CN201539840U - Radiating module and backlight module by adopting radiating module - Google Patents
Radiating module and backlight module by adopting radiating module Download PDFInfo
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- CN201539840U CN201539840U CN200920137281XU CN200920137281U CN201539840U CN 201539840 U CN201539840 U CN 201539840U CN 200920137281X U CN200920137281X U CN 200920137281XU CN 200920137281 U CN200920137281 U CN 200920137281U CN 201539840 U CN201539840 U CN 201539840U
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- shell fragment
- radiating
- module
- heat radiation
- heat
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Abstract
The utility model provides a radiating module. The radiating module comprises a radiating baseplate and further comprises at least one radiating spring plate; and a raised part is formed on the radiating spring plate. The utility model further provides a backlight module by adopting the radiating module; the backlight module comprises a circuit board, at least one heat production device and a radiating module, wherein, the circuit board is provided with at least one through hole; the heat production device is arranged at the upper part of the circuit board in a position corresponding to the through hole; and the raised part of the radiating module is in contact with the bottom of the heat production device through the through hole. The utility model has the advantage that the radiating module is in direct contact with heat production devices such as a light emitting diode and the like, so as to reduce the impact of low-heat conducting non-metallic media on the integral radiating effect.
Description
[technical field]
The utility model is the parts about a kind of LCD, particularly a kind of LED (LCD) radiating module and use the module backlight of this radiating module.
[background technology]
Along with science and technology is maked rapid progress, various intelligent information products have been full of in modern's life, and LCD has also been played the part of considerable role in information products.Because LCD has that external form is frivolous, power consumption is few and characteristic such as radiationless pollution, therefore be widely used on the various portable type information products such as mobile computer (notebook), PDA(Personal Digital Assistant) and mobile phone, and replace conventional cathode ray tube (Cathode-RayTube gradually, CRT) display, and become the main flow of thin plane display.
General LCD comprises a module backlight and a display panels, and module wherein backlight is used to provide display panels needed light source when display frame.Conventional liquid crystal is used cold cathode fluorescent lamp pipe (cold cathode fluorescent lamp, CCFL) or outer electrode fluorescent lamp (ExternalElectrode Fluorescent Lamp, EEFL) as the light source in the module backlight, but with the fluorescent lamp improvement that the LCD of light source has limited the color specification, had a strong impact on the color representation of LCD because of the colour temperature about its 4800K, and only can reach (the NationalTelevision System Committee of National Television System Committee, 70～80% of the colourcast standard institute standard colour gamut performance of NTSC) formulating, so can't satisfy the requirement of user gradually, and fluorescent lamp also has shortcomings such as the green product of not meeting requirement and size be bigger for display frame.Therefore at present industry just research and develop have high sophistication, high briliancy, no mercury, low-voltage, high color reprodubility, high color saturation, reaction speed soon and light emitting diode (the light emitting diode of advantage such as volume is little, LED) replace fluorescent lamp, in being applied to, in the undersized backlight liquid crystal display module.
Yet, use LED to still have its shortcoming that need improve as the light source of module backlight, one be can not ignore the heat dissipation problem that part promptly is module backlight.Because LED is installed in the module backlight that is similar to enclosure space, therefore along with the operation of LCD time increases, the internal temperature of module backlight also can have influence on the service life of LED and the monolithic stability degree of LCD because of heat that LED produces rises gradually.The processing method of industry is to set up heat abstractor near the LED placement of module backlight at present, to reduce the high temperature that LED was produced.
Please refer to Fig. 1, Figure 1 shows that United States Patent (USP) the 6th, 966, No. 674 disclosed heat abstractors.As shown in Figure 1, light emitting diode 20 is located on the interior circuit board 10 of backlight liquid crystal display module, circuit board 10 has a through hole 12, one hot conductive post 300 is arranged in the through hole 12, and see through a heat carrier 500 and be connected in light emitting diode 20 belows, and hot conductive post 300 belows are provided with a fin 400 in addition.Yet the heat abstractor of this kind setting but has cost and improves and shortcoming such as assembling inconvenience, because need one by one in each through hole of circuit board coating or paste heat carrier, the complicated and operation of program is difficult for.In addition, the heat carrier of the present general usefulness of industry, for example its disclosed heat conductive pad (thermal conductive pad) or thermal grease (thermal conductive paste), the heat conduction number is how only between 1～10 watt/Mi Du (W/m ℃), have to have up to 385 heat conduction number with fine aluminium and compare greater than 220 heat conduction number or fine copper, mutually far short of what is expected.In other words, this use heat carrier increases the radiating mode that contact-making surface is fitted, and effect is limited.
