model further relates to an adhesive dispenser of a semiconductor component.
Description
Technical field
The utility model relates to a kind of point gum machine, particularly relevant for a kind of point gum machine with many row's syringes.
Background technology
Light-emitting semi-conductor components has low power consumption, lower calorific value, operation lifetime length, impact resistance, volume is little, reaction speed is fast, no mercury and the good light electrical characteristics such as coloured light that can send wavelength stabilization, progress along with photoelectricity science and technology, light-emitting semi-conductor components has been regarded as one of preferable selection of new light source from generation to generation promoting the existing significant progress in aspects such as luminous efficiency, service life and brightness.
Point glue processing procedure is applied in the procedure for producing of light-emitting semi-conductor components widely.Traditional automatically dropping glue machine is though constantly promote on precision and speed.Yet because light-emitting semi-conductor components application more and more widely in daily life, the output of light-emitting semi-conductor components is also increasing, and traditional automatically dropping glue machine still can't satisfy mass-produced demand.
Therefore the point gum machine of multiple-pin type also arises at the historic moment, yet, though being arranged in a plurality of syringes of a straight line, multiple-pin type point gum machine utilization at present carries out a glue.But because the consumption of light-emitting semi-conductor components is increasing, such multiple-pin type point gum machine has still formed the bottleneck that light-emitting semi-conductor components is produced.How can improve traditional point gum machine effectively and make it can more effectively carry out the volume production of light-emitting semi-conductor components, and then reduce production costs, be the user and the ardent hope of producer of light-emitting semi-conductor components.
Summary of the invention
In above-mentioned novel background, because the demand and the output of light-emitting semi-conductor components are all increasing, the efficient deficiency of automatically dropping glue machine has still formed the bottleneck that light-emitting semi-conductor components is produced.
Therefore, a purpose of the present utility model is at the point gum machine that a kind of matrix form automatically dropping glue machine and semiconductor subassembly are provided, and promoting the efficient that light-emitting semi-conductor components is produced effectively, and then reduces the light-emitting semi-conductor components production cost.
An embodiment of the present utility model provide a kind of matrix form automatically dropping glue machine include a mobile device, a carrying platform in order to carry some glue supports, a syringe fixture is coupled in mobile device, to move and to arrange more syringe with respect to carrying platform.
Many row's syringes are installed on the syringe fixture, and each row's syringe comprises a plurality of syringes, and each syringe comprises a syringe needle, in order to the glue cup of the correspondence on the alignment point glue support.Syringe be in order to storing liquid glue material in wherein, and include a plurality of glue cups on the some glue support.
Above-mentioned some glue support can be a light-emitting diode component point glue support, and the longitudinal pitch of arranging syringe is equivalent to longitudinal pitch or many times of longitudinal pitches of glue cup more.The horizontal spacing of syringe then is equivalent to horizontal spacing or many times of horizontal spacings of glue cup.
Another kind of embodiment of the present utility model provides a kind of point gum machine of semiconductor subassembly, comprises: a mobile device; And arrange syringe more, and these many row's syringes are installed on this mobile device, and wherein each row's syringe comprises a plurality of syringes, and each syringe is aimed at the glue cup of the correspondence on some glue supports.
Therefore, the disclosed matrix form automatically dropping glue of the utility model machine can improve the efficient of the some glue of light-emitting diode component effectively, and then reduces the production cost of light-emitting diode component, and can further popularize the use of light emitting diode.
Description of drawings
For above-mentioned and other purpose of the present utility model, feature, advantage and embodiment can be become apparent, being described in detail as follows of appended accompanying drawing:
Fig. 1 is the schematic diagram of matrix form automatically dropping glue machine one embodiment of the present utility model; And
The schematic diagram of Fig. 2 employed some glue support during for light-emitting semi-conductor components point glue.
[primary clustering symbol description]
100: matrix form automatically dropping glue machine 130: mobile device
110: the first row's syringes 140: syringe fixture
112: the first row's syringe needles 150: carrying platform
120: the second row's syringes 200: some glue support
122: the second row's syringe needles 210: glue cup
The specific embodiment
The utility model is to disclose a kind of matrix form automatically dropping glue machine, by the design of many rows spininess tube, can improve the efficient of light-emitting semi-conductor components point glue processing procedure effectively, and then reduces the production cost of light-emitting semi-conductor components.Below will clearly demonstrate spirit of the present utility model with accompanying drawing and detailed description, as the person skilled in the art after understanding preferred embodiment of the present utility model, when can be by the technology of the utility model institute teaching, change and modification, it does not break away from spirit of the present utility model and scope.
