CN201476441U - Semiconductor cooling refrigerator with embedded-type fan heat dissipation device - Google Patents
Semiconductor cooling refrigerator with embedded-type fan heat dissipation device Download PDFInfo
- Publication number
- CN201476441U CN201476441U CN2009201930290U CN200920193029U CN201476441U CN 201476441 U CN201476441 U CN 201476441U CN 2009201930290 U CN2009201930290 U CN 2009201930290U CN 200920193029 U CN200920193029 U CN 200920193029U CN 201476441 U CN201476441 U CN 201476441U
- Authority
- CN
- China
- Prior art keywords
- fan
- wind guide
- guide cover
- heat sink
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a semiconductor cooling refrigerator with an embedded-type fan heat dissipation device, which includes a refrigerator body, a refrigerator door, a heat pipe radiator and a cold guiding device inside the refrigerator body. The heat pipe radiator is mounted at the back part of the refrigerator body and a fan heat dissipation device is arranged in the middle position of the rear part of the box body and right faces to the heat pipe radiator; and the fan heat dissipation device includes an axial flow fan, a fan box and an air guide box, the axial flow fan is mounted inside the fan box, an air guide shield covers the fan box, the fan box is mounted at the tail part of the fan box, an air inlet is formed on a side of the air guide, an air outlet is formed at the middle part of the air guide cover, and the axial flow fan faces to the air outlet of the air guide fan.
Description
Technical field
The utility model relates to a kind of semiconductor freezer, particularly a kind of semiconductor freezer with embedded fan heat sink.
Background technology
The semiconductor freezer of existing heat pipe heat radiation can only pass through heat pipe heat radiation usually, because the heat-pipe radiator heat can only be a natural heat dissipation, and can't discharge by wind-force, so its radiating efficiency is lower, cause refrigerating chip to damage.
Summary of the invention
The purpose of this utility model is to design a kind of semiconductor freezer with embedded fan heat sink.
To be solved in the utility model is the lower problem of semiconductor freezer radiating efficiency of existing heat pipe heat radiation.
For achieving the above object, the technical solution of the utility model is:
The utility model comprises casing, chamber door, heat-pipe radiator and is located at cold guide apparatus in the casing, and heat-pipe radiator is loaded on the rear portion of casing, is provided with fan heat sink in centre position, casing rear portion, and fan heat sink faces heat-pipe radiator; Described fan heat sink comprises aerofoil fan, fan box, wind guide cover, described aerofoil fan is loaded in the fan box, the wind guide cover cover cap is on fan box, fan box is loaded on the casing rear portion, the avris of wind guide cover is provided with air inlet, the wind guide cover middle part is provided with air outlet, and aerofoil fan is facing to the air outlet of wind guide cover.
Another feature of the present utility model is that the wind guide cover air inlet is at least two, at least three of wind guide cover air outlets.
Advantage of the present utility model:
1, radiating efficiency height.The utility model is except heat pipe heat radiation, and also the circulated air that blows out by aerofoil fan speeds up heat pipe heat radiation.The principle of its heat radiation is: because this fan heat sink is an embeddeding refrigerator post-foaming layer, and be provided with the air inlet groove in wind guide cover four sides, so can realize four side air intakes, guarantee that fan has the circulation that into has to change the wind condition, reach fan and directly the waste heat that stops on the heat pipe, surplus heat are distributed fast.
2, embedded fan heat sink has not only solved the installation site of fan, and has reduced fan noise.
3, the utility model ejects the temperature that reduces on the heat pipe by the heat on the rapid opposite heat tube, has improved the life-span and the refrigerating efficiency of refrigerating chip.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is the structural representation of heat abstractor.
Fig. 3 is the structural representation of wind guide cover.
The specific embodiment
Below in conjunction with drawings and Examples, the utility model is further described.
As shown in the figure, the utility model comprises casing 2, chamber door 3, heat-pipe radiator 5 and is located at cold guide apparatus 4 in the casing 2.Heat-pipe radiator 5 is loaded on the rear portion of casing 2.Be provided with fan heat sink in centre position, casing 2 rear portion, fan heat sink faces heat-pipe radiator 5.Described fan heat sink comprises aerofoil fan 7, fan box 9, wind guide cover 6, and aerofoil fan 7 is loaded in the fan box 9, and wind guide cover 6 cover caps are on fan box 9, and fan box 9 is loaded on casing 2 rear portions.The avris of described wind guide cover 6 is provided with air inlet 10, and wind guide cover 6 middle parts are provided with air outlet 11, and aerofoil fan 7 is facing to the air outlet 11 of wind guide cover 6.