Therefore how to design with low cost and have the module backlight and the radiating module of great heat radiation effect, still be an important topic of liquid crystal display industry.
[utility model content]
It is a kind of with low cost and have a heat radiation module of great heat radiation effect that one of technical problem to be solved in the utility model is to provide.
Two of technical problem to be solved in the utility model is to provide a kind of module backlight that uses above-mentioned heat radiation module.
The utility model is what one of to solve the problems of the technologies described above by the following technical programs: a kind of radiating module, comprise a heat-radiating substrate, also comprise at least one heat radiation shell fragment, described heat radiation shell fragment is the cantilever design that is fixed on the heat-radiating substrate, has a jut on the described heat radiation shell fragment.
The height of described jut is less than the twice of this heat radiation shell fragment thickness.
The part that the root of described heat radiation shell fragment connects heat-radiating substrate has an elastic construction.
Described elastic construction is an arc groove, and the degree of depth of described arc groove is less than half of this heat radiation shell fragment thickness.
Described heat-radiating substrate and described heat radiation shell fragment are metal.
Described heat-radiating substrate and described heat radiation shell fragment are one of the forming.
Described heat-radiating substrate has the holes of a mechanical stamping partly around around the described heat radiation shell fragment.
The utility model be solve the problems of the technologies described above by the following technical programs two: a kind of module backlight, described module backlight comprises:
One circuit board has at least one through hole; At least one heat production device is to should through hole and be arranged at this circuit board top; An and radiating module, described radiating module comprises a heat-radiating substrate, it is characterized in that: described radiating module also comprises at least one heat radiation shell fragment, described heat radiation shell fragment is the cantilever design that is fixed on the heat-radiating substrate, has a jut on the described heat radiation shell fragment, the height of jut is greater than the thickness of this circuit board, and this jut is contacted with the bottom of this heat production device in fact via this through hole, makes this heat radiation shell fragment elasticity be connected to the bottom of this heat production device.
Described heat production device is a light emitting diode.
The height of described jut is less than the twice of this heat radiation shell fragment thickness.
The part that the root of described heat radiation shell fragment connects heat-radiating substrate has an elastic construction.
Described elastic construction is an arc groove, and the degree of depth of described arc groove is less than half of this heat radiation shell fragment thickness.
Described heat-radiating substrate and described heat radiation shell fragment are metal.
Described heat-radiating substrate and described heat radiation shell fragment are metal.
Described heat-radiating substrate and described heat radiation shell fragment are one of the forming.
Described heat-radiating substrate has the holes of a mechanical stamping partly around around the described heat radiation shell fragment.
The utility model radiating module and use the advantage of the module backlight of this radiating module to be: the jut of radiating module utilization heat radiation shell fragment directly contacts with heat production device such as light emitting diode, and become a heat conduction, heat-radiating integrated framework, with low cost and have a great heat radiation effect, significantly reduce the thermal resistance that heat catalysis that any nonmetal grade in the diabatic process adds low heat conduction number is increased for radiating module itself, more effectively overcome that circuit board is heated buckling deformation and the not good state of heat-conducting effect that may cause.
[description of drawings]
The utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the schematic diagram of existing module radiating module backlight.
Fig. 2 is the schematic diagram of radiating module of the module backlight of the utility model preferred embodiment.
Fig. 3 and Fig. 4 are the heat radiation shell fragment schematic perspective view of the utility model preferred embodiment radiating module.
Fig. 5 is that Fig. 4 is along the profile shown in the tangent line V-V '.
Fig. 6 is for being applied to the utility model radiating module the profile of down straight aphototropism mode set.
