CN201438459U - Heat dissipating device assembly - Google Patents

Heat dissipating device assembly Download PDF

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Publication number
CN201438459U
CN201438459U CN200920301295.0U CN200920301295U CN201438459U CN 201438459 U CN201438459 U CN 201438459U CN 200920301295 U CN200920301295 U CN 200920301295U CN 201438459 U CN201438459 U CN 201438459U
Authority
CN
China
Prior art keywords
heat
radiator
radiating subassembly
heat abstractor
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200920301295.0U
Other languages
Chinese (zh)
Inventor
李阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200920301295.0U priority Critical patent/CN201438459U/en
Priority to US12/484,531 priority patent/US20100230074A1/en
Application granted granted Critical
Publication of CN201438459U publication Critical patent/CN201438459U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The utility model discloses a heat dissipating device, which comprises a base in thermocontact with a to-be-radiated element and a radiator arranged in the base, wherein, the radiator comprises a first radiating component and a second radiating component symmetrical with respect to the center spot of the heat dissipating device, and each radiating component comprises a plurality of radiating fins stretching outward from the center spot of the heat dissipating device and heat pipes penetrated in the corresponding radiating fins. The utility model also discloses a heat dissipating device assembly, the heat dissipating device assembly comprises the heat dissipating device and a radiator fan supplying air for the heat dissipating device, the first radiating component and the second radiating component are centrosymmetric with respect to the heat dissipating device, a column-shaped space is formed between the first radiating component and the second radiating component, an air inlet of the heat dissipating device is arranged at the top part of the column-shaped space, and the air inlet is an arc-shaped surface which is convenient for aircurrent leading-in.

Description

The heat abstractor combination
Technical field
The utility model is about the combination of a kind of heat abstractor, refers to a kind of in light weight and heat abstractor combination that radiating efficiency is high especially.
Background technology
Along with the power output of electronic components such as central processing unit and improving constantly of operating frequency, the heat of its corresponding generation is showed increased also, if the heat of untimely its generation of eliminating will cause accumulation of heat to cause that temperature raises, and have a strong impact on the normal operation of electronic component.For this reason, industry is carried out auxiliary heat dissipation at these heat-generating electronic elements mounted on surface one radiators usually, installs a fan simultaneously on radiator additional, to strengthen radiating effect.Traditional straight blow type radiating device comprises some radiating fins that are parallel to each other and weld together, and is positioned at the heat conduction copper core in the middle of the radiator, and it is not high to have bigger weight and a radiating efficiency.
Summary of the invention
In view of above content, be necessary to provide a kind of in light weight and heat abstractor combination that radiating efficiency is high.
A kind of heat abstractor, comprise one with treat the base of heat dissipation element thermo-contact, and be positioned at radiator on the described base, described radiator comprises that about one first radiating subassembly of the central point of described heat abstractor and one second radiating subassembly each radiating subassembly comprises from the central point of described heat abstractor some fin that extend outward and the heat pipe that is arranged on the corresponding fin.
A kind of heat abstractor combination, comprise radiator and give the radiator fan of described radiator air-supply, described radiator comprise one with treat the base of heat dissipation element thermo-contact, and be positioned at heat abstractor on the described base, described heat abstractor comprises central point one first radiating subassembly and one second radiating subassembly about described radiator, form a cylindrical space between described first radiating subassembly and second radiating subassembly, its top is the air inlet of radiator, and described air inlet is is convenient to import distinguished and admirable arcwall face.
Relative prior art, symmetrically arranged first radiating subassembly and second radiating subassembly are adopted in the combination of the utility model heat abstractor, have replaced traditional copper core with heat pipe simultaneously and have conducted heat, and have improved radiating efficiency and have alleviated the weight of radiator.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the utility model heat abstractor combination preferred embodiment.
Fig. 2 is the three-dimensional assembly diagram of Fig. 1.
Embodiment
See also Fig. 1, the combination of the utility model heat abstractor comprises a radiator 10, reaches a fan 20 that is fixed on the described radiator 10.
Described radiator 10 comprises a base 11 and is positioned at heat abstractor 12 on the described base 11.Described heat abstractor 12 comprises one first radiating subassembly 121 and one second radiating subassembly 122.Each radiating subassembly comprises along the central point of described radiator 10 some fin 13 that extend outward and the heat pipe 14 that is arranged on the corresponding fin 13.The lower end of each heat pipe 14 is installed on the described base 11, and upwards bends the fin 13 that extends through on the corresponding radiating subassembly.Described base 11 comprises two fixed heads 112 of a heat-conducting plate 111 and the corresponding described heat pipe 14 of difference.Corresponding described heat pipe 14 is provided with two arc grooves 15 on the described heat-conducting plate 111, and each groove 15 1 side is provided with a columnar projections 16.Corresponding described heat pipe 14 also is respectively equipped with an arc groove 17 on each fixed head 112, and the corresponding described columnar projections 16 of groove 17 1 sides on each fixed head 112 is provided with cylindricality perforation 18.In the groove that is installed on described heat-conducting plate 111 15 of the lower end level of each heat pipe 14 and the groove 17 of respective fixation plate 112, thereby described columnar projections 16 snaps in the corresponding cylindricality perforation 18 corresponding heat pipe 14 is fixed on the described base 11.Also be provided with two stators 19 on the described base 11, the middle part of each stator 19 is welded on described conducting strip 111 1 sides and corresponding fixed head 112 bottoms, two lateral bucklings of each stator 19 extend two legs 191, each leg 191 is provided with an installing hole 192.
See also Fig. 2, described fan 20 is rounded, is positioned at the air inlet place of described radiator 10.Form a cylindrical space between described first radiating subassembly 121 and second radiating subassembly 122, the air inlet of described radiator 10 is is convenient to import distinguished and admirable arcwall face.In the utility model better embodiment, fan 20 is fixed on the radiator 10 in mode bonding or that screw fixes.
Heat pipe 14 in described first radiating subassembly 121 and second radiating subassembly 122 passes whole fin 13 of its correspondence respectively, can be delivered to described first radiating subassembly 121 and second radiating subassembly 122 rapidly from the heat of described heat-conducting plate 111.When fan 20 high speed rotating at the air inlet place that is positioned at radiator 10, the guide effect of the described arc air inlet of distinguished and admirable process, distinguished and admirablely in the process of radiator 10 of flowing through, can keep higher speed and arrive the upper surface of base 11 rapidly and make, and flow out via the gap of 13 of adjacent fin on described first radiating subassembly 121 and second radiating subassembly 122, dispel the heat thereby can rapidly and efficiently treat heat dissipation element, improved radiating efficiency greatly.Be respectively equipped with simultaneously the copper core that heat pipe 14 replaced in the traditional heat-dissipating device in described first radiating subassembly 121 and second radiating subassembly 122 and conduct heat, can alleviate the weight of radiator 10 greatly.
Symmetrically arranged first radiating subassembly 121 and second radiating subassembly 122 are adopted in the utility model heat abstractor combination, have replaced traditional copper core with heat pipe 14 simultaneously and have conducted heat, and have improved radiating efficiency and have alleviated the weight of radiator.

