CN201563286U - Layout structure of circuit board - Google Patents
Layout structure of circuit board Download PDFInfo
- Publication number
- CN201563286U CN201563286U CN2009202382772U CN200920238277U CN201563286U CN 201563286 U CN201563286 U CN 201563286U CN 2009202382772 U CN2009202382772 U CN 2009202382772U CN 200920238277 U CN200920238277 U CN 200920238277U CN 201563286 U CN201563286 U CN 201563286U
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- CN
- China
- Prior art keywords
- circuit board
- substrate
- residual copper
- plate
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a layout structure of a circuit board, which comprises a substrate, wherein a plurality of circuit board units are arranged on the substrate; each circuit board unit comprises a male side and a female side of the circuit board; and the circuit board units in female/male alternative arrangement are arranged on the same surface of the substrate. Accordingly, the difference in the residual copper rates between two adjacent circuit board units is higher than 20%. The utility model aims to overcome the disadvantages in the prior art and provides a layout structure of a circuit board, which is capable of effectively preventing the circuit board from tilting and warping.
Description
Technical field
The utility model relates to a kind of composing structure of circuit board.
Background technology
In the technology of producing multilayer circuit board, because designing requirement, the residual copper rate of each layer circuit is all different, and such as producing double-layer circuit board, the circuit on general upper strata and its residual copper rate of circuit of lower floor are different; In producing the process of setting type, existing composing often is distributed on the one side of same residual copper rate on the same one side of substrate, and as Fig. 2, plate sunny side A is arranged on the same one side of substrate 1; Fig. 3, plate back B is arranged on the another side of substrate 1; This design can cause the residual copper rate of the levels of the big plate of monoblock different, is easy to cause problems such as plate sticks up, plate is curved in the process of processing.
The utility model content
The purpose of this utility model is in order to overcome weak point of the prior art, to provide a kind of simple in structure, can effectively preventing the circuit board composing structure of problems such as the plate of circuit board sticks up, plate is curved.
In order to achieve the above object, the utility model adopts following scheme:
A kind of composing structure of circuit board comprises a substrate, is provided with a plurality of circuit board units on described substrate, and described each circuit board unit comprises the plate sunny side and the plate back, and circuit board unit becomes yin, yang alternately to arrange on same of substrate.
The composing structure of aforesaid a kind of circuit board is characterized in that the residual copper rate between described adjacent two circuit board units differs more than 20%.
In sum, the beneficial effects of the utility model:
Be provided with a plurality of circuit board units in the utility model on substrate, each circuit board unit is different with the residual copper rate of its circuit board unit on every side.Residual copper rate between the general adjacent circuit board unit differs more than 20%, adopt into the mode that yin, yang is alternately arranged in the process of setting type, the different circuit board unit of residual copper rate reasonably is set together, make the upper and lower two-layer residual copper rate uniformity of monoblock circuit, efficiently solve problems such as the plate that causes owing to the residual copper rate of levels difference in the production process sticks up, plate is curved.What also help conducting electricity in the electroplating process simultaneously is even.
Description of drawings
Fig. 1 is a schematic diagram of the present utility model;
Fig. 2 is one of schematic diagram of prior art;
Fig. 3 be prior art schematic diagram two;
Fig. 4 is a side schematic view of the present utility model.
Embodiment
Below in conjunction with embodiment the utility model is described further:
The composing structure of a kind of circuit board as shown in Figure 1 and Figure 4, comprise a substrate 1, be provided with a plurality of circuit board units 2 on described substrate 1, described each circuit board unit 2 comprises plate sunny side A and plate back B, and 2 one-tenth yin, yangs of circuit board unit are alternately arranged on 1 same of substrate.Residual copper rate between general described adjacent two circuit board units 2 differs more than 20%.In same layer circuit board is arranged such as Fig. 1 in the residual copper rate of circuit board unit A be 80%, its adjacent each circuit board unit is respectively B, the residual copper rate that circuit board unit is respectively B is 20%.
Arranging so reasonably is set together the different circuit board unit of residual copper rate, makes the upper and lower two-layer residual copper rate uniformity of monoblock circuit, efficiently solves problems such as the plate that causes owing to the residual copper rate of levels difference in the production process sticks up, plate is curved.What also help conducting electricity in the electroplating process simultaneously is even.
Claims (2)
1. the composing structure of a circuit board, it is characterized in that comprising a substrate (1), on described substrate (1), be provided with a plurality of circuit board units (2), described each circuit board unit (2) comprises the plate sunny side (A) and the plate back (B), goes up circuit board unit (2) same of substrate (1) and becomes yin, yang alternately to arrange.
2. the composing structure of a kind of circuit board according to claim 1 is characterized in that the residual copper rate between described adjacent two circuit board units (2) differs more than 20%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009202382772U CN201563286U (en) | 2009-11-02 | 2009-11-02 | Layout structure of circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009202382772U CN201563286U (en) | 2009-11-02 | 2009-11-02 | Layout structure of circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201563286U true CN201563286U (en) | 2010-08-25 |
Family
ID=42628436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009202382772U Expired - Fee Related CN201563286U (en) | 2009-11-02 | 2009-11-02 | Layout structure of circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201563286U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106231785A (en) * | 2016-08-18 | 2016-12-14 | 深圳崇达多层线路板有限公司 | Printed circuit board (PCB) pressing structure and multilayer board |
CN116133233A (en) * | 2023-01-29 | 2023-05-16 | 江阴旺达商务贴有限公司 | Printed circuit typesetting uniformity degree analysis system |
-
2009
- 2009-11-02 CN CN2009202382772U patent/CN201563286U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106231785A (en) * | 2016-08-18 | 2016-12-14 | 深圳崇达多层线路板有限公司 | Printed circuit board (PCB) pressing structure and multilayer board |
CN116133233A (en) * | 2023-01-29 | 2023-05-16 | 江阴旺达商务贴有限公司 | Printed circuit typesetting uniformity degree analysis system |
CN116133233B (en) * | 2023-01-29 | 2023-08-11 | 江阴旺达商务贴有限公司 | Printed circuit typesetting uniformity degree analysis system |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100825 Termination date: 20151102 |
|
EXPY | Termination of patent right or utility model |