[primary clustering symbol description]
10 circuit boards, 12 through holes
20 light emitting diodes, 300 hot conductive post
400 fin, 500 heat carriers
100 circuit boards, 120 through holes
200 light emitting diodes, 40 heat-radiating substrates
42 heat radiation shell fragments, 44 juts
46 arc grooves, 50 back of the body deckle boards
60 module 70 radiating modules backlight
[specific embodiment]
Radiating module in the utility model can be applicable to various down straight aphototropism mode set or side-light type module backlight, and can comprise heat production devices such as at least one light source, for example light emitting diode in these modules backlight.Please refer to Fig. 2, Fig. 2 is the schematic diagram of the module backlight of the utility model preferred embodiment.For convenience of description, only show organigram, but the utility model is not as limit with the module backlight of single light emitting diode and radiating module.
As shown in Figure 2, module 70 backlight comprises a circuit board 100, at least one light emitting diode 200, at least one through hole 120 and a radiating module 60.Through hole 120 is arranged in the circuit board 100, and radiating module 60 comprises a heat-radiating substrate 40 and at least one heat radiation shell fragment 42.Light emitting diode 200 is arranged at the position of circuit board 100 tops corresponding to through hole 120, and is electrically connected the circuit (not shown) in the circuit board 100.And heat-radiating substrate 40 in the radiating module 60 and heat radiation shell fragment 42 place the below of circuit board 100.Heat radiation shell fragment 42 of the present utility model has a jut 44, and jut 44 sees through the below, bottom that through hole 120 elasticity are connected to light emitting diode 200, guaranteeing light emitting diode 200 contact protrusion portion 44 in fact, and then the used heat that light emitting diode 200 is produced when luminous can see through jut 44 and conduct to heat-radiating substrate 40 via heat radiation shell fragment 42 effectively and disperse.In addition, heat-radiating substrate of the present utility model 40 bottom surfaces more can directly utilize the surface treatment of cutting, sandblast, etching, machining etc., or in conjunction with structural designs such as radiating fins, to produce bigger cooling surface area, help the used heat conduction.
See also Fig. 3 and shown in Figure 4, be the heat radiation shell fragment schematic perspective view of radiating module.In preferred embodiment of the present utility model, be arranged at the heat radiation shell fragment 42 on the heat-radiating substrate 40, be to utilize the processing of mechanical type such as punching press holes directly to destroy the cantilever design that heat-radiating substrate 40 is produced, the shell fragment 42 that also promptly dispels the heat is the part of heat-radiating substrate 40, heat radiation shell fragment 42 is formed in one with heat-radiating substrate 40, but be not limited thereto, heat radiation shell fragment 42 also can be embedded on the heat-radiating substrate 40 for the independent parts of making again.And as shown in Figure 3, the physical characteristic that heat radiation shell fragment 42 utilizes heat-radiating substrate 40 metal materials itself to possess ductility is bestowed stamping pressure, and further forms salient point on this cantilever design, becomes jut 44.In addition, in order to increase the elasticity of heat radiation shell fragment 42, as shown in Figure 4, can optionally increase by an elastic construction at the root of cantilever design of heat radiation shell fragment 42, for example arc groove 46.In addition, the cantilever design of heat radiation shell fragment 42 also can be other shape, for example the vertical bar shaped of non-icon such as spirality, semicircle structure.
Please refer to Fig. 5, Fig. 5 is that Fig. 4 is along the profile shown in the tangent line V-V '.The heat transfer heat radiation function of shell fragment 42 owing to will guarantee to dispel the heat, the height of the jut 44 of the utility model radiating module 60 is no more than the twice of heat radiation shell fragment 42 thickness, and the height of jut 44 need surpass the thickness of circuit board 100, make jut 44 can be connected to the bottom of light emitting diode 200 through through hole 120 elasticity, as shown in Figure 2, to guarantee light emitting diode 200 contact protrusion portion 44 in fact.In addition, as previously mentioned, at the alternative arc groove 46 that increases of the root of heat radiation shell fragment 42 cantilevers, to strengthen the elasticity of heat radiation shell fragment 42.Yet, because metal also has the character of plastic deformation except the character of strain, when the external force that therefore gives machining produced arc groove 46 and keeps the elasticity of metal itself again, these arc groove 46 degree of depth needed less than 1/2nd of shell fragment 42 thickness that dispel the heat.