The utility model result of use:
The utility model and same electronic refrigerator are unkitted the fan heat sink deck watch
One, refrigerator is not placed in the wooden case
| The electronic refrigerator structure | The evaporation jig head temperature | The evaporation jig bottom temp | Environment temperature |
| Do not adorn fan | 43.9℃ | 41.9℃ | 27.0℃ |
| Embed fan is installed | 40.4℃ | 39.3℃ | 27.0℃ |
Two, refrigerator is placed in the wooden cabinet
| The electronic refrigerator structure | The evaporation jig head temperature | The evaporation jig bottom temp | The temperature inside the box |
| Do not adorn fan | 47.2℃ | 44.5℃ | 38.6℃ |
| Embed fan is installed | 42.1℃ | 41℃ | 35.6℃ |
Annotate: (under equal test condition, it is 5 degree that refrigerator temperature is provided with the operating point, 4 hours testing times
Conclusion: after embedding fan heat sink, refrigerator temperature in wooden cabinet environment average 3.9 degree that descended, and environment temperature is in stable dress attitude, discharging for semi-conductive heat radiation and hot blast provides power, thereby has improved the reliability of semiconductor refrigeration chip.
Claims (5)
1. semiconductor freezer with embedded fan heat sink, comprise casing, chamber door, heat-pipe radiator and be located at the interior cold guide apparatus of casing, heat-pipe radiator is loaded on the rear portion of casing, it is characterized in that being provided with fan heat sink in centre position, casing rear portion, fan heat sink faces heat-pipe radiator; Described fan heat sink comprises aerofoil fan, fan box, wind guide cover, described aerofoil fan is loaded in the fan box, the wind guide cover cover cap is on fan box, fan box is loaded on the casing rear portion, the avris of wind guide cover is provided with air inlet, the wind guide cover middle part is provided with air outlet, and aerofoil fan is facing to the air outlet of wind guide cover.
2. the semiconductor freezer with embedded fan heat sink according to claim 1 is characterized in that the wind guide cover air inlet is at least two, at least three of wind guide cover air outlets.
3. the semiconductor freezer with embedded fan heat sink according to claim 1 is characterized in that the wind guide cover air outlet distributes radially.
4. the semiconductor freezer with embedded fan heat sink according to claim 1 is characterized in that curved shape of wind guide cover air inlet or oblong-shaped.
5. the semiconductor freezer with embedded fan heat sink according to claim 1 is characterized in that being provided with in the casing insulating foam layer and inner bag.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201930290U CN201476441U (en) | 2009-08-25 | 2009-08-25 | Semiconductor cooling refrigerator with embedded-type fan heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201930290U CN201476441U (en) | 2009-08-25 | 2009-08-25 | Semiconductor cooling refrigerator with embedded-type fan heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201476441U true CN201476441U (en) | 2010-05-19 |
Family
ID=42412690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201930290U Expired - Fee Related CN201476441U (en) | 2009-08-25 | 2009-08-25 | Semiconductor cooling refrigerator with embedded-type fan heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201476441U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105444462A (en) * | 2015-12-24 | 2016-03-30 | 广东富信科技股份有限公司 | Semiconductor refrigerating system |
| CN110836566A (en) * | 2018-08-16 | 2020-02-25 | Lg电子株式会社 | Refrigerator with a door |
-
2009
- 2009-08-25 CN CN2009201930290U patent/CN201476441U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105444462A (en) * | 2015-12-24 | 2016-03-30 | 广东富信科技股份有限公司 | Semiconductor refrigerating system |
| CN105444462B (en) * | 2015-12-24 | 2018-01-26 | 广东富信科技股份有限公司 | Semiconductor refrigeration system |
| CN110836566A (en) * | 2018-08-16 | 2020-02-25 | Lg电子株式会社 | Refrigerator with a door |
| CN110836566B (en) * | 2018-08-16 | 2021-10-15 | Lg电子株式会社 | Refrigerator with a door |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20140825 |
|
| EXPY | Termination of patent right or utility model |