Consult Fig. 1, it is the schematic diagram that illustrates matrix form automatically dropping glue machine one embodiment of the present utility model.As shown in the figure, matrix form automatically dropping glue machine 100 includes one first row's syringe 110, syringe numbering 1-6 among the figure, and with one second row's syringe 120, syringe numbering 7-12 among the figure.Two row's syringes difference configured in parallel are in syringe fixture 140, and each row's syringe has a plurality of syringes.Therefore, when using matrix form automatically dropping glue machine 100 of the present utility model to carry out the some glue processing procedure of light-emitting semi-conductor components, because it has at least two rows' syringe, so can utilize first row's syringe needle 112 of its below and second row's syringe needle 122 to carry out a glue simultaneously.It should be noted that matrix form automatically dropping glue machine 100 of the present utility model is not limited to the structure of two row's syringes and every row 6 pins, under suitable design, many rows (more than two rows) and spininess tube (more than two syringes) all do not break away from spirit of the present invention and scope.
Consult Fig. 2 simultaneously, it is the schematic diagram of employed some glue support when illustrating light-emitting semi-conductor components point glue.Because matrix form automatically dropping glue machine 100 of the present utility model has many rows' syringe, and each row has a plurality of syringes.Therefore, when utilizing matrix form automatically dropping glue machine 100 of the present utility model to carry out the some glue processing procedure of light-emitting semi-conductor components.Some glue support 200 as among Fig. 2 has 8*18 glue cup 210 on it.In the foregoing description according to matrix form automatically dropping glue machine 100 of the present utility model, first row's syringe 110 and second row's syringe 120 can have 6 syringes respectively, also can carry out the some glue of 12 glue cups 210 simultaneously.That is mobile each time syringe and the relative position of putting glue support 200, single syringe that can be more known promotes one times some glue efficient.Certainly, if having three rows or four rows' barrel design, can also relatively improve a glue efficient three or four times.In addition, syringe is to be used for storing liquid glue material carrying out the some glue of light-emitting diode component, and liquid glue material then can be selected from the group that elargol, insulating cement, conducting resinl, silica gel, transparent adhesive tape, UV glue and epoxy resin are constituted.Syringe needle then can be selected from the group that plastic spike, metal needle and Teflon syringe needle are constituted.
Wherein, the longitudinal pitch of first row's syringe 110 and second row's syringe 120 is to be designed to be equivalent to the longitudinal pitch of two of glue cup 210 between arranging, or many times of the longitudinal pitch of glue cup 210, the situation of visual reality is arranged, in the time of only need working as the glue cup 210 of first row's syringe, 110 its belows of aligning, second row's syringe 120 also can be aimed at the glue cup 210 of its below.In addition, the syringe horizontal spacing of each row's syringe then be equivalent to a horizontal spacing of glue support 200 gluing cups 210, or its multiple does not also break away from spirit of the present utility model and scope.
Above-mentioned syringe is fixed in syringe fixture 140, utilize the mobile device 130 that is connected with syringe fixture 140 to move then, its can be used for the carrying platform 150 of bearing point glue support 200, carry out relative motion, make the syringe needle of the syringe front end on the syringe fixture 140 can aim at the glue cup 210 on the some glue support 200 of below and then finish the some glue operation of light-emitting semi-conductor components, and hoist point glue efficiency of operation effectively.
Understand as the person skilled in the art, the above is embodiment of the present utility model, and all other do not break away from the equivalence of being finished under the spirit that the utility model discloses and change or modify, and all should be included in the protection domain of claims.
Claims (10)
1. a matrix form automatically dropping glue machine is characterized in that, comprises at least:
One mobile device;
One carrying platform in order to carry some glue supports, includes a plurality of glue cups on this glue support;
One syringe fixture is coupled in this mobile device, to move with respect to this carrying platform; And
Many row's syringes, in wherein, these many row's syringes are installed on this syringe fixture in order to storing liquid glue material, and wherein each row's syringe comprises a plurality of syringes, and each syringe comprises a syringe needle, in order to aim at the glue cup of the correspondence on this glue support.
2. matrix form automatically dropping glue machine according to claim 1 is characterized in that, this glue support is a light-emitting diode component point glue support.
3. matrix form automatically dropping glue machine according to claim 1 is characterized in that, the longitudinal pitch of these many row's syringes is equivalent to the longitudinal pitch of those glue cups.