It should be noted that, when heat-radiating substrate 40 is assembled with light emitting diode 200 and circuit board 100 with heat radiation shell fragment 42, modes such as heat-radiating substrate 40 can be locked admittedly by seeing through screw in addition, snib are fixed in the below of circuit board 100, can fit face-to-face to guarantee circuit board 100 and heat-radiating substrate 40.Therefore when jut 44 is connected to the bottom of light emitting diode 200 by through hole 120, because the height of jut 44 surpasses the thickness of circuit board 100, so can make heat radiation shell fragment 42 be subjected to the downward active force that conflict applied of light emitting diode 200 and produce an elastic strain.Also be, heat radiation shell fragment 42 is out of shape downwards because of the meeting that influences that is subjected to jut 44 and is oppressed by light emitting diode 200, and then by 42 design concepts of going up the employing interference engagement as elastic construction and design of heat radiation shell fragment, make heat radiation shell fragment 42 also can above light emitting diode 200 places, impose a reaction force in the distortion downwards by the elastic restoring force of self, and then the gap of the jut 44 of the shell fragment 42 of guaranteeing to dispel the heat and light emitting diode 200 bottom surfaces remains 0, and not influenced by the heat-radiating substrate 40 and the situation of circuit board 100.Therefore can solve in the existing module backlight that circuit board causes because of bad processing procedure or overheated generation buckling deformation or the like other factors and heat-radiating substrate between produce the space, cause the problem of effectively heat conduction, heat radiation.In addition, radiating module of the present utility model also is not limited to be positioned at the heat production device below of light emitting diode 200 light sources such as grade, for example also can be arranged at the heat production device below of other light source drive etc., and then the design that utilizes the utility model elastic reaction guarantees that these heat production devices directly contact with the heat radiation shell fragment 42 that possesses good heat conductivity, effectively conduct heat.
Fig. 6 is for being applied to the utility model radiating module the profile of down straight aphototropism mode set.As shown in Figure 6, module backlight has a plurality of light emitting diodes 200 as its light source.Light emitting diode 200 is electrically connected on the circuit board 100, heat-radiating substrate 40 is fixed in the below of circuit board 100, have a plurality of heat radiation shell fragments 42 and a plurality of corresponding jut 44 that punching press produces on it, and each jut 44 elasticity is connected to the below of each light emitting diode 200, can combine closely to guarantee the light emitting diode 200 and the jut 44 of heat radiation shell fragment 42.
Because the utility model radiating module is to utilize the heat radiation shell fragment directly and heat production device such as light source, light emitting diode for example, contact, be a heat conduction, heat-radiating integrated framework, so can effectively reduce the heat dissipation that the heat catalysis of any nonmetal low heat conduction number in the diabatic process reduces integral heat dissipation means.In addition, the rubber-like design of heat radiation shell fragment own can guarantee that the contact-making surface fit-state of heat production device and radiating module is good, also can overcome in the prior art after the circuit board temperature distortion warpage, light emitting diode and the heat abstractor contact-making surface is destroyed is separated from each other even, and the not good state of the heat-conducting effect that causes.The utility model can reduce existing radiating module need be coated with thermal grease one by one or paste heat carriers such as heat conductive pad in each through hole of circuit board complicated process again simultaneously, this integrated heat radiation architecture design significantly reduces the time cost of material and assembling radiating module, so the utility model has improved the predicament that present module heat radiation backlight generally runs into.
Though more than described the specific embodiment of the present utility model; but being familiar with those skilled in the art is to be understood that; our described specific embodiment is illustrative; rather than be used for qualification to scope of the present utility model; those of ordinary skill in the art are in the modification and the variation of the equivalence of doing according to spirit of the present utility model, all should be encompassed in the scope that claim of the present utility model protects.