Claims (8)

1. heat abstractor, comprise one with treat the base of heat dissipation element thermo-contact, and be positioned at radiator on the described base, it is characterized in that: described radiator comprises that about one first radiating subassembly of the central point of described heat abstractor and one second radiating subassembly each radiating subassembly comprises from the central point of described heat abstractor some fin that extend outward and the heat pipe that is arranged on the corresponding fin.
2. heat abstractor as claimed in claim 1 is characterized in that: the lower end of each heat pipe is installed on the described base, and upwards bends the fin that extends through on the corresponding radiating subassembly.
3. heat abstractor as claimed in claim 2, it is characterized in that: described base comprises two fixed heads of a heat-conducting plate and the corresponding described heat pipe of difference, corresponding described heat pipe is provided with two arc grooves on the described heat-conducting plate, each groove one side is provided with a columnar projections, corresponding described heat pipe also is respectively equipped with an arc groove on each fixed head, the corresponding described columnar projections of groove one side on each fixed head is provided with cylindricality perforation, in the groove that is installed on described heat-conducting plate and respective fixation plate of the lower end level of each heat pipe, thereby described columnar projections snaps in the perforation of corresponding cylindricality corresponding heat pipe is fixed on the described base.
4. heat abstractor as claimed in claim 3, it is characterized in that: described heat abstractor also comprises two stators that lay respectively at described base both sides, the middle part of each stator is welded on described conducting strip one side and corresponding fixed head bottom, two lateral bucklings of each stator extend two legs, each leg is provided with an installing hole.
5. heat abstractor combination, comprise radiator and give the radiator fan of described radiator air-supply, described radiator comprise one with treat the base of heat dissipation element thermo-contact, and be positioned at heat abstractor on the described base, it is characterized in that: described heat abstractor comprises about one first radiating subassembly of the central point of described radiator and one second radiating subassembly, form a cylindrical space between described first radiating subassembly and second radiating subassembly, its top is the air inlet of radiator, and described air inlet is is convenient to import distinguished and admirable arcwall face.
6. heat abstractor combination as claimed in claim 5 is characterized in that: each radiating subassembly comprises from the central point of described radiator some fin that extend outward and the heat pipe that is arranged on the corresponding fin.
7. heat abstractor as claimed in claim 6 combination is characterized in that: described radiator fan is rounded and be positioned at the air inlet position.
8. heat abstractor combination as claimed in claim 6 is characterized in that: described fan is fixed on the described radiator in mode bonding or that screw fixes.
CN200920301295.0U 2009-03-13 2009-03-13 Heat dissipating device assembly Expired - Fee Related CN201438459U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200920301295.0U CN201438459U (en) 2009-03-13 2009-03-13 Heat dissipating device assembly
US12/484,531 US20100230074A1 (en) 2009-03-13 2009-06-15 Heat dissipation apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200920301295.0U CN201438459U (en) 2009-03-13 2009-03-13 Heat dissipating device assembly

Publications (1)

Publication Number Publication Date
CN201438459U true CN201438459U (en) 2010-04-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200920301295.0U Expired - Fee Related CN201438459U (en) 2009-03-13 2009-03-13 Heat dissipating device assembly

Country Status (2)

Country Link
US (1) US20100230074A1 (en)
CN (1) CN201438459U (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103256751A (en) * 2013-05-10 2013-08-21 广东工业大学 Energy-saving semiconductor cold-hot switching device and controlling method thereof
WO2015027511A1 (en) * 2013-09-02 2015-03-05 Chen Hui Chiang Lamp base with heat dissipation structure and lamp thereof, and illumination device

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TW201405291A (en) * 2012-07-20 2014-02-01 Hon Hai Prec Ind Co Ltd Heat dissipation module

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CN103256751A (en) * 2013-05-10 2013-08-21 广东工业大学 Energy-saving semiconductor cold-hot switching device and controlling method thereof
CN103256751B (en) * 2013-05-10 2016-01-27 广东工业大学 A kind of energy-saving semiconductor cold-hot conversion equipment and control method thereof
WO2015027511A1 (en) * 2013-09-02 2015-03-05 Chen Hui Chiang Lamp base with heat dissipation structure and lamp thereof, and illumination device

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100414

Termination date: 20130313