4. matrix form automatically dropping glue machine according to claim 1 is characterized in that, the longitudinal pitch of these many row's syringes is equivalent to many times of longitudinal pitches of those glue cups.
5. matrix form automatically dropping glue machine according to claim 1 is characterized in that the horizontal spacing of those syringes is equivalent to the horizontal spacing of those glue cups.
6. matrix form automatically dropping glue machine according to claim 1 is characterized in that the horizontal spacing of those syringes is equivalent to many times of horizontal spacings of those glue cups.
7. matrix form automatically dropping glue machine according to claim 1 is characterized in that, these many row's syringes comprise one first row's syringe and one second row's syringe.
8. matrix form automatically dropping glue machine according to claim 7 is characterized in that, this first row syringe comprises a plurality of syringes, and this second row syringe also comprises a plurality of syringes.
9. matrix form automatically dropping glue machine according to claim 1 is characterized in that, this liquid state glue material is selected from the group that elargol, insulating cement, conducting resinl, silica gel, transparent adhesive tape, UV glue and epoxy resin are constituted.
10. the point gum machine of a semiconductor subassembly is characterized in that, comprises:
One mobile device; And
Many row's syringes, these many row's syringes are installed on this mobile device, and wherein each row's syringe comprises a plurality of syringes, and each syringe is aimed at the glue cup of the correspondence on some glue supports.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202713012U CN201572728U (en) | 2009-11-16 | 2009-11-16 | Matrix automatic adhesive dispenser and adhesive dispenser of semiconductor component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202713012U CN201572728U (en) | 2009-11-16 | 2009-11-16 | Matrix automatic adhesive dispenser and adhesive dispenser of semiconductor component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201572728U true CN201572728U (en) | 2010-09-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202713012U Expired - Fee Related CN201572728U (en) | 2009-11-16 | 2009-11-16 | Matrix automatic adhesive dispenser and adhesive dispenser of semiconductor component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201572728U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157773A (en) * | 2014-08-21 | 2014-11-19 | 木林森股份有限公司 | LED glue injection mold |
| CN105772332A (en) * | 2016-05-06 | 2016-07-20 | 深圳市朝阳光科技有限公司 | Universal dispensing head structure |
| CN106029240A (en) * | 2014-02-18 | 2016-10-12 | 3M创新有限公司 | Method and apparatus for forming articles with non-uniform coatings |
| CN107597505A (en) * | 2017-10-30 | 2018-01-19 | 安徽世林照明股份有限公司 | A kind of LED elargol spot gluing equipment and dispensing method |
-
2009
- 2009-11-16 CN CN2009202713012U patent/CN201572728U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106029240A (en) * | 2014-02-18 | 2016-10-12 | 3M创新有限公司 | Method and apparatus for forming articles with non-uniform coatings |
| CN104157773A (en) * | 2014-08-21 | 2014-11-19 | 木林森股份有限公司 | LED glue injection mold |
| CN104157773B (en) * | 2014-08-21 | 2016-11-16 | 木林森股份有限公司 | A kind of LED injecting glue mould |
| CN105772332A (en) * | 2016-05-06 | 2016-07-20 | 深圳市朝阳光科技有限公司 | Universal dispensing head structure |
| CN107597505A (en) * | 2017-10-30 | 2018-01-19 | 安徽世林照明股份有限公司 | A kind of LED elargol spot gluing equipment and dispensing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHANJING TECHNOLOGY (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: ADVANCED DEVELOPMENT PHOTOELECTRIC CO., LTD. Effective date: 20101117 Owner name: RONGCHUANG ENERGY TECHNOLOGY CO., LTD. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: NO. 13, GONGYE ROAD 5, HSINCHU INDUSTRY ZONE, HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN PROVINCE, CHINA TO: 518000 NO. 2, E. RING ROAD 2, INDUSTRY ZONE 10, YOUSONG, LONGHUA SUBDISTRICT OFFICE, BAO'AN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20101117 Address after: 518000, Shenzhen, Guangdong, Baoan District province Longhua Street tenth Pine Industrial Zone, No. two, East Ring Road, No. 2 Co-patentee after: Advanced Optoelectronic Technology Inc. Patentee after: Zhanjing Technology (Shenzhen) Co., Ltd. Address before: Hsinchu County, Taiwan, China Hukou Hsinchu Industrial Zone, No. five, industrial road, No. 13 Patentee before: Advanced Development Photoelectric Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100908 Termination date: 20151116 |
|
| EXPY | Termination of patent right or utility model |