Claims (16)
1. a radiating module comprises a heat-radiating substrate, it is characterized in that: also comprise at least one heat radiation shell fragment, described heat radiation shell fragment is the cantilever design that is fixed on the heat-radiating substrate, has a jut on the described heat radiation shell fragment.
2. radiating module as claimed in claim 1 is characterized in that: the height of described jut is less than the twice of this heat radiation shell fragment thickness.
3. radiating module as claimed in claim 1 is characterized in that: the part that the root of described heat radiation shell fragment connects heat-radiating substrate has an elastic construction.
4. radiating module as claimed in claim 3 is characterized in that: described elastic construction is an arc groove, and the degree of depth of described arc groove is less than half of this heat radiation shell fragment thickness.
5. radiating module as claimed in claim 1 is characterized in that: described heat-radiating substrate and described heat radiation shell fragment are metal.
6. radiating module as claimed in claim 1 is characterized in that: described heat-radiating substrate and described heat radiation shell fragment are one of the forming.
7. radiating module as claimed in claim 6 is characterized in that: described heat-radiating substrate has the holes of a mechanical stamping partly around around the described heat radiation shell fragment.
8. module backlight, described module backlight comprises:
One circuit board has at least one through hole; At least one heat production device is to should through hole and be arranged at this circuit board top; An and radiating module, described radiating module comprises a heat-radiating substrate, it is characterized in that: described radiating module also comprises at least one heat radiation shell fragment, described heat radiation shell fragment is the cantilever design that is fixed on the heat-radiating substrate, has a jut on the described heat radiation shell fragment, the height of jut is greater than the thickness of this circuit board, and this jut is contacted with the bottom of this heat production device in fact via this through hole, makes this heat radiation shell fragment elasticity be connected to the bottom of this heat production device.
9. module backlight as claimed in claim 8 is characterized in that: described heat production device is a light emitting diode.
10. module backlight as claimed in claim 8 is characterized in that: the height of described jut is less than the twice of this heat radiation shell fragment thickness.
11. module backlight as claimed in claim 8 is characterized in that: the part that the root of described heat radiation shell fragment connects heat-radiating substrate has an elastic construction.
12. module backlight as claimed in claim 11 is characterized in that: described elastic construction is an arc groove, and the degree of depth of described arc groove is less than half of this heat radiation shell fragment thickness.
13. module backlight as claimed in claim 8 is characterized in that: described heat-radiating substrate and described heat radiation shell fragment are metal.
14. module backlight as claimed in claim 8 is characterized in that: described heat-radiating substrate and described heat radiation shell fragment are metal.
15. module backlight as claimed in claim 8 is characterized in that: described heat-radiating substrate and described heat radiation shell fragment are one of the forming.
16. module backlight as claimed in claim 15 is characterized in that: described heat-radiating substrate has the holes of a mechanical stamping partly around around the described heat radiation shell fragment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920137281XU CN201539840U (en) | 2009-03-27 | 2009-03-27 | Radiating module and backlight module by adopting radiating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920137281XU CN201539840U (en) | 2009-03-27 | 2009-03-27 | Radiating module and backlight module by adopting radiating module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201539840U true CN201539840U (en) | 2010-08-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920137281XU Expired - Fee Related CN201539840U (en) | 2009-03-27 | 2009-03-27 | Radiating module and backlight module by adopting radiating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201539840U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102889507A (en) * | 2011-07-22 | 2013-01-23 | Lg伊诺特有限公司 | Backlight unit and display apparatus using the same |
| CN107314285A (en) * | 2017-06-30 | 2017-11-03 | 武汉华星光电技术有限公司 | Backlight module and mobile terminal |
-
2009
- 2009-03-27 CN CN200920137281XU patent/CN201539840U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102889507A (en) * | 2011-07-22 | 2013-01-23 | Lg伊诺特有限公司 | Backlight unit and display apparatus using the same |
| CN102889507B (en) * | 2011-07-22 | 2016-05-11 | Lg伊诺特有限公司 | Back light unit and use its display unit |
| CN107314285A (en) * | 2017-06-30 | 2017-11-03 | 武汉华星光电技术有限公司 | Backlight module and mobile terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100804 Termination date: 20170327 |